Patents Examined by Tszfung J Chan
  • Patent number: 11264156
    Abstract: A magnetic core includes a nanocrystalline alloy ribbon having a composition represented by FeCuxBySizAaXb, where 0.6?x<1.2, 10?y?20, 0?(y+z)?24, and 0?a?10, 0?b?5, all numbers being in atomic percent, with the balance being Fe and incidental impurities, and where A is an optional inclusion of at least one element selected from Ni, Mn, Co, V, Cr, Ti, Zr, Nb, Mo, Hf, Ta and W, and X is an optional inclusion of at least one element selected from Re, Y, Zn, As, In, Sn, and rare earth elements. The nanocrylstalline alloy ribbon has a local structure such that nanocrystals with average particle sizes of less than 40 nm are dispersed in an amorphous matrix and are occupying more than 30 volume percent of the ribbon.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: March 1, 2022
    Assignees: METGLAS, INC., HITACHI METALS, LTD.
    Inventors: Motoki Ohta, Naoki Ito
  • Patent number: 11264159
    Abstract: A common mode choke coil includes a multilayer body obtained by stacking insulating layers, first and second coils inside the multilayer body, and first to fourth outer electrodes on outer surfaces of the multilayer body. The first and second outer electrodes are respectively connected to first and second ends of the first coil. The third and fourth outer electrodes are respectively connected to first and second ends of the second coil. The first coil includes first to third spiral conductors connected to one another through via conductors. The second coil includes fourth to sixth spiral conductors connected to one another through via conductors. The first spiral conductor is adjacent to the second and fourth spiral conductors. The fourth spiral conductor is adjacent to the first and fifth spiral conductors. The distance between the first and fourth spiral conductors is smaller than the distances between other spiral conductors.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: March 1, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Naoyuki Murakami
  • Patent number: 11257618
    Abstract: A transformer includes: an upper E core; a lower E core; a first coil portion disposed so as to cover a magnetic leg of the upper E core and a magnetic leg of the lower E core; and a second coil portion disposed so as to cover the periphery of the first coil portion in a direction perpendicular to the central axis of winding of the first coil portion. The first coil portion includes a bobbin and an edgewise coil wound around the bobbin. The second coil portion includes a bobbin and an edgewise coil wound around the bobbin.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: February 22, 2022
    Inventor: Hiroyuki Miyazaki
  • Patent number: 11250982
    Abstract: A wire-wound magnetic component includes a magnetic core, a coil set, a bobbin, an insulating wrapper, a caulking member and an ingress-protective finishing film. The magnetic core has at least one leg. The coil set is aligned and interacts with the magnetic core for electromagnetic induction, wherein the coil set includes at least one coil. The bobbin includes: a main body having a hollow portion for accommodating the leg of the magnetic core, and winding therearound a conductive wire to form the coil set, wherein the conductive wire has an unwound free end extending from the coil set; a cover plate disposed at an end of the main body and configured as a flange so as to define a winding space for accommodating the coil set; and an ingress-protective structure disposed in the winding space and separating the coil set from the cover plate.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 15, 2022
    Assignee: CYNTEC CO., LTD
    Inventors: Yi-Ting Lai, Chu-Keng Lin, Hsieh-Shen Hsieh
  • Patent number: 11250987
    Abstract: A transformer includes a magnetic core, a first winding and at least one second winding. The magnetic core has a window through which the first winding passes through without contacting the magnetic core. The second winding passes through the window of the magnetic core and is wound on the magnetic core. The second winding has a distance from the first winding, and the second winding has a first insulating part disposed on an outer surface of the second winding facing the first winding.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: February 15, 2022
    Assignee: Delta Electronics, Inc.
