Abstract: A mobile wireless communications device may include a portable housing, a printed circuit board (PCB) carried by the portable housing, and wireless transceiver circuitry carried by the PCB. The mobile wireless communications device also may include an antenna coupled to the wireless transceiver circuitry. The antenna may include a loop conductor, a first conductor body coupled to the loop conductor and extending into the interior thereof to define a first slotted opening with adjacent portions of the loop conductor, and a second conductor body coupled to the loop conductor and extending into the interior thereof to define a second slotted opening with adjacent portions of the loop conductor. The first and second conductor bodies may be spaced apart to define a third slotted opening therebetween. The first slotted opening may have an enlarged width portion adjacent the first conductive body.

Abstract: A method for producing a ceramic substrate material having a first layer and possibly a further layer is specified. The first layer comprises at least one first component made of a crystalline ceramic material and/or a glass material as a matrix and a second component made of a further crystalline ceramic material, which is provided in the matrix. An etching step is performed, mantle areas of the crystals and/or crystal agglomerates of the second component being etched selectively in the first layer to generate a cavity structure in the first layer. The present invention also relates to a corresponding ceramic substrate material, an antenna or an antenna array, and the use of the ceramic substrate material for an antenna or an antenna array.

Abstract: Disclosed herein is an RFID antenna, including, a dipole antenna pattern, and a matching pattern containing a pair of first pattern parts, each part being discretely and protrusively disposed at one side of the dipole antenna pattern and a second pattern part connecting each distal end of the pair of first pattern parts, wherein a ratio of an inner length of the pair of first pattern parts vs an inner length of the second pattern part is substantially larger than 1:8.

Abstract: A THz antenna array has a plurality of THz antennae, a THz antenna having a photoconductive region and a first electrode and a second electrode which are arranged interspaced from each other via a spacer region that extends laterally across at least a part of the photoconductive region. In order to simplify the structure and facilitate its production, a lateral region between adjacent THz antennae of the array is not photoconductive. It is especially free from photoconductive material.

Abstract: In an antenna unit including a dome-shaped top cover, an antenna module disposed in the top cover and adapted to receive radio waves, a bracket covering an under surface of the top cover, and a gasket disposed between the top cover and the bracket to thereby ensure hermeticity in the top cover, the bracket includes a bottom portion pressure welding the gasket between the bottom portion and the top cover to make inside of the top cover an enclosed space, and a mounting portion integrated to the bottom portion to enable the antenna unit to mount in a narrow-mounting-space cabinet.

Abstract: In one embodiment of the present invention, a conductive pattern portion formed in a pattern layer functions as an antenna, and, when electromagnetic waves at a predetermined frequency arrive, resonance occurs, and an electromagnetic wave of a specific frequency is introduced into a sheet member. As to the sheet member having the pattern layer, even in a small and thin sheet member, the phase of reflected waves from the reflection area can be adjusted, and thus an area having high electric field intensity due to interference between reflected waves from the reflection area and arriving electromagnetic waves can be set in the vicinity of the antenna element. When the sheet member is disposed between an antenna element and a communication jamming member, an electromagnetic field is generated around the conductive pattern portion, and an electromagnetic energy is supplied from the conductive pattern portion to the antenna element, and therefore receiving power of the antenna element can be increased.

Abstract: A printed dual-band Yagi-Uda antenna is disclosed, which includes a substrate, a first driver, a first director, a second driver and a reflector. The first driver is formed on the substrate, and is utilized for generating a radiation pattern of a first frequency band. The first director is formed at a side of the first driver on the substrate, and is utilized for directing the radiation pattern of the first frequency band toward a first direction. The second driver is formed between the first driver and the first director on the substrate, and is utilized for generating a radiation pattern of a second frequency band. The reflector is formed at another side of the first driver on the substrate, and is utilized for reflecting both the radiation patterns of the first frequency band and the second frequency band toward the first direction.

Abstract: A method for assembly of a segmented reflector antenna, including coupling a central segment upon an antenna mount. Attaching a peripheral segment to a bottom portion of the central segment. Rotating the central segment to present a bottom portion of the central segment without a peripheral segment, and attaching a peripheral segment to the bottom portion. In additional steps, a secondary ring of peripheral segments may be applied, each connected to an outer edge of a peripheral segment connected to the bottom portion of the central segment.

Abstract: A communication device with an embedded antenna includes a printed circuit board and an embedded antenna including at least one radiating unit, at least one feeding unit, where each feeding unit is coupled to a corresponding one of the at least one radiating unit and the printed circuit board, and a connecting unit coupled to the at least one radiating unit including a first connecting portion and a second connecting portion. The connecting unit and the at least one radiating unit form a loop structure such that the embedded antenna is capable of covering one side of the printed circuit board.

Abstract: A device for conveying signals for a mobile antenna positioner is provided. The device comprises a waveguide with a conductive structure including a first end connected to the antenna, and a second end connected to the mount of the positioner, wherein the waveguide has a continuous structure, each of its ends being attached by means allowing a range of movement of the waveguide in order to limit the bending forces of said guide and to reduce the force applied to the attachment means during the movements of the positioner. The device applies notably to communication systems with mobile antennas, and more particularly to the production of antenna stations comprising antenna positioners with a wide range of movement in relative bearing.

