Abstract: A metal band as an inlay for trim strips or sealing strips or as edge protection, in particular for motor vehicles or switch cabinets, said metal band being provided with cut and/or punched apertures, wherein the metal band consists of microalloyed steel or multiphase steel.

Abstract: A copper powder containing copper particles, wherein the copper powder has a packed bulk density of 1.30 g/cm3 to 2.96 g/cm3, and wherein a 50% particle diameter D50 when a cumulative frequency is 50% in a volume-based particle diameter histogram of the copper particles, and a crystallite diameter D determined from a diffraction peak of a Cu (111) plane in an X-ray diffraction profile obtained by powder X-ray diffractometry of the copper powder using Scherrer's formula satisfies D/D50?0.060.

Abstract: Niobium alloy powder that is highly spherical is described. The niobium alloy powder can be useful in additive manufacturing and other uses. Methods to make the niobium alloy powder are further described as well as methods to utilize the niobium alloy powder in additive manufacturing processes. Resulting products and articles using the niobium alloy powder are further described.

Abstract: The present invention provides an annealing separator composition, a grain-oriented electrical steel sheet and a method for manufacturing a grain-oriented electrical steel sheet. An annealing separator composition for a grain-oriented electrical steel sheet according to an embodiment of present invention comprising: on the basis of total solid 100 wt %, 5 to 70 wt % of mullite; and the remainder being magnesium oxide or magnesium hydroxide.

Abstract: The present invention relates to a resistor including a Ni-based alloy that consists of 15.0 mass %?Cr?25.0 mass %, 1.0 mass %?Al?4.0 mass %, 1.0 mass %?Cu?3.0 mass %, 0 mass %?Si?1.5 mass %, and 0 mass %?Mn?1.5 mass %, with the balance being Ni and inevitable impurities, in which the resistor has a Vickers hardness at 20° C. of 160 Hv or more and 230 Hv or less, a volume resistivity at 20° C. of 125 ??·cm or more and 150 ??·cm or less, and a temperature coefficient of resistance at 20° C. to 155° C. of ?50 ppm/° C. or more and 10 ppm/° C. or less, and relates to a manufacturing method thereof.

Abstract: Low iron loss and high magnetic flux density in a Si-gradient magnetic material are achieved. A non-oriented electrical steel sheet is a multilayer electrical steel sheet comprising of an inner layer and a surface layer located on each of both sides of the inner layer, wherein the surface layer and the inner layer have predetermined chemical compositions, ?Si defined as a difference in Si content between the surface layer and the inner layer is 0.1 mass % to 0.5 mass %, a ratio t1/t of a total thickness t1 of both surface layers to a sheet thickness t is 0.04 to 0.78, a ratio B50/Bs is 0.825 or more, and iron loss W10/800 and the sheet thickness t satisfy W10/800?13+80×t.

Abstract: A component formed of a refractory metal has a surface that is at least partially coated with a layer of titanium diboride. There is also described a method of manufacturing the component and the application of TiB2 as a release agent in high-temperature applications.

Abstract: An active metal brazing substrate and a method for manufacturing the same are provided. The active metal brazing substrate includes a ceramic substrate layer, an active metal layer, and a conductive metal layer. The active metal layer is disposed between the ceramic substrate layer and the conductive metal layer. The active metal layer is formed from an active metal solder and an organic dispersion medium. The active metal solder includes silver, copper, and an active metal. Based on a total weight of the active metal solder being 100 wt %, an amount of the silver ranges from 10 wt % to 60 wt %. A peel strength between the ceramic substrate layer and the conductive metal layer ranges from 165 N/cm to 270 N/cm.

Abstract: There is provided a laminate that improves the electromagnetic wave shielding effect in a low frequency region. A laminate includes at least one non-magnetic metal layer and at least one magnetic metal layer, wherein the at least one magnetic metal layer contains an amorphous phase.

Abstract: A metal-ceramic substrate which has a highly stable bond between the metal layer and the ceramic body, and also high thermal conductivity and electrical conductivity. The metal-ceramic substrate comprises (a) a ceramic body, (b) a metal layer, and (c) a bonding layer located between the ceramic body and the metal layer. The bonding layer comprises (i) a metal M1 having a melting point of at least 700° C., (ii) a metal M2 having a melting point of less than 700° C., (iii) a metal M3 selected from the group of active metals, and (iv) a metal M4 selected from the group consisting of bismuth, gallium, zinc, indium, germanium, aluminum and magnesium. The bonding layer has the following characteristics: (c1) M(M2)EDX=10-20 weight percent, (c2) 15 weight percent?[M(M4)/M(M2)]ICP*1000 weight percent+M(M2)EDX?100 weight percent and (c3) M(Ag)EDX<10 weight percent.

