Abstract: Using pulsed current and relatively low average voltages, articles containing light metals such as magnesium may be rapidly anodized to form protective surface coatings. The anodizing solutions employed may contain phosphate, permanganate, silicate, zirconate, vanadate, titanate, hydroxide, alkali metal fluoride and/or complex fluoride, optionally with other components present.
Abstract: There is provided a copper-plating liquid free from an alkali metal and a cyanide which, when used in plating of a substrate having an outer seed layer and fine recesses of a high aspect ratio, can reinforce the thin portion of the seed layer and can embed copper completely into the depth of the fine recesses.
The plating liquid contains divalent copper ions and a completing agent, and an optional pH adjusting agent.