Patents Examined by Tremesha W Burns
  • Patent number: 12389527
    Abstract: A circuit assembly includes a printed circuit board, an integrated circuit chip coupled to the printed circuit board, and a plurality of power phases associated with the integrated circuit chip arranged as grouped power phases. One or more power phases of the grouped power phases is physically distanced from a side of the integrated circuit chip associated with physically distanced power phase(s) of the grouped power phases.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: August 12, 2025
    Assignee: Ciena Corporation
    Inventors: Daniel Rivaud, Fabien Colton, Luc Lacourciere, Lloyd Cosman
  • Patent number: 12379812
    Abstract: A conductive component includes a first electrode pattern made of metal thin wires, and includes a plurality of first conductive patterns that extend in a first direction alternating with first non-conductive patterns. Each first conductive pattern includes break parts in portions other than intersection parts of the thin metal wires. The conductive component further includes a second electrode pattern made of thin metal wires, and includes a plurality of second conductive patterns that extend in a second direction orthogonal to the first direction and alternating with second non-conductive patterns. Each second conductive pattern includes break parts in portions other than intersection parts of thin metal wires.
    Type: Grant
    Filed: August 29, 2023
    Date of Patent: August 5, 2025
    Assignee: FUJIFILM Corporation
    Inventors: Hiroshige Nakamura, Tadashi Kuriki
  • Patent number: 12375599
    Abstract: An electronic device may include a body having a cylindrical shape as a cylindrical housing. The body may include: a first side surface portion extending from one end; and a second side surface portion extending from the other end of the body and disposed in parallel with the first side surface portion. The body may include a rollable display disposed to be rolled in an inner space of the cylindrical housing, and pulled from the inside of the housing to the outside and pushed into the inside of the housing. The electronic device may include radio frequency (RF) transmission lines disposed to traverse an active area of the rollable display on the rear surface of the rollable display. The electronic device may include a plurality of antennas disposed on one side of the rollable display and electrically connected to a first side of the plurality of RF transmission lines. The electronic device may include a flexible circuit board electrically connected to a second side of the RF transmission lines.
    Type: Grant
    Filed: June 2, 2023
    Date of Patent: July 29, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Minuk Kim, Kyunggu Kim, Jihwan Kim, Kyungmoon Seol, Yongjae Song, Byungduk Yang, Kyungtae Kim, Kwangtai Kim, Donghyun Yeom, Jaebong Chun
  • Patent number: 12369247
    Abstract: Provided is a wiring circuit board capable of suppressing peeling of a terminal from an insulating layer. The wiring circuit board includes a base insulating layer, and a conductive pattern disposed on one surface of the base insulating layer in a thickness direction. The conductive pattern includes a wiring and a terminal. The terminal protrudes from one end edge of the wiring. The terminal includes a first terminal layer and a second terminal layer. A ratio (Y/X) of the volume Y of the wiring in a folded region with respect to the volume X of the terminal is 0.1 or more. The folded region is a region when a region of the terminal when viewed in the thickness direction is folded back toward the opposite side in a protruding direction of the terminal with the one end edge of the wiring as a starting point.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: July 22, 2025
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hideki Matsui, Naoki Shibata, Ryosuke Sasaoka
  • Patent number: 12355157
    Abstract: Example embodiments relate to a substrate integrated waveguide (SIW) with dual circular polarizations. An example SIW may include a dielectric substrate and a first metallic layer coupled to a top surface of the dielectric substrate with a through-hole extending through the dielectric substrate and the first metallic layer. The SIW also includes a dielectric layer coupled to a top surface of the first metallic layer. A second metallic layer is coupled to a top surface of the dielectric layer. The second metallic layer includes a non-conductive opening, a plurality of feeds with a first end in the non-conductive opening and a second end including a single-ended termination, and an impedance transformer. The SIW also includes a third metallic layer coupled to a bottom of the dielectric substrate, and a set of metallic via-holes proximate the non-conductive opening and coupling the second metallic layer to the third metallic layer.
