Patents Examined by William H. Mayo, III
  • Patent number: 10709036
    Abstract: A dedicated airflow tunnel can extend directly from a front side of the chassis to a power supply unit (PSU) located near the rear side of the chassis. The dedicated airflow tunnel is removable and replaceable with airflow tunnels of different size. The dedicated airflow tunnel can avoid recirculation of PSU cooling air.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: July 7, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Shih-Hsuan Hu
  • Patent number: 10707597
    Abstract: An electrical contact device for a twin-axial electrical cable has a crimping section. In a crimped state on the twin-axial electrical cable, the crimping section is closed and has an oval cross-sectional shape in at least a portion of the crimping section.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: July 7, 2020
    Assignee: TE Connectivity Germany GmbH
    Inventors: Bert Bergner, Christian Mandel, Uwe Bluemmel, Rajesh Kumar
  • Patent number: 10699825
    Abstract: Provided are a core electric wire for multi-core cable that is superior in flex resistance at low temperature, and a multi-core cable employing the same. A core electric wire for multi-core cable according to an aspect of the present invention comprises a conductor obtained by twisting element wires, and an insulating layer that covers an outer periphery of the conductor, in which, in a transverse cross section of the conductor, a percentage of an area occupied by void regions among the element wires is from 5% to 20%. An average area of the conductor in the transverse cross section is preferably from 1.0 mm2 to 3.0 mm2. An average diameter of the element wires in the conductor is preferably from 40 ?m to 100 ?m, and the number of the element wires is preferably from 196 to 2,450. The conductor is preferably obtained by twisting stranded element wires obtained by twisting subsets of element wires.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: June 30, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shigeyuki Tanaka, Shinya Nishikawa, Hiroyuki Okawa, Takaya Kohori, Yuhei Mayama, Takayuki Hirai
  • Patent number: 10701809
    Abstract: A flexible printed circuit board that can reduce detachment when a flexible printed circuit board is attached to a display panel, and reduce a work cost, and simplify process, and reduce a tearing of the flexible printed circuit board due to a stress concentrated on a specific area of the flexible printed circuit board, and a display apparatus including the same. The flexible printed circuit board includes a base film having a notch at one side, on at least one side, and a plurality of rows of impact absorbing parts spaced apart from each other along the edge of the notch. The impact absorbing part provides a pattern layer one surface or both surfaces of the base film or a pattern hole of penetrating through the base film.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: June 30, 2020
    Assignee: LG Display Co., Ltd.
    Inventor: Changseok Oh
  • Patent number: 10681838
    Abstract: An electrical enclosure with a great heat dissipation and an ingress protection rating equal or greater than level 65, including a sealed enclosure housing and a heat bridge configured inside the sealed enclosure housing. The sealed enclosure housing includes a heat-absorbing layer, a reinforced layer and a heat dissipating layer. The heat bridge can be a gaseous heat bridge or a solid heat bridge. One end of the heat bridge is connected to the heat-emitting electrical components configured inside the sealed enclosure, and the other end is connected to the heat-absorbing layer on the sealed enclosure housing. The generated heat is rapidly conducted to the heat-absorbing layer on the enclosure housing through the heat bridge, and then conducted to the heat dissipation layer through the reinforced layer. The heat is dissipated to the exterior space through such structure to keep a suitable temperature inside the sealed enclosure.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: June 9, 2020
    Inventors: Qinghong Chen, Dongdong Chen
  • Patent number: 10679768