    Inventors: Jianxing Dong, Jianping Ying, Teng Liu
  • Patent number: 11244783
    Abstract: A stacking inductor device includes a first inductor unit and a second inductor unit disposed above first inductor unit. First inductor unit includes a first and a second wire. First wire is disposed on a first side of first inductor unit. Second wire is disposed on a second side of first inductor unit. A first opening of second wire is disposed on a first side of stacking inductor device. Second inductor unit includes a third and a fourth wire. Third wire is disposed on a first side of second inductor unit, and first side of second inductor unit corresponds to first side of first inductor unit. A second opening of third wire is disposed on a second side of stacking inductor device. Fourth wire is disposed on a second side of second inductor unit, and second side of second inductor unit corresponds to second side of first inductor unit.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: February 8, 2022
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventor: Hsiao-Tsung Yen
  • Patent number: 11227715
    Abstract: An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: January 18, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Akinori Hamada, Hayami Kudo, Ryo Okura, Shinji Otani
  • Patent number: 11222743
    Abstract: An electronic component includes: a multilayer body; an inductor constituted of a plurality of inductor conductor layers and a via hole conductor, the inductor having a helical shape; a first outer electrode provided on a first end surface formed by contiguous outer edges of the insulation layers; and a second outer electrode provided on a second end surface. The plurality of inductor conductor layers have a first inductor conductor layer connected to the first outer electrode, and a second inductor conductor layer adjacent to the first inductor conductor layer on another side in the lamination direction. The via hole conductor connecting the first inductor conductor layer and the second inductor conductor layer is provided closer to the first outer electrode than the second outer electrode, and when viewed in plan view from a normal direction of the first end surface, does not overlap with the first outer electrode.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: January 11, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masayuki Yoneda
  • Patent number: 11205539
    Abstract: A coil component includes a coil and external electrodes electrically connected to the coil. The coil may include a plurality of coil patterns. A distal end of an outermost coil pattern may include a gap filling portion. A through via directly connected to an innermost coil pattern may also include a gap filling portion.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hyung Jung, Boum Seock Kim, Kang Wook Bong
  • Patent number: 11201007
    Abstract: A modulated inductance module includes an inductor including one or more electrical conductors disposed around a ferromagnetic ceramic element formed on a semiconductor die, wherein the inductor further has two or more metal oxides having fluctuations in metal-oxide compositional uniformity less than or equal to 1.50 mol % throughout said ceramic element, the ceramic element has crystalline grain structure having a diameter that is less than or equal to 1.5× a mean grain diameter, and the semiconductor die contains active semiconductor switches or rectifying components that are in electrical communication with the one or more electrical conductors of the inductor.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: December 14, 2021
    Inventor: L. Pierre de Rochemont
  • Patent number: 11195652
    Abstract: A coil component includes: a body having one surface and the other surface opposing each other in one direction; a coil portion including a coil pattern having at least one turn around the one direction, and embedded in the body; an external electrode disposed on the one surface of the body and connected to the coil portion; a shielding layer disposed on the other surface of the body; and an insulating layer disposed between the body and the shielding layer.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: December 7, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tai Yon Cho, Tae Jun Choi, Jung Young Cho, Chang Hak Choi, Byeong Cheol Moon, Seung Hee Oh
  • Patent number: 11189413
    Abstract: First internal conductors are separated from each other in a first direction. Each of the first internal conductors includes a coil portion and a pad portion having a width larger than a width of the coil portion. The pad portions adjacent to each other in the first direction are connected to each other via a through-hole conductor and overlap each other when viewed from the first direction. When viewed from the first direction, each of the coil portions includes a first portion not overlapping the pad portion adjacent in the first direction and a second portion overlapping a part of the pad portion adjacent in the first direction. A second internal conductor is disposed on the same layer as the second portion and is positioned to overlap a portion of the pad portion adjacent in the first direction not overlapping the second portion when viewed from the first direction.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: November 30, 2021
    Assignee: TDK CORPORATION
    Inventors: Yuya Oshima, Shinichi Kondo, Junichi Otsuka, Yohei Tadaki, Kazuo Iwai, Masayuki Suzuki, Shigeshi Osawa, Kazuhiro Ebina, Makoto Yoshino, Mamoru Kawauchi
  • Patent number: 11189414
