Patents Examined by W. David Walkenhorst
  • Patent number: 6674006
    Abstract: An assembly for electrical distribution includes not less than six conductors, the assembly defining a distribution portion and a source application portion, load connecting portions of the conductors being arranged in overlying layers in the distribution portion of the assembly. The load connecting portion of each conductor includes at least one load connection portion projecting beyond the overlying layers of the assembly whereby each load is connected between two conductors at the distribution portion of the assembly. The source connection portion of each conductor having at least one connection element, the source connection portion of each conductor being electrically isolated from the source connection portions of all other conductors.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: January 6, 2004
    Assignee: D-M-E Company
    Inventors: Thomas Linehan, Fred Schroeder, Todd Johnston, John Khalaf
  • Patent number: 6667439
    Abstract: An IC package preferably includes an IC and encapsulating material surrounding the IC, with the encapsulating material having an opening therein to define an exposed portion of the IC. Vestigial portions of encapsulating material may be left on the exposed portion of the IC and spaced inwardly from a periphery of the opening based upon molding using a mold protrusion which includes a bleed-through retention channel positioned inwardly from peripheral edges. The channel collects and retains any bleed-through of the encapsulating material. The IC package may further include a leadframe carrying the IC. The leadframe may include a die pad, finger portions, and a plurality of die pad support bars. The die pad may be downset below a level of the finger portions. Each of the die pad support bars may be resiliently deformed to accommodate the downset of the die pad. Low stress encapsulating material and adhesive may also be included in the IC package.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: December 23, 2003
    Assignees: Authentec, Inc., Hestia Technologies, Inc.
    Inventors: Matthew M. Salatino, Patrick O. Weber
  • Patent number: 6664464
    Abstract: This specification discloses an anti-EMI device used in electronic products. The device contains a U-shape component and a spring component. The U-shape component is embedded inside the housing of an electronic product for fixing and connecting the anti-EMI device to the electronic product. The spring component is used to shield the EMI from the electronic product. The spring component is connected to the bottom surface of the U-shape component, extending along both sidewalls toward the opening of the U-shape component and protruding out of the electronic product housing.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: December 16, 2003
    Assignee: Quanta Computer Inc.
    Inventors: Hung-Ta Liao, Ming-Chu Hou, Wei-Jen Lee, Guo-Ming Huang
  • Patent number: 6660940
    Abstract: An insulation insert (40) is provided for preventing electrical shorts and/or arcing between adjacent strands in a stator coil. The insulation insert includes a thin base (42) of substantially uniform cross section and a lead-in nose (43) formed in the thin base (42) for guiding the insulation insert (40) into a position between adjacent strands. The insulation insert (40) includes two substantially vertical cuts (45) in the thin base (42) above the lead-in nose (43), which delineate a center section (44) flanked by two ear portions (46). A head (54) and two wings (52) are formed in the insulation insert by folding the ear portions (46) along substantially horizontal creases (47).
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: December 9, 2003
    Assignee: Siemens Westinghouse Power Corporation
    Inventor: Franklin T. Emery
  • Patent number: 6660933
    Abstract: The invention relates to a shielding element for electromagnetically shielding an aperture opening formed, for example, in a metallic structure, a plug holder or a component housing. In the non-deflected state, a large number of conductive contact springs extend from the frame of the shielding element towards the aperture opening. The contact springs at least partially overlap one another and close the aperture opening. When a plug-in element is inserted into the aperture opening, the contact springs are deflected in the insertion direction and rest in a sprung manner on the component. The invention provides an automatically closing radio-frequency seal for an aperture opening.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: December 9, 2003
    Assignee: Infineon Technologies AG
    Inventor: Mario Festag
  • Patent number: 6657120
    Abstract: A shelter for individuals or groups of people caught in the open in inclement weather especially when there is a danger of lightning. The shelter includes an elongate electrically-conductive member for supporting a canopy, the elongate electrically-conductive member being configured as a lightning conductor; an electrically-conducting floor; and a coupling member for electrically connecting the elongate electrically-conductive member to the electrically-conducting floor. The coupling member includes a flange extending laterally away from the elongate electrically-conducting member, over the electrically-conductive flooring, to provide an enlarged footprint of engagement with the electrically-conducting floor.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: December 2, 2003
    Assignee: H. R. Smith (Technical Developments) Limited
    Inventor: Henry Roy Smith
  • Patent number: 6657128
    Abstract: A housing for an electrical apparatus includes a sheath, at least one shed and a hydrophobic coating. The sheath includes a first electrically insulative material and an outer surface. The at least one shed includes a second electrically insulative material and an outer surface. The hydrophobic coating is applied to the outer surface of at least one of the sheath and the at least one shed. One of the first electrically insulative material and the second electrically insulative material includes an electrically insulative, polymeric material.
