Patents Examined by Wojciech Haske
  • Patent number: 11976378
    Abstract: The present invention discloses a device and method for preventing copper plating of a conductor roll in the technical field of manufacturing of copper electroplating films. A conductor roll and an electroplating anode are respectively connected to the negative output end and the positive output end of a first power source, the conductor roll and the electroplating anode electroplate a plating product flowing through plating pool bath after being electrified, and the conductor roll is connected to the positive output end of a second power source and mated with an auxiliary electrode connected to the negative output end of the second power source to realize the electrolysis of the conductor roll so that the conductor roll avoids copper deposition when electroplating the plating product.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: May 7, 2024
    Assignee: Chongqing JIMAT New Material Technology Co., Ltd.
    Inventors: Shiwei Zang, Wenqing Liu
  • Patent number: 11965257
    Abstract: A method for preparing a COF-protected electrode and an electrode are provided. The method includes mixing an organic framework, a small molecular organic acid and a solvent, adding a polar aqueous solution containing a substrate thereto, mixing the above uniformly and heating the system at a low temperature under an inert atmosphere, filtering the solution to obtain precipitates, washing and drying the precipitates to obtain a COF film grown on a surface of the substrate; coating a protective layer on the COF film to obtain a substrate/COF/protective layer film; etching off the substrate to obtain a COF/protective layer film; and transferring the COF/protective layer film to a surface of the electrode, and removing the protective layer.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: April 23, 2024
    Assignee: Huaneng Clean Energy Research Institute
    Inventors: Chang Zhang, Jinyi Wang, Zhibo Ren, Pengjie Wang, Xianming Xu, Huan Zhang
  • Patent number: 11965254
    Abstract: The present invention relates to a manufacturing apparatus and method for customizing a H2/CO synthetic gas in a desired ratio by producing a synthetic gas in which H2 and CO are mixed through hydrolysis of both carbon dioxide and a nitrogen compound with low power. In a low-power electrochemical apparatus for producing a synthetic gas according to the present invention, by performing the reduction of the carbon dioxide at the cathode and the oxidation of the nitrogen compound at the anode at the same time, carbon dioxide conversion efficiency may be improved 30% or more compared to the conventional carbon dioxide conversion system, and a synthetic gas with a desired H2/CO ratio may be produced by controlling the H2/CO ratio of the produced synthetic gas, and by reducing a driving voltage, the corrosion problem of electrode materials may be inhibited and the durability of electrodes may be increased.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: April 23, 2024
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jaeyoung Lee, Minjun Choi, Jin Won Kim, Sungyool Bong, Youjin Lee, Sunki Chung
  • Patent number: 11946153
    Abstract: A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: April 2, 2024
    Assignee: ISHIHARA CHEMICAL CO., LTD.
    Inventors: Masaru Hatabe, Hironori Murakami, Fuka Yamaoka
  • Patent number: 11932959
    Abstract: This application provides a copper plating solution for a composite current collector, including a leveling agent represented by a general formula (1) where an anion X is F?, Cl?, or Br?; R1, R2, and R3 are each independently selected from O or S; and R4, R5, and R6 are each independently selected from hydrogen, a substituted or unsubstituted alkyl, a substituted or unsubstituted vinyl, a substituted or unsubstituted aryl, and a substituted or unsubstituted heteroaryl.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: March 19, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Jia Peng, Mingling Li, Xin Liu, Qisen Huang
  • Patent number: 11926914
    Abstract: Provided is a tungsten electrode for molten salt electrolysis for rare earth metals preparation, including an open tungsten shell and a copper alloy body; wherein the copper alloy body is arranged inside the open tungsten shell; a tungsten buffer layer is provided between a side wall of the copper alloy body and the open tungsten shell; and a bottom of the copper alloy body is in contact with an inner bottom of the open tungsten shell.
    Type: Grant
    Filed: August 28, 2023
    Date of Patent: March 12, 2024
    Assignee: Ganzhou Chenguang Rare Earths New Material Co., Ltd.