    Type: Grant
    Filed: March 6, 2024
    Date of Patent: July 8, 2025
    Assignee: Waymo LLC
    Inventors: Edwin Lim, Marvin Weinstein
  • Patent number: 12356598
    Abstract: A noise suppression tape is provided with a tape-shaped insulator, a sticky layer, and a conductive layer. In the sticky layer, one surface is exposed and the other surface is joined to be fixed to one surface of the insulator. A width of the sticky layer is the same as a width of the insulator. The conductive layer, one surface of which is exposed and flush with the one surface of the sticky layer, is embedded in the sticky layer to be fixed to the sticky layer. A width of the conductive layer is smaller than the width of the sticky layer.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: July 8, 2025
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Ayumi Sakai, Yosuke Watanabe
  • Patent number: 12349278
    Abstract: A data storage device includes a substrate and one or more grid array integrated circuit packages. The grid array integrated circuit package includes at least one self-alignment pin having a tapered shape. The substrate includes one or more connection pads to receive the grid array integrated circuit packages. The connection pads include at least one self-alignment receptacle that receives the self-alignment pins such that the grid array integrated circuit packages maintain an alignment with an associated connection pad of the substrate.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: July 1, 2025
    Assignee: Sandisk Technologies, Inc.
    Inventors: Uthayarajan A/L Rasalingam, Alexander Beh
  • Patent number: 12347788
    Abstract: Glass substrates having signal shielding for use with semiconductor packages and related methods are disclosed. An example semiconductor package includes a core layer defining a channel and a through glass via (TGV). The channel at least partially surrounding the TGV. A signal transmission line is provided in the opening and extending through the core layer. An electrically conductive material positioned in the channel. The conductive material to provide electromagnetic shielding to the transmission line.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: July 1, 2025
    Assignee: Intel Corporation
    Inventors: Kristof Darmawikarta, Srinivas V. Pietambaram, Kemal Aygun, Telesphor Kamgaing, Zhiguo Qian, Jiwei Sun
  • Patent number: 12348016
    Abstract: A reconfigurable electrical box includes an enclosure, and an electrical component arranged within the enclosure. A plurality of base contacts are arranged within the enclosure and are electrically connected to the electrical component, and a plurality of external contacts are arranged over and selectively conductively connected to a portion of the plurality of base contacts. A frame is fitted over the plurality of external contacts and is attached to the enclosure. The frame fixes the position of the external contacts relative to the plurality of base contacts.
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: July 1, 2025
    Assignee: TE Connectivity Solutions GmbH
    Inventor: Michael Dale Brown
  • Patent number: 12342466
    Abstract: A method for producing a printed circuit board having at least one embedded electronic component, in which a support layer and a positioning layer having a recess somewhat larger than the corresponding base area of the printed circuit board module are provide, the positioning layer is placed on the support layer and the printed circuit board module inserted into the recess in the positioning layer. The printed circuit board module is positioned without soldering or gluing, and at least one electrically insulating layer placed on the printed circuit board module and the positioning layer surrounding the printed circuit board module. An electrically conductive layer is placed on the at least one electrically insulating layer covering the printed circuit board module, and the layer sequence is pressed. The bores in the pressed layer sequence are metallized.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: June 24, 2025
    Assignee: UNIMICRON GERMANY GMBH
    Inventors: Oliver Holz, Manuel Schumann, Dieter Köhler
  • Patent number: 12334248
    Abstract: Disclosed is a magnetic component. The magnetic component of the disclosure includes a core unit including an upper core and a lower core, a bobbin unit having at least a portion disposed inside the core unit, and a coil unit including primary coils and secondary coils wound around the bobbin unit in a second direction, which is perpendicular to a first direction oriented from the upper core toward the lower core. The bobbin unit includes a first terminal accommodation portion and a second terminal accommodation portion. The first terminal accommodation portion accommodates first terminal pins, connected to at least some of the secondary coils in the second direction and having end portions bent in the first direction. The second terminal accommodation portion accommodates second terminal pins, connected to the remaining ones of the secondary coils in the second direction and having end portions bent in the first direction.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: June 17, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Bi Yi Kim, Yong Hwan Kim, Sue Kyung Oh
  • Patent number: 12322947
    Abstract: The invention relates to a modular and compact arrangement (200) of three phases (A, B, C) of a gas-insulated apparatus (100), that is suitable for placement inside a tunnel or a pipe (106) or another confined space. According to the invention, the three phases (A, B, C) are arranged in a triangle or side-by-side on a fixation part (103, 104) which includes a roller system (105; 105a, 105b, 105c, 105d). This allows the insertion of such a three-phase assembly (100) into confined spaces such as pipes or tunnels (106), without the need for access by workers or machinery. Furthermore, the present disclosure relates to a method for assembling and installing such a three-phase arrangement (100) into the confined space (106).
