Abstract: A method for manufacturing resistors comprising the steps of forming a top electrode layer on a top face of a substrate, a resistance pattern connected to the top electrode layer, a protective layer covering the resistance pattern, a thin metal film side electrode layer on a side face of the substrate which is electrically connected to the top electrode layer, and a concavity by removing a part of the side electrode layer and substrate.
Type:
Grant
Filed:
January 11, 1999
Date of Patent:
May 29, 2001
Assignee:
Matsushita Electric Industrial Co., Ltd.