Patents Examined by U. K. Kajguru
  • Patent number: 5145904
    Abstract: Filler-containing thermoplastic molding materials contain, as essential components,A) from 10 to 84.8% by weight of a thermoplastic polyamide,B) from 10 to 84.8% by weight of a modified polyphenylene ether,C) from 5 to 50% by weight of glass fibers or carbon fibers or a mixture thereof, having a median fiber length 1.sub.50 of from 150 to 400 .mu.m, andD) from 0.2 to 4% by weight of a pigmentand in additionE) from 0 to 4% by weight of a rubber impact modifier,F) from 0 to 20% by weight of a particulate filler which differs from D) andG) from 0 to 20% by weight of a flameproofing agent.
    Type: Grant
    Filed: June 21, 1990
    Date of Patent: September 8, 1992
    Assignee: BASF Aktiengesellschaft
    Inventors: Klaus Muehlbach, Peter Steiert, Klaus Benker