    Abstract: A cable having one or more conductors surrounded by at least an inner semiconductive layer, an insulation layer and an outer semiconductive layer, in that order, wherein the insulation layer is not crosslinked and has at least 90 wt % of a polymer composition, said polymer composition having: (I) 85.0 to 99.5 wt % of an LDPE; and (II) 0.5 to 15.0 wt % of an HDPE having a density of at least 940 kg/m3 or 1.5 to 15.0 wt % of an ultra-high molecular weight polyethylene having a Mw of at least 1,000,000.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: June 9, 2020
    Assignee: BOREALIS AG
    Inventors: Per-Ola Hagstrand, Villgot Englund, Thomas Gkourmpis, Mattias Andersson, Jonna Hynynen, Christian Müller
  • Patent number: 10674640
    Abstract: An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: June 2, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chao-Li Kao, Jin-Zhong Huang, Yi-Ping Hsieh, Chang-Ye Li
  • Patent number: 10674606
    Abstract: A display panel used for coupling to another display panel in a side by side manner is disclosed, which includes: a first substrate, including a first hole, a first surface and a second surface opposite to the first surface; a first conductive layer disposed on the first surface of the first substrate; a first circuit layer disposed on the second surface of the first substrate; a first connecting element disposed in the first hole and connecting the first conductive layer and the first circuit layer; and a first sealing layer disposed on the first conductive layer, wherein the first hole at least partially overlaps the first sealing layer. In addition, a display device comprising two display panels disposed adjacent to each other is also disclosed.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 2, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: Jui-Jen Yueh, Kuan-Feng Lee
  • Patent number: 10674605
    Abstract: A display device according to an exemplary embodiment includes: a substrate including a display region configured to display an image, and a pad region positioned around the display region; and a first pad unit positioned on the pad region, wherein the first pad unit includes a first terminal region including a plurality of first pad terminals arranged in a first pattern, and a second terminal region including a plurality of second pad terminals arranged in a second pattern different from the first pattern.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 2, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Byoung Yong Kim, Jong Hyuk Lee, Jeong Ho Hwang
  • Patent number: 10674602
    Abstract: A display unit includes a display section having flexibility, and a bending control section configured to limit a movable shaft in bending the display section to one direction in a display surface and allowed to maintain the display section in an arbitrary bending state.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: June 2, 2020
    Assignee: SONY CORPORATION
    Inventor: Gen Yukawa
  • Patent number: 10672713
    Abstract: Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: June 2, 2020
    Assignee: Intel Corporation
    Inventors: Mihir K Roy, Stefanie M Lotz, Wei-Lun Kane Jen
  • Patent number: 10672533
    Abstract: An example cable assembly includes: a plurality of conductors in a Litz cable arrangement; a layer of magnet wire insulation over the Litz cable arrangement; an inner silicone dielectric jacket over the layer of magnet wire insulation; and an outer silicone jacket over the inner silicone dielectric jacket.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: June 2, 2020
    Assignee: Illinois Tool Works Inc.
    Inventor: Paul Verhagen
  • Patent number: 10667423
    Abstract: A connector cooling and status indication system includes a connector chassis that defines a connector aperture, an airflow aperture located adjacent the connector aperture, and a status indicator aperture that is located adjacent the connector aperture. A connector subsystem includes a connector that is located immediately adjacent the connector aperture, and a heat dissipation device extends from the connector subsystem and defines at least one heat dissipation device channel that is configured to channel an airflow received via the airflow aperture. A status indicator subsystem includes a light emitting element that is located immediately adjacent the status indicator aperture, and is positioned adjacent the connector subsystem such that no portion of the status indicator subsystem impedes the airflow that is received via the airflow aperture and channeled by the at least one heat dissipation device channel.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: May 26, 2020
    Assignee: Dell Products L.P.
