Abstract: The invention relates to an inductor (1) having a coil (2) and a core (3), wherein the core (3) is made of a Soft Magnetic Composite (SMC), the coil (2) is composed of a annularly wound electrical conductor, the coil (2) is substantially integrated into said core (3) so that the core (3) material acts as a thermal conductor having thermal conductivity above 1.5 W/m*K more preferably 2 W/m*K most preferably 3 W/m*K, conducting heat from said coil (2), wherein the inductor (1) is in thermal connection with at least one thermal connecting fixture (10-25), wherein said at least one thermal connecting fixture (10-25) is adapted to be connected to a first external heat receiver (4) so as to conduct heat from the inductor to said first external heat receiver (4).

Abstract: The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.

Abstract: A vehicle is provided with a transmission and an inductor assembly that is mounted within a chamber of the transmission. The inductor assembly includes a coil, a core and an insulator having first and second portions that are oriented toward each other. Each portion includes a base, a support extending from the base, and a spool extending transversely from the support to engage the other portion. Each spool includes an external surface for supporting the coil and a cavity extending therethrough for receiving the core.

Abstract: An electronic device includes a magnetic element, and a first circuit module. The magnetic element includes a magnetic core set and a winding assembled in the magnetic core set. The first circuit module is coupled to the first winding of the magnetic element. A vertical projection area of the first circuit module has an overlap portion with a vertical projection area of the winding of the magnetic core set on a first plane, and the first plane is a horizontal plane at which the winding is located.

Abstract: A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.

Abstract: A reactor 2 disclosed by the present specification is equipped with two coils 3 that are arranged parallel to each other, a resin cover 41 that adheres to the two coils to cover the coils, and a column member 13. The resin cover 41 exposes lateral faces of the coils on such a side as to be in contact with a common tangential plane KL. The column member 13 is arranged parallel to the coils 3 in a space that is surrounded by the common tangential plane KL and the lateral faces of the respective coils 3. The column member 13 is exposed on a side thereof that is opposed to the common tangential plane KL, and is in contact with the respective coils 3 on the other side thereof. Furthermore, the column member 13 has a groove 13a that has an opening on the other side of the common tangential plane KL and extends along coil axes. The groove has a width that is narrow at the opening and widens toward a bottom of the groove. An interior of the groove is filled with resin of the resin cover 41.

Abstract: A high frequency transformer with high conversion efficiency is provided. The high frequency transformer includes a first coil assembly 1 formed from a single flat wire, with first coils 1A that are configured by winding the flat wire edgewise plural times and that are formed at specific intervals, and a second coil assembly 2 formed from a single flat wire, with second coils 2A that are configured by winding the flat wire edgewise plural times and that are formed at specific intervals.

Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.

Abstract: An electronic package that includes a substrate; a first electronic component mounted on one side of the substrate; a second electronic component mounted on an opposing side of the substrate; a core mounted to the substrate, wherein the core extends through the substrate; a first wire electrically attached to at least one of the first electronic component and the substrate, wherein the first wire is wrapped around the core to form a first coil on the one side of the substrate; and a second wire electrically attached to at least one of the second electronic component and the substrate, wherein the second wire is wrapped around the core to form a second coil on the opposing side of the substrate.

Abstract: An electronic component includes a main body formed from an insulative material, coil conductors, outer electrodes provided on a surface of the main body, and outer pads. Each coil conductor is constituted by a spiral-shaped coil portion and a lead portion connected to the coil portion and extending linearly. The outer pads connect the lead portions to the outer electrodes. At a contact point that connects one of the coil portions to their corresponding one of the lead portions, an angle formed by the coil portion and the lead portion is an obtuse angle.

Abstract: A coil structure includes a conductor band and a first insulating plate. The conductor band turns around a coil axis in such a manner that the conductor band folds at a plurality of portions which form a plurality of folded portions. The first insulating plate includes a first edge portion which abuts along at least one of the plurality of folded portions. At least part of the conductor band is wound around the first insulating plate.

Abstract: A surface mount, power inductor component assembly includes only two different shapes of modular core pieces and a set of windings having the same shape that can be assembled and arranged to have any desired number of non-magnetically coupled windings to accommodate electrical power systems having different numbers of phases of electrical power. The core pieces and windings are vertically elongated to reduce the component footprint on a circuit board yet provide higher power, higher current capability.

Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

Abstract: An electronic device includes a magnetic element, a first circuit module and a second circuit module. The magnetic component includes a magnetic core set and a winding, and the winding includes a first winding and a second winding, and the winding is assembled on the magnetic core set. The first circuit module is connected to the first winding of the magnetic element. The second circuit module is connected to the second winding of the magnetic element. The first circuit module or/and the second circuit module has/have an overlap portion with the winding on a vertical projection area of a first plane, and the first plane is the first plane is a horizontal plane at which the winding is located.

Abstract: An inductor apparatus includes: a substrate including an electrical insulation property and a non-magnetic material; and a plurality of inductors disposed in the substrate so as to extend from a first surface of the substrate to a second surface of the substrate, each of the plurality of inductors including: an inductor conductive part that has an electrical conductivity and extends in a thickness direction of the substrate; and a magnetic layer that covers a side of the inductor conductive part and include a relative permeability and a soft magnetic material.

Abstract: Toroidal transformers are currently used only in low-voltage applications. There is no published experience for toroidal transformer design at distribution-level voltages. Toroidal transformers are provided with electrostatic shielding to make possible high voltage applications and withstand the impulse test.

Abstract: An expansion radiator for a hermetically closed electrical transformer or a throttle. A heat exchange fluid is delivered to the radiator via an inflow, passed through an expansion shaft cavity formed by an expansion shaft and an associated cover part, and then drained off via an outflow. A flow guiding part which steers a flow direction of the heat exchange fluid is arranged in a mouth region between the inflow and the expansion shaft cavity.

Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element disposed in the body, wherein at least one portion of a terminal part of the conductive element is exposed outside of the body; a metal foil having an adhesive material on the bottom surface thereof, the metal foil being adhered on the body through the adhesive material and covering a first portion of the terminal part of the conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the metal foil; and a metal layer, overlaying on the metal foil and covering the second portion of the terminal part of the conductive element, wherein the metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.

Abstract: A transformer system includes a transformer module and a base module. One or more transformer modules are detachably coupled to the base module. The transformer module includes a housing, a transformer, primary-side and secondary-side wires electrically connected to primary and secondary terminals of the transformer, a conductive tab electrically connected to a neutral terminal of the transformer, and a first coupling mechanism. The base module includes a base enclosure, a neutral connector electrically connected to a power line neutral connection, and a second coupling mechanism. The second coupling mechanism detachably engages the first coupling mechanism of the transformer module, and the conductive tab of the transformer module is electrically connected to the neutral connector of the base module when the first coupling mechanism is engaged with the second coupling mechanism.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.