Patents Examined by Wesley Nicolas
  • Patent number: 6916414
    Abstract: Using pulsed current and relatively low average voltages, articles containing light metals such as magnesium may be rapidly anodized to form protective surface coatings. The anodizing solutions employed may contain phosphate, permanganate, silicate, zirconate, vanadate, titanate, hydroxide, alkali metal fluoride and/or complex fluoride, optionally with other components present.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: July 12, 2005
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventor: Shawn E. Dolan
  • Patent number: 6709563
    Abstract: There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper completely into the depth of the fine recesses. The plating liquid contains divalent copper ions and a completing agent, and an optional pH adjusting agent.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: March 23, 2004
    Assignee: Ebara Corporation
    Inventors: Mizuki Nagai, Shuichi Okuyama, Ryoichi Kimizuka, Takeshi Kobayashi