Abstract: A SiC ingot includes a seed crystal and a single crystal grown on the seed crystal, wherein the single crystal has therein a micropipe passing through the single crystal in a growth direction, and when photoluminescence observation is performed on a plurality of wafers cut out from the single crystal in a direction intersecting the growth direction, an S/N ratio of the micropipe in a first wafer cut out of the plurality of wafers, which is closest to the seed crystal, is higher than an S/N ratio of the micropipe in a second wafer cut out from a position further away from the seed crystal than the first wafer.

Abstract: A surface-coated metal porous body having a three-dimensional network structure, the surface-coated metal porous body including: a framework forming the three-dimensional network structure; and a coating film provided on a surface of the framework, wherein the framework has a body including a metal element as a constituent element, the coating film includes a scale-like carbon material and a fine-grained conductive material, a distance D between two points that are farthest from each other on an outer perimeter of a main surface of the scale-like carbon material is 5% or more and 120% or less relative to a thickness of the framework, and the scale-like carbon material is deposited on the surface of the framework.

Abstract: This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one surface or both surfaces of the copper sheet (11), in which surfaces of the copper particles (12) are coated with copper nanoparticles (12a) having an average particle diameter smaller than an average particle diameter of the copper particles (12), the average particle diameter of the copper nanoparticles (12a) calculated from a BET value is 9.59 nm or more and 850 nm or less, and an average porosity of the preform layer (13) is 11% or more and 78% or less.

Abstract: In an exemplary embodiment of the present invention: A series of U-shaped nickel-iron components are plated onto a rough or roughened semiconductor package or printed circuit board material. The horizontal base of the U-shaped component has a surface roughness of the semiconductor package material. The vertical surfaces of the U-shape have a surface roughness derived from the dry film. The large smooth vertical surface allows the U-shaped nickel-iron components to have a low average roughness. The lowered average roughness reduces the path length the U-shaped nickel-iron components provide for magnetic flux while the roughness of the horizontal portion of the U-shape allows for increased mechanical bonding to occur.

Abstract: A hot stamping component according to an embodiment of the present disclosure includes a steel sheet, a plating layer located on the steel sheet and including Zn, and a surface layer located on the plating layer, wherein the surface layer includes a post-treatment layer including an Si-based inorganic post-treatment agent, a Zn oxide layer located on a same layer as the post-treatment layer on the plating layer, and an inter-diffusion layer located between the plating layer and at least one of the post-treatment layer and the Zn oxide layer to overlap at least one of the post-treatment layer and the Zn oxide layer, the inter-diffusion layer including at least one of Si, Mn, O, Fe, Zn, and SiO, wherein a tensile strength of the steel sheet is 1680 MPa or more.

Abstract: A method for manufacturing an electrical device that includes: anodizing a portion of an anodizable metal layer so as to obtain an anodic porous oxide region and an anodizable metal region adjoining the anodic porous oxide region, the anodic porous oxide region being thicker than the anodizable metal region; depositing a layer of liner material on the anodic porous oxide region and on the anodizable metal region; depositing a layer of filler material on the layer of liner material to obtain a stacked structure having a top surface; planarizing the stacked structure from a top surface thereof until reaching the layer of the liner material, so as to expose a portion of liner material located above at least a portion of the anodic porous oxide region; and removing the exposed portion of liner material.

Abstract: Provided is a hot stamped body having a chemical composition comprising, by mass %, C: 0.40 to 0.70%, P: 0.100% or less, S: 0.0100% or less, N: 0.0200% or less, O: 0.0200% or less, Al: 0.0010 to 0.500%, Nb: 0.0010 to 0.100%, Ti: 0.010 to 0.200%, Mo: 0.010 to 2.000%, B: 0.0005 to 0.0200%, etc., and balance of Fe and impurities, and a microstructure with a total amount of segregation of at least one of Mo, W, Ta, Re, Os, Ir, and Tc at prior austenite grain boundaries of 0.10 atm % or more.

Abstract: To provide a new tungsten-based thermal spray coating suitable as e.g. a component for plasma etching device using halogen gas, and a material for thermal spraying for obtaining the thermal spray coating. A thermal spray coating characterized by containing tungsten as a matrix phase and oxides containing silicon and boron as a dispersed phase, and a component for plasma etching device having such a thermal spray coating. A material for thermal spraying characterized by containing from 1 to 7 wt % of silicon, from 0.5 to 3 wt % of boron and the reminder being tungsten and unavoidable impurities, and a method for producing a thermal spray coating by thermally spraying the material for thermal spraying.

Abstract: Fuel cell alloy bipolar plates. The alloys may be used as a coating or bulk material. The alloys and metallic glasses may be particularly suitable for proton-exchange membrane fuel cells because of they may exhibit reduced weights and/or better corrosion resistance. The alloys may include any of the following AlxCuyTiz, AlxFeyNiz, AlxMnyNiz, AlxNiyTiz, CuxFeyTiz, CuxNiyTiz, AlxFeySiz, AlxMnySiz, AlxNiySiz, NixSiyTiz, and CxFeySiz. The alloys or metallic glass may be doped with various dopants to improve glass forming ability, mechanical strength, ductility, electrical or thermal conductivities, hydrophobicity, and/or corrosion resistance.

