Patents Examined by Wiliam Krynski
  • Patent number: 6040068
    Abstract: A ceramic wiring board has a non-oxide based ceramic substrate which is a sintered body containing aluminum nitride, silicon nitride or the like as main component, and a metallized layer formed on the non-oxide based ceramic substrate; the metallized layer is plasma-etched, irregularities having a difference of elevation of about 0.5 to about 200 nm are formed on the surface of metal particles forming the metallized layer which are positioned on the surface of the metallized surface, and a metal plated layer is further formed on the metallized layer.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: March 21, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Taka-aki Yasumoto, Hideki Yamaguchi
  • Patent number: 5302436
    Abstract: A composition suitable for an ink-jet receptive layer comprising from about 1% to about 10% of at least one carboxylic acid having a pKa of from about 2 to about 6, said acid being selected from the group consisting of aryl monocarboxylic acids, aryloxy monocarboxylic acids, alkyl carboxylic acids having alkyl groups containing at least about 11 carbon atoms, dicarboxylic acids, tricarboxylic acids and pyridinium salts, and at least one liquid-absorbent polymer comprising from about 90% to about 99% aprotic constituents, and a transparent sheet suitable for making visual transparencies having a film backing having such ink-receptive layer coated on at least one major surface thereof.
    Type: Grant
    Filed: June 4, 1992
    Date of Patent: April 12, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Alan G. Miller