Patents Examined by Wyrozebski-Lee Kat
  • Solvent-free applicable heat-curing coating material
    Patent number: 6319973
    Abstract: Solvent-free applicable curable coating material containing as binder inorganic polymers and/or organic polymers, cross-linkers and sliding aids.
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: November 20, 2001
    Assignee: Dana Corporation
    Inventors: Markus Lemm, Kai Lemke, Dieter Grafl