Abstract: A method of making a capillary tube for providing increased control of electroosmotic flow in electrophoretic separation. A resistive coating solution is formed so that a tube coating having a high electrical resistivity may be achieved. An electrically conductive material, such as carbon black, is homogeneously mixed with a polymer, such as polyimide, in a solvent. The content by weight of the electrically conductive material is less than 20 percent and is preferably within 7 percent to 8 percent, relative to the content by weight of the polymer. The resistive coating solution is applied to the exterior of the tube until a thickness is reached which achieves a desired resistance across the coated exterior surface. Typically, a multi-layered coating is formed. The coating solution may be applied while rotating the capillary tube or, alternatively, while the capillary tube is drawn past an applicator.

Abstract: A printed-wiring board shielded from electromagnetic wave radiation is made by forming a conductive circuit pattern on an insulating substrate, disposing a first insulating layer over the circuit pattern, forming a jumper wire over the first insulating layer and between connecting terminals of the conductive pattern, forming a second insulating layer covering the jumper wire and the first insulating layer, and disposing an electromagnetic wave shielding layer over the conductive pattern. The jumper wire is formed by a printing process using a conductive paste containing a conductive metal such as silver, carbon or copper. The shield layer is formed by a printing process using a conductive metal resin paste such as copper. The shield layer is protected by providing an overcoat layer over the shield layer.

Abstract: There is disclosed methods for producing self-supporting ceramic matrix and ceramic matrix composite bodies by batch, semi-continuous, and continuous processes utilzing the directed oxidation of a molten parent metal with an oxidant to form an oxidation reaction product which may embed filler material.

Abstract: A thick film forming process according to the present invention comprises using the screen printing to form thick films in the vicinity of the edges or parts of large areas of a substrate, and next using the direct writing to form thick films of patterns on the other parts of the substrate. The process of this invention enables a circuit pattern in thick films to be changed easily in set conditions.

Abstract: A polyol-water mixture is applied over the polymeric insulation of the or each conductor core of an electrical cable prior to extruding the polymeric sheath of the cable thereover such that the polymeric sheath is prevented from adhering to the polymeric insulation.

Abstract: A method of preventing the growth of microorganisms on the surface of a substrate in contact with the environment, while simultaneously preventing corrosion of these substrates by depositing nickel-63 onto the substrate.

Abstract: A method of decorating a glass substrate that has conductive coating applied thereto as electrically resistive heating elements comprises applying to said glass substrate a glass enamel composition comprising 5 to 25 percent by weight glass coloring agents, 1 to 25 percent by weight of a metal that will be resistant to rapid oxidation under the conditions in which the glass enamel is fired, and the remainder a soda free flux glass. The conductive coating composition is next applied and comprises finely divided conductive noble metals including silver, and a glass binder. The glass enamel composition and the conductive coating composition are fired onto the substrate. The glass enamel and conductive coating do not visibly react and the conductive coating cannot be seen through the glass enamel.

Abstract: A strain detector which has a driven shaft for receiving a stress; a high magnetostrictive rate magnetic layer made of one of Co--B, Co--P, Co--Ni--B, Ni--Fe--P, and Co--Ni--P formed by electroless plating on the outer periphery of the driven shaft; and a detecting coil disposed through a gap on the periphery of the magnetic layer for detecting a variation in the permeability by a strain responsive to the stress of the magnetic layer, a method for manufacturing the strain detector which has the steps of forming a high magnetostrictive plating layer made of one of Co--B, Co--P, Co--Ni--B, Ni--Fe--P and Co--Ni--P by electroless plating on the periphery of the driven shaft; and selectively removing the plating layer to obtain a magnetic layer made of a plurality of magnetic pieces aligned in parallel at a predetermined angle with respect to the central axis of the driven shaft.

Abstract: A technique for one step solder application through a mask to a printed circuit board (PCB) having pads for surface mountable components and through holes for a leaded components is disclosed wherein the amount of solder deposited on the pads and in the holes is simultaneously, independently controlled as a function of mask thickness, blade hardness and blade to mask angle.

Abstract: A solution and a method of using it for preventing smear in the manufacture of printed circuit boards includes monoethanolamine combined with a fatty acid for neutralizing the active amine except in the presence of relatively high heat, and a surface tension reducing agent. The solution is applied to the printed circuit board as holes are being drilled. The friction of the drill bit on the printed circuit board generates heat which activates the amine allowing it to attack the inner glass epoxy walls of the printed circuit board and prevent smear.

