Abstract: A method and structure for a wafer level package is provided, which utilizes a plurality of spacer walls on a semiconductor wafer or a transparent substrate, which has the ability to decide the position of the sealant. As a result, the dimension of a device is decided by the position of the sealant and the spacer walls, therefore, shrinking the distance between the photosensitive zone and the sealant will enhance the gross dies after performing a die sawing process to the whole semiconductor wafer. In addition, the semiconductor process decides the height of the spacer walls so that the yield will be improved due to the fact that a uniformity of the gap, which is between the semiconductor wafer and the transparent substrate, and the width of sealant, will be controlled.

Abstract: A light-emitting unit includes an LED, a lead on which the LED is mounted, and a transparent protector covering the LED. The lead is formed with a dent to accommodate the LED. The dent includes a bottom surface to which the LED is attached and a side surface extending from the bottom surface in a flaring manner. The side surface of the dent is formed with at least one opening so that it avoids encircling the LED completely.