Abstract: A ring type wearable terminal includes: a first ring that has a recessed portion formed on a side surface thereof; a second ring that is bonded to the first ring and that covers the recessed portion; and a communication unit that is housed in the recessed portion. The recessed portion is filled with an adhesive agent. The adhesive agent filling the recessed portion bonds the first ring and the second ring and also fixes the communication unit to the recessed portion so as to protect the communication unit. This allows the strength of the ring type wearable terminal to be improved.
Abstract: A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall.
Abstract: An electronic device includes a printed circuit board (PCB), at least one socket mounted to the PCB, at least one connector inserted into the at least one socket, a first member mounted to the PCB, a second member mounted to the PCB, and a first cover. The first cover covers and presses against the at least one connector, the first cover includes a first end for being fixed to the first member and a second end opposite to the first end for being fixed to the second member. At least one of the first member and the second member is soldered to the PCB, and a soldered area of the at least one of the first member and the second member is larger than a predetermined value.
Type:
Grant
Filed:
June 28, 2012
Date of Patent:
September 30, 2014
Assignees:
Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.