Abstract: A lithographic projection apparatus for successively projecting a pattern on wafers by preliminarily determining locations of surface points of each wafer before it is illuminated in a projection station has a pair of measuring stations arranged oppositely with respect to the projection station at the center. Each measuring station has a wafer surface sensor for determining the locations of surface points of the wafer carried on a stage and a stage height sensor for measuring the height of a reference plane on the stage. A wafer on a stage is placed in one of the measuring stations to have measurements taken and ideal height data are collected while another wafer is being illuminated in the projection station. After these measurement and illumination processes are completed, the illuminated wafer is removed from the projection station and replaced with a new wafer to be measured and illuminated.

Abstract: To reduce and prevent local field anomalies created localized thinning of the coating of optical elements in the apparatus. The projection system is flood exposed to an intense beam of radiation for a substantial period of time. As the rate of thinning of the coating decreases with time, a uniform coating results.

Abstract: A carrier for carrying a lithographic substrate or a lithographic patterning means. The carrier comprises a first member provided with an open hollow structure that is open to at least one side of the member. The carrier further comprises a second member connected to the first member, such that a closed hollow internal structure is formed between the carrier members.

Abstract: An exposure apparatus includes an illumination optical system for illuminating a reflection mask that forms a pattern, by using light from a light source, wherein the illumination optical system includes a field stop that defines an illuminated area on the reflection mask, and has an opening, and an imaging system for introducing the light from the opening in the field stop into the reflection mask, the imaging system being a coaxial optical system, wherein a principal ray of the imaging system at a side of the reflection mask forming an inclination angle to a common axis of the coaxial optical system, the inclination angle being approximately equal to an angle between a principal ray of the projection optical system at the side of the reflection mask and a normal to a surface of the reflection mask.

Abstract: A lithographic projection apparatus is provided. The apparatus includes a radiation system for providing a beam of radiation, and a support for supporting a patterning device. The patterning device serves to pattern the beam of radiation according to a desired pattern. The apparatus also includes a substrate table for holding a substrate, a projection system for projecting the patterned beam of radiation onto a target portion of the substrate, and a particle supply unit for supplying getter particles into the beam of radiation in order to act as a getter for contamination particles in the beam of radiation. The getter particles have a diameter of at least about 1 nm.

Abstract: A stage system that reduces disturbances caused by deformation of a cable and achieves high-precision positioning. The stage system includes a substrate stage movable in at least two axial directions, a fine-motion cable unit that holds a cable and finely moves in at least two axial directions, and a coarse-motion cable unit that coarsely moves the fine-motion cable unit in at least one axial direction.

Abstract: The present invention provides for a method for adjusting an alignment microscope. In the method of the present invention an alignment mask is used in which the one side comprises at least one alignment mark and the other side is reflective. For the adjustment, the microscope is first focused to the alignment mark and then refocused to the mirror image of the alignment mark generated by the reflective side. The microscope is then adjusted by comparing the positions of the alignment mark and the generated mirror image of the alignment mark until the alignment mark overlaps its mirror image. Moreover, a device for adjusting an alignment microscope in accordance with the method of the present invention.

Abstract: A lithographic projection apparatus is disclosed. The apparatus includes an illumination system configured to condition a beam of radiation, and a support structure configured to support a patterning device. The patterning device serves to impart the beam of radiation with a pattern in its cross-section. The apparatus also includes a substrate table configured to hold a substrate, a projection system configured to project the patterned beam onto a target portion of the substrate, and a fluid supply system configured to provide a fluid to a volume. The volume includes at least a portion of the projection system and/or at least a portion of the illumination system. The apparatus further includes a coupling device configured to couple the fluid supply system to the substrate table, substrate, support structure, patterning device, or any combination thereof.

Abstract: An alignment apparatus includes a first support member having a reference surface which movably supports an object, and a driving unit which moves the object in at least one direction on the reference surface and aligns the object at a predetermined position. The driving unit includes (i) a first driving unit which moves the object in a first direction, and (ii) a second driving unit which moves the object in a second direction, substantially perpendicular to the first direction. The alignment apparatus further includes a second support member which is provided separately from the first support member and supports a heating unit of the driving unit, through a bearing. The first support member supports the object so as to allow the object to move in the first and second directions, and the second support member supports the first and second driving units.

Abstract: A method and structure for optimizing an optical lithography illumination source comprises a shaped diffractive optical element (DOE) interposed between the illuminator and a lens during the exposure of a photoresist layer over a semiconductor wafer. The DOE may, in some instances, increase depth of focus, improve the normalized image log-slope, and improve pattern fidelity. The DOE is customized for the particular pattern to be exposed. Descriptions and depictions of specific DOE's are provided. Additionally, a pupilgram having a particular pattern, and methods for forming the pupilgram, are discussed.

Abstract: A lithographic apparatus includes at least one object support structure in a high vacuum chamber. The object support structure includes a carrier device in which a number of dividing walls are provided forming a number of compartments in the carrier device. At least one of the compartments is shielded from the high vacuum chamber and is provided with separate gas evacuating structures.

Abstract: An optical scanning apparatus that includes a light source, a polygon mirror for deflecting a plurality of light beams emitted from the light source, and an image focusing system for causing the light beams deflected by the polygon mirror to form spots on surfaces of a plurality of photosensitive drums, wherein the image focusing system is disposed between the polygon mirror and the photosensitive drums, and includes scanning lenses for causing the beams deflected by the polygon mirror to form spots on the respective surfaces of the photosensitive drums, and the central axes of the scanning lenses are spaced a predetermined distance from optical axes extended from the center of the light source.

Abstract: A system and method for generating an illumination intensity profile of an illuminator that forms part of a projection lithography system. Radiation from the illuminator is projected towards an illumination profile mask having a plurality of apertures such that each aperture passes a distinct portion of the radiation. The intensity of each of the distinct portions of radiation is detected and assembled to form the illumination intensity profile.