Abstract: The present invention is the formation of solid polymer layers under vacuum. More specifically, the present invention is the use of "standard" polymer layer-making equipment that is generally used in an atmospheric environment in a vacuum, and degassing the monomer material prior to injection into the vacuum. Additional layers of polymer or metal or oxide may be vacuum deposited onto solid polymer layers.Formation of polymer layers under a vacuum improves material and surface characteristics, and subsequent quality of bonding to additional layers. Further advantages include use of less to no photoinitiator for curing, faster curing, fewer impurities in the polymer electrolyte, as well as improvement in material properties including no trapped gas resulting in greater density, and reduced monomer wetting angle that facilitates spreading of the monomer and provides a smoother finished surface.

Abstract: A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferring and printing a conductive thick film pattern transferred on the blanket onto a substrate, firing the conductive pattern to scatter the organic matter, and sintering the conductive pattern. A conductive ink comprises conductive metal powder, glass frit, transition metal oxide, dispersing agent, and vehicle containing an organic binder comprising at least one of poly-iso-butyl methacrylate, poly-iso-propyl methacrylate, polymethyl methacrylate, poly-4-fluoroethylene, and poly-.alpha.-methyl styrene.

Abstract: Drill bits having projecting inserts are completely coated with refractory material including on the edge margins about the inserts by thermally spraying with refractory particles whose particulate constituent under the spraying conditions is able to penetrate the inserts. Completely coated drill bits are provided.

Abstract: A base material for printed wiring boards is formed by laminating together layers of prepregs of woven cloth impregnated with a thermosetting polymeric resin varnish. The varnish has an inorganic filler which is present in an amount sufficient to provide the base material with an average coefficient of thermal expansion along its Z-axis between 30.degree. C. and 270.degree. C. which is equal to or less than the coefficient of thermal expansion of copper from 30.degree. C. to 270.degree. C. plus the maximum elongation at 270.degree. C. of copper suitable for forming a conductive pattern on hole walls of printed wiring boards. Printed wiring boards manufactured on the base material by additive or subtractive processes are resistant to failure from thermal stress or thermal cycling.

Abstract: An efficient spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. The displacement tin plating solution is stabilized and replenished by incorporating free tin metal in the plating solution reservoir. Unwanted tin(IV) ions which are produced by aerial oxidation during the spray process, are reacted with tin metal in the reservoir to produce sufficient tin(II) ions to compensate for losses due to plating, oxidation and the like. Not only is the plating bath stabilized, but its useful life is extended dramatically.

Abstract: There is disclosed a process for growing a high-melting-point metal film comprising the steps of forming a first ion-implanted layer in a given region of a silicon substrate, in which region a second ion-implanted layer is formed; contacting a high-melting-point metal fluoride gas with the surface of the second ion-implanted layer to adhere the high-melting-point metal thereto; growing the high-melting-point metal film of a given thickness by reacting the mixture of the high-melting-point metal fluoride and silane gas; and subjecting the silicon substrate to a heat treatment, characterized in that the above third and fourth steps are alternatively repeated.

Abstract: The present invention is directed to lacquer binders containing polyvinyl acetal which are suitable for the formation of films and coatings and contain mixtures ofa) polyvinyl acetals andb) organic compounds containing (i) carbodiimide and/or uretone imine groups and (ii) blocked isocyanate groups,the mixtures containing from 1 to 300 parts by weight of component b) per 100 parts by weight of component a).The invention is also directed to a process for the formation of coatings on heat resistant substrates by coating these substrates with a coating composition containing binder, inert solvent and optionally the conventional auxiliary agents and additives used in lacquer technology, followed by curing of the coating at temperatures above about 80.degree. C., characterized in that the coating compositions used contain binders of the type mentioned above. Finally, the present invention is directed to these coated heat resistant substrates.

Abstract: A process for providing through plated holes in a substrate by screen printing provides uniformly thick plating of the holes. One side of the substrate is screen plated while being subjected to an underpressure between 10 and 200 gr/cm.sup.2 from a chamber fed by a large volume vacuum vat. When treating the other side of the substrate, vacuum may be increased up to 2.5 times the first underpressure.

Abstract: A method and apparatus for drawing a thick film circuit on a substrate by discharging a paste from a tank with a discharge hole. A waste drawing is performed by extruding the paste from the tank on a waste drawing section at a predetermined interval of non-drawing duration, thereby preventing paste clogging at the discharge hole and resulting in increase on workability and productivity.