Patents Examined by Tuan T Dihn
  • System interconnect for integrated circuits
    Patent number: 9660364
    Abstract: An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.
    Type: Grant
    Filed: October 16, 2013
    Date of Patent: May 23, 2017
    Assignee: Intel Corporation
    Inventors: Timothy Wig, Todd Hinck, Sanka Ganesan