Patents Examined by W. Wilczewski
  • Wafer processing method
    Patent number: 7498239
    Abstract: A wafer processing method is capable of easily handling even a thinly formed wafer during the processing thereof. An annular protective member is bonded to an outer circumferential excess region on an outer surface of the wafer, on which devices are not formed, and a rear surface is ground with the outer surface left in the mentioned condition. Since the outer circumference of the wafer is reinforced with the annular protective member, the handling of the wafer becomes easy even after the wafer becomes thinner due to a grinding operation.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: March 3, 2009
    Assignee: Disco Corporation
    Inventor: Kazuhisa Arai