    Inventors: Shaohua Yang, Zhenhong Cui, Hui Li, Senlin Ouyang, Yao Xie, Fangsong He, Guangdong Wu, Kangwei Xie
  • Patent number: 11912590
    Abstract: A redox-active compound is disclosed that is the reaction product of an electron-withdrawing monomer, a cross-linker, and a redox-active moiety. The cross-linker may be connected to the redox-active moiety through the electron-withdrawing functional group. The redox-active compound has a reduced form and an oxidized form and neither the reduced form nor the oxidized form is decomposed by oxygen. The redox-active compound may be used to create a pH gradient in a fluid stream. A redox-active composition may include the redox-active compound, a binder, and a current collector. The redox-active composition may be part of a membraneless electrochemical cell.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 27, 2024
    Assignee: XEROX CORPORATION
    Inventor: Eugene S. Beh
  • Patent number: 11905614
    Abstract: A terminal material having a base material in which at least a surface is made of Cu or Cu alloy; an Ni layer with at thickness of 0.1 ?m to 1.0 ?m inclusive on the base material; a Cu—Sn intermetallic compound layer with a thickness of 0.2 ?m to 2.5 ?m inclusive on the Ni layer; and an Sn layer with a thickness of 0.5 ?m to 3.0 ?m inclusive on the Cu—Sn intermetallic compound layer, when cross sections of the Cu—Sn intermetallic compound layer and the Sn layer are analyzed by the EBSD method with a measuring step 0.1 ?m and a boundary in which misorientation between adjacent pixels is 2° or more is deemed to be a crystal boundary, an average crystal grain size Dc of the Cu—Sn intermetallic compound layer is 0.5 ?m or more, and a grain size ratio Ds/Dc is five or less.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 20, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Miyashima, Kazunari Maki, Shinichi Funaki, Seiichi Ishikawa
  • Patent number: 11905612
    Abstract: In a plating method for mounting a tubular workpiece having openings at both ends in an axial direction thereof on a power feeding clip and immersing the tubular workpiece in a circulated plating solution to plate the tubular workpiece, the mounting of the tubular workpiece on the power feeding clip is performed by inserting the power feeding clip into the tubular workpiece from one of the openings of the tubular workpiece. The power feeding clip is configured by a folded metal plate, and includes a plurality of elastic contact pieces that can elastically contact the inner surface of the tubular workpiece to hold the tubular workpiece and supply power to the tubular workpiece, and a restraining part that is located inside the tubular workpiece and restrains flow of the plating solution in the axial direction.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: February 20, 2024
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventors: Takeharu Naito, Osamu Hashiguchi, Yumiko Kobori, Akifumi Nakamura, Yosuke Honda, Masanori Takahashi
  • Patent number: 11905607
    Abstract: The present disclosure provides a pure-H2O-fed membrane-electrode assembly (MEA) electrolysis system for electrocatalytic CO2 reduction (ECO2R) to ethylene (C2H4) and C2+ compounds under an industrial applicable continuous flow condition with at least 1000-hour lifetime, and fabrication method thereof.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: February 20, 2024
    Assignee: THE HONG KONG POLYTECHNIC UNIVERSITY
    Inventors: Xiaojie She, Shu-Ping Lau
  • Patent number: 11898265
    Abstract: Disclosed is a method for preparing a carbon material, comprising applying a voltage to an electrically conductive medium to form an electrically conductive path in an oxygen-free environment containing a carbon source and a catalyst to obtain the carbon material, wherein the electrically conductive medium includes a solid substrate or a liquid-phase electrically conductive system; under the condition that the electrically conductive medium is the liquid-phase electrically conductive system, the carbon material is obtained in the liquid-phase electrically conductive system; and under the condition that the electrically conductive medium is the solid substrate, the carbon material is obtained on a surface of the solid substrate.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: February 13, 2024
    Assignee: Qingdao University of Science & Technology
    Inventors: Yan He, Dianming Chu, Wenjuan Bai, Qianpeng Dong
  • Patent number: 11901659
    Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: February 13, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshie Tarutani, Kenji Kubota
  • Patent number: 11898259
    Abstract: The present invention is related to the electrochemical conversion of CO2 and provides the use of Gas Diffusion Electrode with an aprotic solvent in such conversion of CO2 as well as an electrochemical cell for use in such conversion. The application and electrochemical cell as herein provided are particularly useful in the conversion of CO2 into oxalate/oxalic acid.
