Abstract: A method for forming epitaxial grown silicon structure having substantially defect free outer surfaces and resulting structure is provided. A silicon substrate is provided, on which an epitaxial silicon crystal is grown. The outer surface layer of the silicon epitaxially grown silicon crystal will contain defective material which is removed by oxidation of the outer layer to silicon dioxide. This removes the defect containing outer layer, creating a new outer layer which is substantially defect free.
Type:
Grant
Filed:
October 23, 1987
Date of Patent:
July 19, 1988
Assignee:
International Business Machines Corporation
Inventors:
Klaus D. Beyer, Louis L. Hsu, Dominic J. Schepis, Victor J. Silvestri