Abstract: A method of making a semiconductor chip 1 having a first electrodes 11, 12 on main surface 1a thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1b opposite to the main surface 1a of the semiconductor chip 1, and a side portion 132 extended from one end portion of the base portion 131 in the direction toward the main surface 1a of the semiconductor chip 1, wherein an end part of the side portion 132 of the second electrode 13 is exposed on the same side as the first electrodes 11, 12.