Abstract: Provided is a circuit for an electronic device having a non-planar transparent resonator. The transparent resonator is mounted on said circuit so as to at least partially occupy a footprint of another component of the circuit. The transparent resonator forms part of a light pathway on said circuit for transmitting light to or from said another component. Also provided is a transparent dielectric resonator antenna (DRA) for optical applications. Since the DRA is transparent, it can let light pass through itself and, thus, the light can be utilized by an optical part of a system or device. The transparent DRA can be placed on top of a solar cell. Since the DRA does not block the light, the light can reach the solar cell panel and power can be generated for the system or device. The system or device so obtained is very compact because no extra footprint is needed within the system or device for the DRA. It finds application in compact wireless applications that need a self-sustaining power device.

Abstract: A multi-frequency antenna includes a microwave substrate, a first antenna unit, a second antenna unit, a third antenna unit and a grounding unit. The first antenna unit, the second antenna unit, and the third antenna unit are disposed on the microwave substrate surface. The grounding unit is disposed at an edge on the surface of the microwave substrate. The grounding unit is in connection with the second antenna unit. The second antenna unit and the third antenna unit are bent to form perpendicular structures to the microwave substrate. The compact arrangement reduces the physical footprint of the antenna module to enable fitment in a wide range of products having tight special constraint.

Abstract: A low-profile antenna assembly includes at least two antennas co-located under a cover. At least one of the at least two antennas includes an antenna configured for use with AM/FM radio. And, at least one of the at least two antennas includes an antenna configured for use with at least one or more of SDARS, GPS, cell phones, Wi-Fi, DAB-VHF-III, DAB-L, etc.

Abstract: The antenna assembly includes first and second adjacent antenna elements each having a tapered or conical antenna body with a base and an apex opposite the base. An elongated or cylindrical antenna body extends from the base of the conical antenna body, and includes a plurality of adjacent elongated or cylindrical antenna body portions, and a respective dielectric member separating adjacent cylindrical antenna body portions. Each of the first and second adjacent antenna elements are aligned along a common longitudinal axis with respective apexes in opposing relation to define a dipole antenna. Increased radiation pattern bandwidth and satisfactory pattern on the horizon may be achieved in such a biconical-type antenna.

Abstract: The present invention relates to panel array antennas, and more particularly to a cooling system for an antenna such as a jet stream conformal panel array antenna. In one embodiment, a panel array antenna for an aircraft includes a closed-loop fluid flow path that passes through the panel array assembly and dissipates heat to the jet stream outside the aircraft. A fluid such as pressurized air passes through this closed-loop path, flowing through strategically-placed openings in the layers of the panel array assembly and flowing over and around the hot electrical components in the panel assembly. The air is heated by these electrical components, and the heated air then flows through the flow path under the top sheet, dissipating the heat to the jet stream outside. In one embodiment, a panel array antenna includes a panel assembly having a top layer through which the antenna radiates or receives a signal, and a fluid flow path through the panel assembly.

Abstract: An electronic device with an embedded three-dimensional antenna is disclosed. The electronic device includes a printed circuit board (PCB) and an embedded three-dimensional antenna. The embedded three-dimensional antenna includes a radiation element and a connection element. The connection element includes a first connection part and a second connection part. The first and second connection parts are coupled to the PCB, and utilized for transferring signals of the embedded three-dimensional antenna to the PCB. The first and second connection parts further clamp the PCB to attach the embedded three-dimensional antenna on the PCB.

Abstract: A semiconductor chip integrating a transceiver, an antenna, and a receiver is provided. The transceiver is located on a front side of a semiconductor substrate. A through substrate via provides electrical connection between the transceiver and the receiver located on a backside of the semiconductor substrate. The antenna connected to the transceiver is located in a dielectric layer located on the front side of the substrate. The separation between the reflector plate and the antenna is about the quarter wavelength of millimeter waves, which enhances radiation efficiency of the antenna. An array of through substrate dielectric vias may be employed to reduce the effective dielectric constant of the material between the antenna and the reflector plate, thereby reducing the wavelength of the millimeter wave and enhance the radiation efficiency. A design structure for designing, manufacturing, or testing a design for such a semiconductor chip is also provided.

Abstract: A low-profile antenna assembly includes at least two antennas co-located under a cover. At least one of the at least two antennas includes an antenna configured for use with AM/FM radio. And, at least one of the at least two antennas includes an antenna configured for use with at least one or more of SDARS, GPS, cell phones, Wi-Fi, DAB-VHF-III, DAB-L, etc.

Abstract: A planar bi-directional radiation antenna including a substrate, a first reflecting element, an antenna body, a second reflecting element and a third reflecting element is provided. The first reflecting element is concaved inwards to form a first notch in a first surface. The antenna body is located inside the first notch, and is symmetrical to a predetermined direction with the first reflecting element. The second reflecting element is concaved inwards to form a second notch in a second surface. The configuration of the first notch and the second notch is correspondingly disposed along a vertical projection plane with respect to the substrate. The third reflecting element is opposite to the antenna body along the predetermined direction, and covers an opening of the first notch, so that the antenna generates two beams, wherein the two beams have an angle relative to the substrate, so as to achieve a bi-directional radiation effect.

Abstract: A meander slot antenna structure for transmitting a wireless signal is provided. The meander slot antenna structure includes a substrate, a ground element, a feed conductor and a couple conductor. The substrate includes a first surface and a second surface, wherein the first surface is opposite to the second surface. The ground element is disposed on the second surface, wherein a meander slot is formed in the ground element. The feed conductor is disposed on the first surface, wherein the feed conductor corresponds to the meander slot. The couple conductor is disposed on the first surface and coupled with the feed conductor, wherein a via passes through the substrate and electrically connects the couple conductor to the ground element.