    Type: Grant
    Filed: January 29, 2001
    Date of Patent: December 2, 2003
    Assignee: McGraw-Edison Company
    Inventors: Michael M. Ramarge, Thomas C. Hartman, David R. Miller, David Servies
  • Patent number: 6657137
    Abstract: In a connection structure for both first and second circuit boards, plural first terminals are arranged on the first circuit board in an arrangement direction, and plural second terminal are arranged on the second circuit board in the arrangement direction. The first and second circuit boards are disposed so that the first connection terminals and the second connection terminals are overlapped to each other, and the first connection terminals and the second connection terminals are connected by using an electrical conductive material. In the connection structure, an arrangement pitch of the first and second connection terminals is made smaller at an endmost portion or/and in vicinity of the endmost portion in the arrangement direction.
    Type: Grant
    Filed: July 16, 2001
    Date of Patent: December 2, 2003
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Kazuya Sanada
  • Patent number: 6657122
    Abstract: A multiple parallel conductor (1), particularly a transposed conductor, for windings of electrical devices and machines is described, which has a plurality of individually electrically insulated partial conductors (3) that together are provided with a common wrapping which comprises a perforated tape (8).
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: December 2, 2003
    Assignee: Nexans
    Inventors: Hans-Joachim Krenzer, Joachim Runge
  • Patent number: 6653563
    Abstract: An apparatus, including a die having a surface, further including an array of electrically conductive bumps; and a plurality of electrically conductive bars positioned within the array of electrically conductive bumps.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: November 25, 2003
    Assignee: Intel Corporation
    Inventor: Mark T. Bohr
  • Patent number: 6649825
    Abstract: A lightning rod system including both methods and specific types of lightning rod protection apparatus, which address the need for lightning rod safety features to deter impalement and minimize injury when humans inadvertently fall upon or strike the projecting air terminal through use of a hebetative contiguous impact surface (10) on an end cap(s). The system involves lightning rod system components such as humanized quantal rod (3) or coil spring coupler (13) engineered to be responsive within the range of forces achieved when a human of average size and weight falls onto the projecting air terminal from a standing surface level with that on which the lightning rod system is mounted to. The lightning rod system also involves a method and engineered components to retrofit existing lightning rod assemblies.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: November 18, 2003
    Assignee: National Lighting Protection Corporation
    Inventor: Robert W. Rapp
  • Patent number: 6649845
    Abstract: An elongate object (e.g., a cable) with at least one transmission element arranged in a core thereof, in which an outer sheath (3) of insulation material is applied over the core. To achieve specific properties of the sheath (3), the sheath is provided with a coating (4) of a cross-linkable insulating material, which is very thin compared to the thickness of the sheath, and the individual properties of which are adjusted to the particular application of the object.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: November 18, 2003
    Assignee: Nexans
    Inventors: Friedrich Mueller, Gilles Widawski, Andreas Rietz
  • Patent number: 6635820
    Abstract: The mounting rack has upper and lower outer walls which are each formed from two perforated shielding panels which are parallel to one another and at a distance from one another. As a result, the shielding attenuation of the mounting rack is considerably increased. In order to reduce the flow resistance, an intermediate space between the two shielding panels is filled with a congruently perforated insulator.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: October 21, 2003
    Assignee: Siemens Aktiengesellschaft
    Inventor: Eduard Mair
  • Patent number: 6633004
    Abstract: The electrical insulator has an insulator body 3 which is fitted between an electrical conductor 1 and a grounded holder 2. The surface of the insulator is at least partially formed by a protective body 6. The material of the protective body has a low dielectric constant in comparison to that of the material of the insulator body 3. The protective body 6 prevents an electrically conductive particle 12 from coming to rest directly on the surface of the insulator body 3, in particular in the region of the triple points T, or causing a considerable increase in the field due to immediate proximity to the insulator body 3. The breakdown voltage of a gas-insulated system which contains such insulators provided with a protective body is increased. Gas-insulated systems can thus be made more compactly and more cheaply, and their life can be extended.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: October 14, 2003
    Assignee: ABB Research Ltd
