Patents Examined by Uyen-Chan N. Le
  • Patent number: 8684487
    Abstract: A disclosed conveying apparatus includes plural conveyance paths arranged in parallel and configured to receive plural conveyance objects fed from an upstream side of the plural conveyance paths and convey the received plural conveyance objects to a conveyance destination situated at a downstream side of the plural conveyance paths. The plural conveyance paths are configured to convey the plural conveyance objects in the order in which the plural conveyance objects are received.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: April 1, 2014
    Assignee: Ricoh Company, Ltd.
    Inventor: Shinji Imoto
  • Patent number: 8545111
    Abstract: An optical module has a structure for reducing the stress applied to a package. The optical module is structured so that an end face of a waveguide (37) of a planar lightwave circuit (30) is joined to a plurality of packages (40) storing therein optical elements so that the waveguide is optically coupled to the optical elements. The optical module includes a housing (3) storing therein a planar lightwave circuit and a plurality of packages in which an upper face of a protrusion (270) formed in the bottom section is fixed to the planar lightwave circuit (30). Each of the plurality of packages (40) is electrically connected to an electric part (22) provided in the housing (3) via flexible printed circuits (271a, 271b).
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: October 1, 2013
    Assignees: Nippon Telegraph and Telephone Corporation, NTT Electronics Corporation
    Inventors: Takaharu Ohyama, Yoshiyuki Doi, Ikuo Ogawa, Akimasa Kaneko, Yasuaki Tamura, Yuichi Suzuki
  • Patent number: 8192089
    Abstract: A connector has first and second connector units, each unit incorporating an oil-filled chamber housing one or more contact elements to be joined. At least one connector unit has a face seal assembly which seals the forward end of the contact chamber in the unmated condition. The face seal assembly comprises three elements. One element is an annular elastomeric seal situated radially outward. The two other elements are inner seal elements which are pressed together radially to form a substantially disc-like shape. The resulting disc-like shaped seal fills the central, circular end face opening of the outer annular seal. As the connector units are mated, elements of the elastomeric face seal assembly are displaced, one axially, and others both axially and radially, creating an opening between the oil-filled chambers that is sealed from the outside environment.
    Type: Grant
    Filed: September 18, 2008
    Date of Patent: June 5, 2012
    Assignee: Teledyne Instruments, Inc.
    Inventors: James L. Cairns, Srikanth Ramasubramanian, Stewart M. Barlow
  • Patent number: 6267295
    Abstract: This invention provides an IC card processing apparatus in which a contact error does not occur in contact elements even when a warped card is inserted, and the service life of the contact of the contact elements can be prolonged. When an IC card 1, 1′ is inserted to the deep end, the distal end of a second arm 42 of a pivot lever 40 abuts against the upper surface of a contact element block 50, to regulate the contact element block to swing about a fulcrum on a line almost perpendicularly intersecting one surface of the contact element block 50 and extending through almost the center of a contact element group, or a support axis perpendicularly intersecting this line, as the center. Therefore, the contact pressures between the respective contact elements 51 of the contact element block 50 and the respective contacts of the IC card 1, 1′ become almost equal to each other.
    Type: Grant
    Filed: August 25, 1999
    Date of Patent: July 31, 2001
    Assignee: Anritsu Corporation
    Inventors: Ryuuichi Amagai, Katsushi Nakamura