Abstract: The present invention provides a process for the currentless deposition of lectropositive metal layers on to appropriate less electropositive metals by contacting an object to be coated with a coating bath, wherein a coating bath is used which contains a metal complex obtained by reacting a monovalent electropositive metal halide with a base, which is capable of complex formation with the electropositive metal, and a hydrohalic acid.The present invention also provides a coating bath for the currentless deposition of electropositive metal layers on to less electropositive metals, wherein said bath contains an electropositive metal complex obtained by reacting a monovalent electropositive metal halide with a base which is capable of complex formation with the electropositive metal and a hydrohalic acid.

Abstract: A method and implementing apparatus for electroless plating an optical disk causes the disk to be positioned in a container with its main surface upturned and then rotated. As the disk rotates, liquid for treating or cleaning the disk is caused to fall on the upturned main surface from a position above the disk.

Abstract: A multilayer system comprises a seed layer (4) of copper deposited on an electrically insulating substrate (2). The seed layer (4) carries a copper pattern (8). An air fired dielectric (10) encapsulates the pattern (8) and the exposed parts of the seed layer (4). The outer skin of the pattern is oxidized as is also the whole of the seed layer other than where it underlies the copper pattern. The oxidized regions of the copper both form a firm bond with the dielectric and inhibit the migration of oxygen into the inner regions of the conductor pattern (8). Also the oxidation of the seed layer renders it non-conductive and therefore obviates the need for its removal. Through holes (12) produced in the dielectric enable electrical connection to the pattern (8).

Abstract: A conveyor on which tires are suspended, with sufficient travel to ensure that they dry out following treatment, for conveying them through a distribution chamber for the solution, equipped with devices for discharging jets of the solution; a movable arm is inserted in between two adjacent tires and temporarily lifts off at least one of them in order to rotate it in front of the discharge devices.

Abstract: A novel immersion tin composition is disclosed containing both thiourea compounds and urea compounds. A method for improving the adhesion of printed circuit boards to one another in a multilayer board and for minimizing or eliminating smear in a multilayer board is also disclosed comprising coating the metal layers of the individual circuit boards with an immersion tin coating prior to laminating them to form a multilayer board.

Abstract: The disclosure relates to a method of bonding semiconductor material to aluminum foil to provide electrical connection therebetween wherein the foil and/or the semiconductor material may have an oxide coating thereon. The method comprises heating the foil to a temperature in the range of from about 500.degree. C. to about 577.degree. C. and then moving the semiconductor into said foil under impact to expose elemental aluminum and semiconductor material at the point of impact and form a bond therebetween at the point of impact.

Abstract: A chip component holding plate includes a sheet member composed of silicon rubber, on which a number of quadrilateral through holes each of which is capable of holding a chip component therein are formed. A plate composed of stainless steel is formed on one main surface of the sheet member. On the stainless steel plate, a number of circular through holes each of which has a diameter larger than an inside width of each quadrilateral through holes of the sheet member are formed at positions respectively corresponding to the respective through holes of the sheet member. In the state that the chip components are respectively press-inserted into the respective through holes of the sheet member, the stainless steel plate is magnetically attracted by a magnet plate. Then, the magnet plate is moved so that end portions of the respective chip components being held by the sheet member are pressed onto a silver paste which is spread on a plate, whereby an electrode is applied on the end portion of each chip component.

Abstract: An improved method for the production of a plasticizer-containing dry flowable polyvinyl alcohol (PVA) resin blend capable of thermoplastic processing. The method provides for the incorporation of plasticizers in intimate contact with the PVA resin without heating, cooling, or extended drying steps. Specifically, PVA resin granules having an appropriately small particle size distribution are spray-coated with a liquid plasticizer medium, and then mixed with a dry, fine powder coating medium to produce a flowable, dry plasticized PVA blend. Additional components, such as antioxidants, dyes, and antiblocking agents, may also be incorporated into the finished product.

Abstract: Process for chemically metallizing an inorganic substrate, which is a poor conductor of electricity, e.g. a ceramic material or glass. The surface of the substrate is chemically activated so that chemical bonds are more readily formed with a subsequently applied, inorganic adhesion promoter. The adhesion promoter in turn facilitates chemical bonding with a subseqently applied metal layer, e.g. a copper layer, which is applied by a wet chemical method. The activation step and the step of applying an adhesion promoter, in combination with at least one thermal treatment, results in an adhesive strength between the metal layer and the substrate surface which equals or exceeds the adhesion strength of the surface of the substrate material.

Abstract: A moving part has material initially applied to it a predetermined distance from its leading edge. Whenever a sensor senses a notch in a flange of the moving part, application of material to the moving part is stopped for a predetermined distance prior to the start of the notch to a predetermined distance beyond the notch. Application of material to the moving part is finally stopped a predetermined distance prior to its trailing edge. Two separate sensors are used to control each of three spray guns for applying the material in the selected areas.