Patents Examined by Wael Fabanny, Jr.
  • Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
    Patent number: 6413852
    Abstract: A method for forming a multilayer interconnect structure on a substrate that include interconnected conductive wiring and vias spaced apart by a combination of solid or gaseous dielectrics.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: July 2, 2002
    Assignee: International Business Machines Corporation
    Inventors: Alfred Grill, Jeffrey Curtis Hedrick, Christopher Vincent Jahnes, Satyanarayana Venkata Nitta, Kevin S. Petrarca, Sampath Purushothaman, Katherine Lynn Saenger, Stanley Joseph Whitehair