Abstract: A powder metal composition providing a powder metal material to be compacted, sintered, and heat treated to be comparable to wrought 6013 aluminum alloy. The powder metal composition includes an aluminum base powder metal, an aluminum-silicon powder metal, an aluminum-copper powder metal, and an elemental magnesium powder metal. A weight percent of silicon in the powder metal composition is in a range of 0.6 to 1.0 wt % of the powder metal composition, a weight percent of copper in the powder metal composition is in a range of 0.7 to 1.1 wt % of the powder metal composition, and a weight percent of magnesium in the powder metal composition is in a range of 0.8 to 1.2 wt % of the powder metal composition. This powder metal is compactable to form a green compact which is further sinterable and heat treatable to provide a powder metal composition comparable to wrought 6013 aluminum alloy.

Abstract: The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 ?m or more and 30 ?m or less, and a void ratio in an end portion region (E) of each of the copper members is 10% or less.

Abstract: A copper-diamond composite (30) according to the present invention includes a plurality of diamond particles (20) that are dispersed in a metal matrix (10) containing copper, in which when a particle size distribution of the diamond particles (20) is measured using an image particle size distribution analyzer, a number average of a sphericity distribution of the diamond particles (20) is 0.90 or more.

Abstract: An Al—Si coated press hardening component, wherein the Al—Si coating comprises a low-Al content ferrite layer with an Al content of less than 5 wt % and a thickness of greater than 5 ?m, and having a maximum bending angle of the Al—Si coated press hardening component is greater than 65°. The thickness of the tough low-Al content ferrite layer in the Al—Si coating after hot stamping, reaching 5-100 ?m, by improving the hot stamping process, so that the formation or propagation of cracks on the surface or the coating is effectively prevented, and the bendability of the pre-coated steel after hot stamping is improved. At the same time, the hot stamping process of the present invention can take into account or optimize the microstructure of the steel substrate to further improve the bendability and tensile property of the whole material.

Abstract: Methods of making composite articles wherein at least a portion of a hardsurface wear protection applied to a composite article includes matrix composite and hard elements with channels between the hard elements. A layered preform coating mat may be applied over a substrate of the composite article and then fused thereto to form channels between hard elements in the coating mat. The channels may extend over the entire outer surface of the composite article or only over a portion thereof. A hybrid layered preform coating mat may include a depressed section adapted for receiving a perforated braze preform inlay. When the coating mat is fused to the substrate, channels may be formed between the hard elements in the depressed section, but not in a non-depressed section.

Abstract: A metal matrix composite material and associated methods are disclosed. In one example, the metal matrix composite material includes ceramic particles distributed in multiple phases. In selected examples, the metal matrix composite material is formed by a process including applying a rotational force and an axial force to a feedstock at an interface and plasticizing a portion of the feedstock at the interface.

Abstract: Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface.

Abstract: Provided is a zinc foil including a core portion containing zinc as a base metal and containing substantially no bismuth and a cladding portion located on at least one side of the core portion and containing zinc as a base metal and containing bismuth, wherein the core portion and the cladding portion are inseparably bonded to each other. It is preferable that the average zinc crystal grain size in the core portion is larger than the average zinc crystal grain size in the cladding portion. It is also preferable that the average zinc crystal grain size in the cladding portion is 0.2 ?m or more and less than 24 ?m.

Abstract: The present disclosure is directed to systems, compositions, and methods for manufacturing objects with sharp edges having a high strength and hardness. To form the sharp edge, an object can be subjected to a compressive force that locally deforms the object to create the sharp edge. In some embodiments, deformation can occur by passing the material through a system of one or more opposed tapered rolls having one or more tapering angles for deforming the material. The tapered rolls can rotate and drive the material downstream to a next opposed pair of tapered rolls. The tapered rolls deform the material by changing the material microstructure, compressing the grains of the material in a predetermined location to create a more homogeneous microstructure. The local modification of the resulting microstructure increases the homogeneity as well as the hardness and strength of the material and prevents cracking and/or chipping of the material.

Abstract: An object of the present disclosure is to provide a composition for use in sintered molded bodies which does not impair the shape retention ability of a green molded body relying on the rigidity inherent to a polyacetal resin, has high fluidity, and is resistant to cracking or swelling during degreasing. The composition for use in sintered molded bodies contains a sinterable inorganic powder and an organic binder, the organic binder contains at least a polyacetal resin and a polyolefin resin, and the melt flow index of the polyacetal resin is 70 to 200 g/10 min.

Abstract: A load-bearing structure is disclosed and configured to, during operation of the structure, transfer load from a first part of the structure to a second part of the structure via a load path. The component includes a matrix material, a plurality of longitudinal first reinforcing elements embedded in the matrix material, and a plurality of longitudinal second reinforcing elements embedded in the matrix material. The long axis of each first reinforcing element is substantially aligned with a first direction and the long axis of each second reinforcing element is substantially aligned with a second direction, the second direction being substantially perpendicular to the first direction. The structure has a predefined crack-propagation region configured to control the propagation of a crack in the structure.