    Inventors: Christoph Heitz, Lutz Niemeyer, Marco Piemontesi
  • Patent number: 6632996
    Abstract: A package tape for testing a chip assembled by a packaging method such as a micro-ball grid array (BGA) package, whereby the chip is designed to face downward. The package tape includes one or more taps, disposed on a guard area other than an area where a semiconductor chip is attached, for testing the semiconductor chip. One or more pads are disposed on the area where the semiconductor chip is attached and are attached to corresponding test pads on the semiconductor chip. One or more leads which electrically connect the taps with the pads. The package tape advantageously enables easy testing of the electric characteristics of the semiconductor chip, which in a typical BGA package tape cannot be tested by probing since the circuit thereof faces down.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: October 14, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yoon-Gyu Song
  • Patent number: 6627811
    Abstract: A cable protective shield assembly is provided for managing the position of computer cables. The assembly includes a base plate having a number of spacers formed on one surface, a cover plate having a number of bores extending through the plate at locations designated in alignment with the spacers of the base plate, and a corresponding number of fasteners for insertion through the bores of the cover plate into the spacers of the base plate to rigidly couple the plates together. The height of the spacers create a standoff distance between the base plate and cover plate defining a space for computer cables to extend. The spacers are also positioned across the base plate surface as to create specific passageways for the cables to be located. One or more ports can be placed along the perimeter of the cover plate to allow access to cable connectors while generally maintaining the organized position of the cables.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: September 30, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brandon Rubenstein, Eugene A Miksch
  • Patent number: 6624360
    Abstract: A bushing, which normally includes an insulator, having a high-voltage connection and a metallic foot part, and an electrical conductor, the foot part of the insulator) is in the form of a curved housing part in which a post insulator for the electrical conductor is arranged. This configuration of the bushing allows the bushing to be arranged inclined on encapsulating housings in which the flange plane of the connecting flange for the bushing runs horizontally or vertically.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: September 23, 2003
    Assignee: Siemens Aktiengesellschaft
    Inventor: Manfred Meinherz
  • Patent number: 6621000
    Abstract: A computer chassis includes a first metal portion and a second metal portion. A mating edge connection is provided between the first and second portions. A gasket is mounted in the edge connection. The gasket includes a compressible strip of electromagnetic interference (EMI) limiting material. A pattern of holes is formed in the strip to improve compressibility and thus enhance EMI shielding.
    Type: Grant
    Filed: August 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Dell Products L.P.
    Inventors: Ralph W. Jensen, Richard S. Mills, Jeffrey C. Hailey
  • Patent number: 6610921
    Abstract: A container system including a vessel for holding a thixotropic semi-solid aluminum alloy slurry during its processing as a billet and an ejection system for cleanly discharging the processed thixotropic semi-solid aluminum billet. The crucible is preferably formed from a chemically and thermally stable material (such as graphite or a ceramic). The crucible defines a mixing volume. The crucible ejection mechanism may include a movable bottom portion mounted on a piston or may include a solenoid coil for inducing an electromotive force in the electrically conducting billet for urging it from the crucible. During processing, a molten aluminum alloy precursor is transferred into the crucible and vigorously stirred and controlledly cooled to form a thixotropic semi-solid billet. Once the billet is formed, the ejection mechanism is activated to discharge the billet from the crucible. The billet is discharged onto a shot sleeve and immediately placed in a mold and molded into a desired form.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: August 26, 2003
    Inventors: Christopher John Brannon, Gerard E. Parker
  • Patent number: 6610933
    Abstract: The invention in a first aspect relates to an improved cast resin bushing assembly for use in a transformer wherein the busing assembly includes a bushing which includes locating means for aligning the bushing assembly within a transformer casing; wherein the bushing further includes a locking means for releasably securing the bushing assembly to a transformer casing; a bushing conductor; and a bushing flange in circumferential arrangement with the bushing.
    Type: Grant
    Filed: September 17, 2001
    Date of Patent: August 26, 2003
    Assignee: Electrical Moulded Components Pacific Party Ltd.
    Inventors: Alfred George Baker, Kenneth Brett Boag