Patents Examined by V. Duang Dang
  • Conditioning process for electroless plating of polyetherimides
    Patent number: 5441770
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: August 14, 1991
    Date of Patent: August 15, 1995
    Assignee: Shipley Company Inc.
    Inventors: James E. Rychwalski, Paul J. Ciccolo, Robert B. Currie, Philip D. Knudsen