Patents Examined by Wiliam A. Powell
  • Patent number: 4992120
    Abstract: A process for forming a line type image on the surface of a glass pane. A film of transparent tinted plastic material is adhesively attached to the face of the glass pane; thereafter a heated stylus is operated in "pencil" fashion to burn a line through the plastic film. An image is thus formed on the plastic surface.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: February 12, 1991
    Inventor: Robert R. Badura
  • Patent number: 4271887
    Abstract: In a tire chain comprising supporting members (1) disposed on the tread surface a retaining network (4) for the supporting members (1) is used which comprises transversely extending network parts (3) connecting lateral strands (6) and passing through passage apertures (2) in the supporting members (1). To prevent tilting of the supporting members (1) about their longitudinal axis the transversely extending network parts (3) are joined together in the region of the tire tread by connecting strands (11) which form holding-down means for the longitudinal edges of the supporting members (1).
    Type: Grant
    Filed: October 15, 1979
    Date of Patent: June 9, 1981
    Inventors: Dietmar H. Holzwarth, Hansjorg W. Rieger
  • Patent number: 4141774
    Abstract: A hot-melt adhesive composition containing a methoxymethylated terpolymer prepared from the corresponding terpolymer that is soluble in lower alcohols and contains a higher nylon salt or an .omega.-amino acid, or a lactam, each of which has more than 10 carbon atoms, and wherein the methoxymethylation ratio of the nylon copolymer is in the range of 10 to 30%.
    Type: Grant
    Filed: June 16, 1977
    Date of Patent: February 27, 1979
    Assignee: Daicel Ltd.
    Inventors: Ken Ando, Minoru Kamosaki, Yoshinobu Ohya, Sigeru Asai
  • Patent number: 3965277
    Abstract: A process for electrically interconnecting a group of integrated-circuit chips embedded in plastic is described. Multilayer conductors are plated in grooves photoformed in successively applied plastic layers and connected to the chip pads and to conductors on other layers through vias also photoformed in the plastic. Photoformation of wiring grooves and layer-interconnecting vias is accomplished by ultraviolet irradiation of photosensitized liquid polyester resin.
    Type: Grant
    Filed: February 28, 1974
    Date of Patent: June 22, 1976
    Assignee: Massachusetts Institute of Technology
    Inventors: Elis A. Guditz, Robert L. Burke