    Inventors: Michael Morihata, Joanne Cuijuan Zhang, Kaixuan Hu
  • Patent number: 10665368
    Abstract: A cable support for receiving and supporting a cable that includes a plurality of conductors extending along the length of the cable and arranged along the width of the cable, includes: a cane-shaped base having a substantially straight base portion and a curved base portion. The cane-shaped base includes a cable-side major surface and an opposing back-side major surface. At least a first portion of the back-side major surface in the curved base portion faces a second portion of the back-side major surface in the straight base portion. A plurality of discrete spaced apart side walls are disposed on the cable-side major surface along each longitudinal edge of the cane-shaped base. At least one side wall is disposed on the straight base portion and at least one side wall is disposed on the curved base portion.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: May 26, 2020
    Assignee: 3M Innovative Properties Company
    Inventor: Dennis L. Doye
  • Patent number: 10665365
    Abstract: A low voltage electric power cable includes at least two insulated conductors arranged together in a bundle, at least one foil extending around the bundle, and an outer sheath extending around the at least one foil. A recess is formed between two insulated conductors. The low voltage electric power cable includes an elongated member, the elongated member being arranged between the at least one foil and the outer sheath, and extending adjacent to the at least one foil along the recess. The elongated member is arranged with a clearance fit underneath the outer sheath.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 26, 2020
    Assignee: NKT Cables Group A/S
    Inventors: Anders Jonas Gatu, Jan Roger Erikers
  • Patent number: 10665966
    Abstract: A cable splice includes a casing having a central portion and a first end including a first aperture. The casing defines an interior cavity. A guide assembly extends through the first opening into the interior cavity. A first clamp member is positioned in the interior cavity and moveable between a loading position and a terminated position. A first biasing member biases the first clamp member toward the terminated position. A carrier is positioned in the interior cavity between the first biasing member and the central region. A second clamp member is positioned in the carrier and moveable with respect to the carrier.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: May 26, 2020
    Assignee: Hubbell Incorporated
    Inventors: Seydou Diop, Paul Zelazny, Dirk Byerman
  • Patent number: 10658092
    Abstract: An electric wire conductor having both flexibility and a space-saving property, a covered electric wire, and a wiring harness containing such an electric wire conductor. The electric wire conductor contains a plurality of elemental wires, and has a flat portion in which a cross-section intersecting an axial direction of the wire strand has a flat shape. In the cross-section of the flat portion, a vacancy ratio defined as a ratio of vacancies not occupied by the elemental wires is 17% or higher. Further, a covered electric wire contains the electric wire conductor and an insulator covering the electric wire conductor. Furthermore, a wiring harness contains the covered electric wire.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: May 19, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hayato Ooi, Yasuyuki Otsuka, Kinji Taguchi, Toru Tanji
  • Patent number: 10650942
    Abstract: A post-fitting shield member to be post-fitted with an electric wire is a plated fiber bundle wound in coil form and formed by performing metal plating on a high-strength fiber member. A manufacturing method of a shielded wire includes an insertion step of inserting an electric wire into the post-fitting shield member having a coil shape; a first fixing step of fixing one end portion of the post-fitting shield member into which the electric wire was inserted in the insertion step; an expansion step of expanding the post-fitting shield member that was fixed in the first fixing step toward the side of its other end portion; and a second fixing step of fixing the other end portion of the post-fitting shield member that was expanded in the expansion step.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: May 12, 2020
    Assignee: Yazaki Corporation
    Inventors: Yutaka Handa, Hiroki Kondo, Satoko Hongo
  • Patent number: 10651637
    Abstract: An electrical isolator includes a flexible non-electrically conductive membrane and an inelastic flexible dielectric member journalled in the membrane and extending from the first end of the membrane to the second end of the membrane. First and second couplings are mounted to the ends of the dielectric member. The ends of the membrane are mated in sealed engagement with the couplings so as to fluidically seal the ends of the membrane and the dielectric member within the membrane. The membrane is filled with a dielectric fluid so as to displace any air in the membrane and the dielectric member. The couplings are adapted to couple to objects at opposite ends of the electrical isolator.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: May 12, 2020
    Assignee: Quanta Associates, L.P.
    Inventors: David Karl Wabnegger, Robert Wayne Palmer, Jody Milton Greer, Daniel Neil O'Connell, Raymond Henry Jodoin, Ian Edward Trip, Michael Howard Boudreau
  • Patent number: 10652377
    Abstract: The electronic assembly may include a flexible circuit board, a sensor, and a receiver. The flexible circuit board may include a first face and a second face opposite to the first face. The sensor may be disposed on the first face of the flexible circuit board and electrically connected to the flexible circuit board. The receiver may be disposed on the second face of the flexible circuit board. A sound channel for the receiver may be communicated to outside bypassing the flexible circuit board or through the flexible circuit board.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 12, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Xiangkun Xie