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: February 13, 2024
    Assignee: Vito NV
    Inventors: Maximilian Konig, Metin Bulut, Jan Vaes, Elias Klemm, Deepak Pant
  • Patent number: 11879181
    Abstract: Provided is an electroplating solution of tin or a tin alloy in which the thickness variation of wafer bumps is maintained at a low level even in various changes of plating conditions and thus the mass productivity is improved. The electroplating solution of tin or a tin alloy may include tin ions as metal ions, a conductive salt, a carboxylic acid as a structure refiner, and a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: January 23, 2024
    Assignee: HOJIN PLATECH CO., LTD.
    Inventors: Woon Suk Jung, Jong Uk Kim, Jin Gyu Lee
  • Patent number: 11879182
    Abstract: The tin alloy plating solution of the present invention includes (A) a soluble salt including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) an alkane sulfonic acid including 9 to 18 carbon atoms in a molecule or a salt thereof, (D) a non-ionic surfactant including one or more phenyl groups in a molecule, and (E) a leveling agent.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: January 23, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventor: Koji Tatsumi
  • Patent number: 11873568
    Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: January 16, 2024
    Assignee: MacDermid Enthone Inc.
    Inventors: Kyle M. Whitten, Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar
  • Patent number: 11873566
    Abstract: A method of electrochemical reduction of CO2 includes the use of a catalyst of Cu/Cu2O particles including Cu/Cu2O interfaces. The catalyst may be included in an electrochemical cell for the conversion of CO2 to value-added products. The electrochemical cell may include an anode, a cathode including the Cu/Cu2O particles including Cu/Cu2O interfaces, and an aqueous medium containing CO2 or CO3?2. The CO2 or CO3?2 is reduced by contacting the Cu/Cu2O particles with the aqueous medium while supplying electricity to the cell. The conversion of CO2 by the electrochemical reduction thereof has higher Faradaic Efficiency due to the Cu/Cu2O interfaces in the Cu/Cu2O particles.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: January 16, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Gugang Chen, Yi Rao, Xia Li
  • Patent number: 11866839
    Abstract: A process for making a carbon nanotube structure includes forming a composite by depositing or growing carbon nanotubes onto a metal substrate, and infusing the carbon nanotubes. In other aspects, a method of making a wire, includes coating carbon nanotubes on a wire, and electroplating the carbon nanotubes. In still other aspects, a method of making a conductor includes growing or depositing vertically aligned carbon nanotubes on a sheet. Yet still, a method of making a cable includes forming multiple composite wires, each composite wire formed by depositing or growing carbon nanotubes onto a metal substrate, and performing a metal infusion of the carbon nanotubes. The method also comprises combining multiple finished composite wires or objects to make large cables or straps.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: January 9, 2024
    Inventors: Paul Kladitis, Brian Rice, Lingchuan Li
  • Patent number: 11846036
    Abstract: The present invention relates to an electrolyte and to a method for the electrolytic deposition of silver coatings and silver alloy coatings. The electrolyte according to the invention is cyanide-free, storage-stable and ensures the deposition of high-gloss, brilliant and white silver and silver alloy layers for technical and decorative applications.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: December 19, 2023
    Assignee: Umicore Galvanotechnik GmbH
    Inventors: Sascha Berger, Klaus Bronder, Mario Tomazzoni, Uwe Manz
  • Patent number: 11840771
    Abstract: Described herein is an aqueous composition including tin ions and at least one compound of formula I wherein X1 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O or S or a C5 to C12 aromatic moiety, R11 is a copolymer of ethylene oxide and a further C3 to C6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R11 is selected from H, R11, R40, R13, R14 are (a) independently selected from H, R11, R40, or (b) may together form a divalent group X13; X13 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O, S or NR43; R40 is H or a linear or branched C1-C20 alkyl, R43 is selected from H, R11 and a linear or branched C1-C20 alkyl.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: December 12, 2023
    Assignee: BASF SE
    Inventors: Alexander Fluegel, Marco Arnold, Nadine Engelhardt, Marcel Patrik Kienle