Abstract: A sensor head of a test and measurement instrument can include an input configured to receive an input signal from a device under test (DUT), an optical voltage sensor having signal input electrodes and control electrodes or one set of electrodes, wherein the input is connected to the signal input electrodes, and a bias control unit connected to the control electrodes and configured to reduce an error signal or the input signal bias control signal are electrically combined and applied to a single set of electrodes.

Abstract: Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Abstract: Methods and apparatus for electrical measurement are disclosed. An example electrical measurement device includes a conductive cable that includes a plurality of conductive filaments on a first end and an electrical connector on a second end, a cable mount that includes a base and an adjustable support attached to the base and the conductive cable to hold the plurality of conductive filaments in contact with a rotating element of a device under test during a measurement operation, with the conductive cable forming a portion of a circuit when the plurality of conductive filaments are in contact with the rotating element of the device under test and the electrical connector is in contact with an output.

Abstract: A radio wave measurement device enabling highly sensitive measurements of radio waves at an extremely low temperature is disclosed. The radio wave measurement device has a radiation-blocking filter through which a targeted radio wave is transmitted, a radio wave-transparent material to reflect a non-targeted electromagnetic wave included in radio waves, and a radio wave detector which are placed in a vacuum vessel, in which the radio waves are transmitted through the radiation-blocking filter, the non-targeted electromagnetic wave included in the radio waves is reflected toward the radiation-blocking filter by the radio wave-transparent material and collected as heat into the radiation-blocking filter, and the heat is exhausted out of the system, allowing the radio waves transmitted through the radio wave-transparent material to be measured with high sensitivity by the radio wave detector.

Abstract: A system for estimating a flowable substrate level in a storage unit is disclosed. In one embodiment, the system includes a transmitter and a conductor that extend downwardly into a grain storage bin, which cycles through a range of frequencies in order to determine the resonant frequency of the conductor which changes depending on the amount of grain in the bin.

Abstract: Systems, methods, and computer readable media to improve integrated circuit (IC) debug operations are described. In general, techniques are disclosed for acquiring/recording waveforms across an under-test IC during a single sweep of a laser scanning microscope (LSM). More particularly, techniques disclosed herein permit the acquisition of an integrated circuit's response to a test signal at each location across the IC in real-time. In practice the test signal consists of a stimulus portion that repeats after a given period. In one embodiment, the IC's response to multiple complete stimulus portions may be averaged and digitized. In another embodiment, the IC's response to multiple partial stimulus portions may be averaged and digitized. As used herein, the former approach is referred to as waveform mapping, the latter as gated-LVI.

Abstract: A contactor having the top ends of its pogo pins contacting the leads of a semiconductor device package positioned in a handler at controlled temperature, and the bottom ends of the pogo pins contacting the pads of electrically conducting vias extending vertically through a heatable interposer. The heatable interposer has a first and a second surface and includes alternating horizontal layers of thermally conductive material and thermally insulating material, and further one or more heating layers operable to control a temperature profile from the first to the second surface, including a temperature control at the first surface. The via pads at the second interposer surface are in contact with the printed circuit board of a tester.

Abstract: An electrode device for a capacitive sensor device and a circuit arrangement for a capacitive sensor device for the operation of an electrode device are provided, wherein the electrode device has a first electrode structure with at least one transmitting electrode and at least one receiving electrode, and a second electrode structure with at least one field sensing electrode, wherein the electrode device or the capacitive sensor device can be operated in a first operation mode and in a second operation mode. In addition a method is provided for approach and/or touch detection with a sensor device.

Abstract: A digital multimeter stores multiple sequential measurements of physical or electrical parameters. Each of the sequential measurements has a name including an automatically generated descriptor. The descriptor for each sequential measurement may indicate a relative position of the measurement within the sequence. For instance, the descriptor may indicate whether the measurement was obtained before or after other measurements in the sequence.

Abstract: A high-powered, high-voltage test device for generating a test voltage, wherein the test voltage is an alternating voltage having an amplitude of at least 100 kV at a power of greater than 1 kW, wherein the device has at least two voltage amplifier branches, of which a first voltage amplifier branch contributes to generating the positive voltage half-cycles of the test voltage and a second voltage amplifier branch contributes to generating the negative voltage half-cycles of the test voltage. The high-voltage test device furthermore has a measurement circuit for measuring the test voltage to be applied to a measurement object and the test current consequently caused in the measurement object and is characterized in that each voltage amplifier branch is installed in a separate assembly having integrated active air cooling.