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: June 3, 2025
    Assignee: Hivoduct AG
    Inventor: Walter Holaus
  • Patent number: 12322622
    Abstract: A component carrier includes a core with a dielectric body, a component embedded at least partially in the core, a first dielectric layer being arranged at a bottom side of the core and of the component, and a second dielectric layer being arranged at a top side of the core and of the component. A gap around the component in the core is filled adjacent to the bottom side with material of the first dielectric layer and is filled adjacent to the top side with material of the second dielectric layer.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: June 3, 2025
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Artan Baftiri
  • Patent number: 12317424
    Abstract: A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: May 27, 2025
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kenya Takimoto, Naoki Shibata, Hayato Takakura
  • Patent number: 12295785
    Abstract: Systems and methods are provided for cleanable and sterilizable electrical connector for medical devices. A sterilizable connector may include a first shell and a second shell configured to engage one another, a nose housing that includes a mating area of the connector for engaging a corresponding mating area in a component of a medical device, and an overmolding that overmolds a combination of the first shell, the second shell, and the nose housing. Each of the first shell, the second shell, and the nose housing includes a first material that is compatible with cleaning and sterilization (C&S) treatment. The overmolding includes a second material that provides sealing of the combination of the first shell, the second shell, and the nose housing during the cleaning and sterilization (C&S) treatment. The connector is configured to enable applying at least sterilization without requiring closing or covering of the mating area of the connector.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: May 13, 2025
    Assignee: GE Precision Healthcare LLC
    Inventors: Matthieu Petitprez, Edouard Dacruz, Jean-Marc Baraban, Giandonato Stallone
  • Patent number: 12288973
    Abstract: A bus bar cooling structure includes: a plurality of bus bars; and an insulating cooling portion provided so as to be in contact with a part of each of the plurality of bus bars, current paths of the plurality of bus bars having different length from start points to end points of the current paths, a contact area between each bus bar and the cooling portion being set to an area proportional to a length of the bus bar.
    Type: Grant
    Filed: December 16, 2022
    Date of Patent: April 29, 2025
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masaaki Katayama, Atsushi Hayashi
  • Patent number: 12284754
    Abstract: According to one embodiment, a flexible substrate includes an insulating basement, a plurality of wiring lines, a plurality of electrical elements connected to the plurality of wiring lines, and a metal layer. The insulating basement includes a plurality of line portions supporting the plurality of wiring lines, and a plurality of island-shaped portions supporting the plurality of electrical elements. The plurality of line portions connect the plurality of island-shaped portions. The plurality of wiring lines and the electrical elements are located between the insulating basement and the metal layer.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: April 22, 2025
    Assignee: Japan Display Inc.
    Inventor: Yasushi Kawata
  • Patent number: 12274257
    Abstract: A wildlife guard assembly is provided that includes two cover sections, a biasing member, and a toggle action lever mechanism. The cover sections are hinged so that the cover sections, when in a closed position, a cavity to capture a line post insulator is defined. The biasing member normally biases the cover sections to the closed position. The lever mechanism is connected to the cover sections and has an over-center position that releasably holds the two cover sections in an open position. The lever mechanism is positioned in the cavity such that, during installation on the line post insulator, the line post insulator interacts with the lever mechanism to move the lever mechanism from the over-center position to allow the biasing member and the lever mechanism to move the cover sections to the closed position.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 15, 2025
    Assignee: Hubbell Incorporated
    Inventors: Paul Alfaro, Jr., Kyle Randy Herman
  • Patent number: 12267952
    Abstract: A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 ?m to 2.0 ?m. The wiring lines have an average height of 40 ?m to 120 ?m. The wiring lines have an average spacing of 1 ?m to 30 ?m.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: April 1, 2025
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Maki Ikebe, Koji Nitta, Shoichiro Sakai, Shingo Nagata, Junichi Motomura, Masahiro Itoh
  • Patent number: 12261402
    Abstract: A spring connector includes: a tube; a movable pin having a distal end portion that protrudes from an opening of the tube, and having a hole portion that opens on a side opposite to a protruding direction; and a coil spring configured to bias the movable pin in the protruding direction. The coil spring includes an eccentric winding portion whose winding center is eccentric relative to an axial straight line connecting a winding center of a winding portion at one end portion and a winding center of a winding portion at the other end portion.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: March 25, 2025
    Assignee: YOKOWO CO., LTD.
    Inventors: Kenta Takahashi, Yasushi Watanabe, Kenji Endo