Abstract: A SiC ingot includes a seed crystal and a single crystal grown on the seed crystal, wherein the single crystal has therein a micropipe passing through the single crystal in a growth direction, and when photoluminescence observation is performed on a plurality of wafers cut out from the single crystal in a direction intersecting the growth direction, an S/N ratio of the micropipe in a first wafer cut out of the plurality of wafers, which is closest to the seed crystal, is higher than an S/N ratio of the micropipe in a second wafer cut out from a position further away from the seed crystal than the first wafer.

Abstract: A surface-coated metal porous body having a three-dimensional network structure, the surface-coated metal porous body including: a framework forming the three-dimensional network structure; and a coating film provided on a surface of the framework, wherein the framework has a body including a metal element as a constituent element, the coating film includes a scale-like carbon material and a fine-grained conductive material, a distance D between two points that are farthest from each other on an outer perimeter of a main surface of the scale-like carbon material is 5% or more and 120% or less relative to a thickness of the framework, and the scale-like carbon material is deposited on the surface of the framework.

Abstract: This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.

Abstract: In an exemplary embodiment of the present invention: A series of U-shaped nickel-iron components are plated onto a rough or roughened semiconductor package or printed circuit board material. The horizontal base of the U-shaped component has a surface roughness of the semiconductor package material. The vertical surfaces of the U-shape have a surface roughness derived from the dry film. The large smooth vertical surface allows the U-shaped nickel-iron components to have a low average roughness. The lowered average roughness reduces the path length the U-shaped nickel-iron components provide for magnetic flux while the roughness of the horizontal portion of the U-shape allows for increased mechanical bonding to occur.

Abstract: A hot stamping component according to an embodiment of the present disclosure includes a steel sheet, a plating layer located on the steel sheet and including Zn, and a surface layer located on the plating layer, wherein the surface layer includes a post-treatment layer including an Si-based inorganic post-treatment agent, a Zn oxide layer located on a same layer as the post-treatment layer on the plating layer, and an inter-diffusion layer located between the plating layer and at least one of the post-treatment layer and the Zn oxide layer to overlap at least one of the post-treatment layer and the Zn oxide layer, the inter-diffusion layer including at least one of Si, Mn, O, Fe, Zn, and SiO, wherein a tensile strength of the steel sheet is 1680 MPa or more.

Abstract: A method for manufacturing an electrical device that includes: anodizing a portion of an anodizable metal layer so as to obtain an anodic porous oxide region and an anodizable metal region adjoining the anodic porous oxide region, the anodic porous oxide region being thicker than the anodizable metal region; depositing a layer of liner material on the anodic porous oxide region and on the anodizable metal region; depositing a layer of filler material on the layer of liner material to obtain a stacked structure having a top surface; planarizing the stacked structure from a top surface thereof until reaching the layer of the liner material, so as to expose a portion of liner material located above at least a portion of the anodic porous oxide region; and removing the exposed portion of liner material.

Abstract: Provided is a hot stamped body having a chemical composition comprising, by mass %, C: 0.40 to 0.70%, P: 0.100% or less, S: 0.0100% or less, N: 0.0200% or less, O: 0.0200% or less, Al: 0.0010 to 0.500%, Nb: 0.0010 to 0.100%, Ti: 0.010 to 0.200%, Mo: 0.010 to 2.000%, B: 0.0005 to 0.0200%, etc., and balance of Fe and impurities, and a microstructure with a total amount of segregation of at least one of Mo, W, Ta, Re, Os, Ir, and Tc at prior austenite grain boundaries of 0.10 atm % or more.

Abstract: To provide a new tungsten-based thermal spray coating suitable as e.g. a component for plasma etching device using halogen gas, and a material for thermal spraying for obtaining the thermal spray coating. A thermal spray coating characterized by containing tungsten as a matrix phase and oxides containing silicon and boron as a dispersed phase, and a component for plasma etching device having such a thermal spray coating. A material for thermal spraying characterized by containing from 1 to 7 wt % of silicon, from 0.5 to 3 wt % of boron and the reminder being tungsten and unavoidable impurities, and a method for producing a thermal spray coating by thermally spraying the material for thermal spraying.

Abstract: Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following AlxCuyTiz, AlxFeyNiz, AlxMnyNiz, AlxNiyTiz, CuxFeyTiz, CuxNiyTiz, AlxFeySiz, AlxMnySiz, AlxNiySiz, NixSiyTiz, and CxFeySiz. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.

Abstract: A powder metal composition providing a powder metal material to be compacted, sintered, and heat treated to be comparable to wrought 6013 aluminum alloy. The powder metal composition includes an aluminum base powder metal, an aluminum-silicon powder metal, an aluminum-copper powder metal, and an elemental magnesium powder metal. A weight percent of silicon in the powder metal composition is in a range of 0.6 to 1.0 wt % of the powder metal composition, a weight percent of copper in the powder metal composition is in a range of 0.7 to 1.1 wt % of the powder metal composition, and a weight percent of magnesium in the powder metal composition is in a range of 0.8 to 1.2 wt % of the powder metal composition. This powder metal is compactable to form a green compact which is further sinterable and heat treatable to provide a powder metal composition comparable to wrought 6013 aluminum alloy.