Abstract: A power plant controller (36) is described. The power plant controller (36) controls a power generation system (10) having one or more power generators (12) and an energy storage system (22), and provides a utility grid or transmission system operator with the capability to select the droop response provided by the power generation system. Accordingly, an operator can request a specific generator droop response in order to provide appropriate frequency and grid control services. The power plant controller (36) operates in real time determining one or more power characteristics of the power generation system (10). Based on these characteristics and an indication of a future predicted power output for the power generation system, the power plant controller can take the necessary steps to ensure that the power generation system is capable of responding with the selected droop response, or can advise the operator that a different droop is preferred.
Abstract: The invention relates to a control unit for an electrical generation/consumption system including generation sources (200) and consumption units (300) connected by a distribution network (100), including a control center (400) which transmits, to controllable consumption units (310) and to controllable generation sources (210), modulation orders based on warning information received from an external operator (500), on information relating to the potential of the respective suppression of units (310), and on information relating to the respective potential of generation or of a decrease in generation of sources (210), or of the suppression of the latter, at each unit (310), a module (312) which transmits, to the center (400), data updated in real time representing the potential modulation suppression of the unit (310), and at the sources (210), a module (212) which transmits, to the control center (400), data which is updated in real time and which is representative of the potential of generation or of the dec
Abstract: Automated fixture layout is approached in two distinct stages. First, the spatial locations of clamping points on the work piece are determined to ensure immobility of the fixtured part under any infinitesimal perturbation. Second, spatial locations are matched against a user-specified library of reconfigurable clamps to synthesize a valid fixture layout or configuration that includes clamps that are accessible and collision free. The spatial locations matching during the second stage can be the same spatial locations chosen in the first stage to ensure immobility, or a different set of spatial locations.
Type:
Grant
Filed:
March 15, 2013
Date of Patent:
February 14, 2017
Assignee:
PALO ALTO RESEARCH CENTER INCORPORATED
Inventors:
Saigopal Nelaturi, Arvind Rangarajan, Tolga Kurtoglu, Christian Fritz
Abstract: A control device that controls a heating device having a plurality of heating zones, has a monitoring unit configured to monitor a temperature of at least a first heating zone in the plurality of heating zones, and a control unit configured to perform heat-up starting control, in which heat-up of at least a second heating zone is started in the plurality of heating zones, based on the temperature of the first heating zone.
Abstract: In a method for setting substrate-treatment time, substrate-treatment time is set by the following method. A predicted supply time of wafers of a following lot to a substrate processing apparatus is calculated based on a predicted plasma-treatment completion time of another substrate processing apparatus. A predicted plasma-treatment completion time of all of wafers of a present lot is calculated. A predicted idle time after the completion of the plasma treatment of all of the wafers of the present lot is calculated based on the predicted supply time of the following lot and the predicted plasma-treatment completion time of the present lot. If the predicted idle time is equal to or longer than the idle time required for dummy treatment, supplementary idle time is added between the plasma treatments of unprocessed wafers of the present lot.