Abstract: A probe card includes a mechanical support fixture having an inner aperture with a plurality of probes secured to the fixture that includes probe tips that extend into the inner aperture for contacting probe pads on die of a wafer to be probed. At least one magnetic shield includes a magnetic material that at least substantially surrounds a projected volume over an area that encloses the probe tips. The magnetic material has a relative magnetic permeability of at least 800.

Abstract: A current sensing assembly includes a conductor having a first side, a second side opposite the first side, a third side, and a fourth side opposite the third side. The first side has a first notch formed therein and the second side has a second notch formed therein opposite the first notch. The current sensing assembly also includes a sensor assembly including a first magnetic sensor disposed in the first notch or proximate to the third side of the conductor between the first and second notches, and a second magnetic sensor disposed in the second notch or proximate to the fourth side of the conductor between the first and second notches.

Abstract: Microwave micro-strip or coplanar waveguide (CPW) transistor test fixtures have the top surface of the input and output blocks forming a convex shape, to allow the soft dielectric substrate to be stretched over the surface and establish secure and continuous ground contact with the block surface and eliminate spurious cavities and discontinuities.

Abstract: An end-sensing sensor assembly for proximity sensing including one or more sensing devices positioned between two axially magnetized ring magnets having like poles facing one another such that the magnetic fields emanating from the two axially magnetized ring magnets define a moveable balanced zone therebetween. The one or more sensing devices may be positioned within the balanced zone or outside the balanced zone, or combinations thereof. The balanced zone shifts in response to the approach of a magnetic, permeable, and/or ferrous material which cause the sensing device to actuate in response to a sufficient shift in the balanced zone. Upon removal or departure of the magnetic, permeable, and/or ferrous material, the balance zone shifts back to the initial position prior to the approach of the magnetic, permeable, and/or ferrous material.

Abstract: A method of inducing spin polarization in an analyte is provided. The method exposes 14N spin defect centers embedded within 25 nm of a diamond surface to a magnetic field while an analyte is near the surface. The 14N spin defect centers are polarized by treatment with an electromagnetic wave protocol having a visible light pulse (p0); a microwave pulse (mw1), a radio frequency pulse (rf1), a microwave pulse (mw2) and a radio frequency pulse (rf2) resulting in polarization of the nuclear spins of the 14N spin defect centers. Polarized spins in the 14N spin defect centers induce spin polarization in the analyte.

Abstract: An electronic device test system is configured to test functions of an electronic device. The electronic device test system includes: a test computer, configured to execute an electronic device test program; a scanning device, configured to scan a barcode number of the electronic device; and an optical sensor module, configured to detect a connection status of the electronic device and the test computer. When the optical sensor module confirms the connection status, the electronic device test program starts a test function to test the electronic device, records a test result of the electronic device according to the barcode number, and subsequently generates a retest rate according to the test result.

Abstract: In an embodiment, a method of testing a radio frequency integrated circuit (RFIC) includes generating high-frequency test signals using the on-chip test circuit, measuring signal levels using on-chip power detectors, and controlling and monitoring the on-chip test circuit using low-frequency signals. The RFIC circuit is configured to operate at high frequencies, and an on-chip test circuit that includes frequency generation circuitry configured to operate during test modes.

Abstract: Some embodiments relate to a semiconductor device on a substrate. An interconnect structure is disposed over the substrate, and a first conductive pad is disposed over the interconnect structure. A second conductive pad is disposed over the interconnect structure and is spaced apart from the first conductive pad. A third conductive pad is disposed over the interconnect structure and is spaced apart from the first and second conductive pads. A fourth conductive pad is disposed over the interconnect structure and is spaced apart from the first, second, and third conductive pads. A first ESD protection element is electrically coupled between the first and second pads; and a second ESD protection element is electrically coupled between the third and fourth pads. A first device under test is electrically coupled between the first and third conductive pads; and a second device under test is electrically coupled between the second and fourth pads.

Abstract: Provided herein is a radio frequency (RF) coil assembly. The RF coil assembly includes one or more coil elements arranged on a shell, a cable connector electrically connected to the coil elements, the cable connector including a number of inner wires enclosed with an outer insulative jacket, and the cable having a first end connect to a connector and a second end rotatably connected with the shell, and the inner wires exposed outwardly of the outer insulative jacket of the second end of the cable and electrically connected to the coil elements.

Abstract: A phase current integration method for diagnosing a fault in a switched reluctance motor power converter determines whether the main switch of a switched reluctance motor power converter is experiencing a short circuit or an open circuit fault by measuring a phase current io(t) transient value of said converter in a non-fault state as well as a present phase current i(t) transient value of said converter, so as to obtain, by an integration operation, an integration value SnO of a phase current during a certain period under the non-fault state, and an integration value Sn of a phase current during a certain period under a present state, the ratio En of the two values indicating a fault characteristic value.