    Abstract: A choke comprising a magnetic core having a centre line that forms a closed loop, the choke has a choke axis around which the magnetic core is located, and a coil wound around the magnetic core, the coil has a plurality of turns, each of the turns has a width perpendicular to lengthwise direction of the turn, and a thickness perpendicular to both lengthwise direction of the turn and the width. The coil has a cross-section whose shape varies along lengthwise direction of the coil, such that each turn has an inner portion and an outer portion whose width is substantially greater than width of the inner portion, the outer portion is located further from the choke axis than the inner portion.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: November 30, 2021
    Assignee: ABB Schweiz AG
    Inventors: Jukka-Pekka Kittilä, Vesa Palojoki, Asko Rantanen
  • Patent number: 11183325
    Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kun Hoi Koo, Byung Woo Kang, Ji Hye Han, Bon Seok Koo
  • Patent number: 11170926
    Abstract: An isolation coupling structure for transmitting a feedback signal between a secondary side and a primary side of a voltage conversion device includes a first dielectric layer including a first face and a second face opposite to the first face, a first coupling coil disposed on the first face enclosing to form an inner region; a second coupling coil configured to couple with the first coupling coil. The second coupling coil includes a first coil portion and a second coil portion, where the first coil portion is disposed on the second face, the second coil portion is disposed on the first face and located inside the inner region. The second coil portion is isolated from the first coupling coil, and the first coil portion and the second coil portion are electrically connected. The technical effect is that it can realize the electrical isolation and the coupling with low cost and small package size.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 9, 2021
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Jung-Pei Cheng, Hsiang-Chung Chang, Yu-Ming Chen, Chieh-Wen Cheng, Tsung-Han Ou, Lih-Ming Doong
  • Patent number: 11165290
    Abstract: A stationary induction apparatus includes a plurality of stationary device structures, each including: a stationary induction device including a core that has a plurality of magnetic legs and yokes connecting both ends of the plurality of magnetic legs, and windings that are respectively wound around the plurality of magnetic legs of the core; and a pair of yoke supports that respectively extend along the yokes on both ends of the stationary induction device and individually support the respective yokes; and a pair of connecting support members to which both ends of the pairs of yoke supports are respectively fixed such that the plurality of stationary device structures are arranged parallel to one another to form airflow paths between the respective stationary induction device that are disposed adjacent to each other.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: November 2, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kiyoshi Takahashi
  • Patent number: 11139106
    Abstract: The invention provides a transformer and a transformer bobbin thereof. The transformer bobbin includes a winding part, a first wire outlet part and a second wire outlet part; the second wire outlet part is provided with an inclined guiding surface facing the winding part, a first partition plate arranged on the inclined guiding surface and a wire avoiding groove arranged on one side of the inclined guiding surface; the inclined guiding surface is divided into a first wire outlet area and a second wire outlet area, the wire avoiding groove is only arranged in the first wire outlet area, and the first partition plate is formed with a wire supporting notch. Therefore, it is not necessary to add an insulation sleeve to windings at the same wire outlet part to achieve winding isolation, whereby windings on the transformer is automatically wound by a machine.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: October 5, 2021
    Assignee: INNOTRANS TECHNOLOGY CO., LTD.
    Inventor: Tsung-Han Chou
  • Patent number: 11139100
    Abstract: A coil device with a cooling structure includes: a coil unit that has a core structure having one or more leg parts and one or more coils wound around the one or more leg parts; and a flow-rectifying member having a flat plate portion covering a face of the one or more coils and flow-rectifying ribs inwardly protruding from an inner surface of the flat plate portion, the flow-rectifying ribs extending in a direction parallel to center axes of the one or more coils and being positioned to face side boundaries of the face of the one or more coils. The flat plate portion and the flow-rectifying ribs form a first air cooling channel at a substantially uniform gap outside of the one or more coils along the direction parallel to the center axes thereof, the first air cooling channel passing cooling air to air-cool the one or more coils.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: October 5, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kiyoshi Takahashi
  • Patent number: 11133128
    Abstract: A system in package module assembly is provided, and includes: a substrate, and a chip, an inductor, and an electrical element that are electrically connected to the substrate. The substrate includes a first surface, a second surface opposite to the first surface, and an accommodation groove. The accommodation groove passes through the second surface and the first surface. The inductor includes a magnetic core and an inductive coil. The magnetic core includes a base and a protrusion disposed on an outer surface of the base. The outer surface on which the protrusion is disposed and that is of the base abuts on the second surface. The protrusion is accommodated in the accommodation groove. The inductive coil is disposed in the protrusion. A system in package module and an electronic device are further provided.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: September 28, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yuping Gong, Zhaozheng Hou, Junhe Wang
  • Patent number: 11127517
    Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Joong Won Park, Young Seuck Yoo