Patents Examined by Xiaobei Wang
  • Patent number: 12179543
    Abstract: A stabilizer is a stabilizer including: a main body cylinder portion which is elastically deformable and a pair of connection plate portions respectively connected to a pair of left and right suspension devices, wherein the connection plate portion includes a pair of base material portions located on both sides in the connection plate portion in a plate thickness direction T and an alloy oxide region which is disposed between the pair of base material portions and in which alloy oxides are scattered, and wherein crystal grains constituting the pair of base material portions straddle the alloy oxide region in the plate thickness direction and the pair of base material portions are joined.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: December 31, 2024
    Assignee: NHK SPRING CO., LTD.
    Inventors: Masato Inaba, Junichi Nakayama, Yuichiro Yamauchi
  • Patent number: 12173379
    Abstract: Disclosed are a non-oriented electrical steel sheet and a manufacturing method therefore, the sheet ensuring excellent magnetic characteristics by having increased texture intensity of surface (100) through strict control of the content ratio of Si, Al and the like and through final annealing heat treatment in an inert gas atmosphere.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: December 24, 2024
    Assignee: LG Electronics Inc.
    Inventors: Jin Bae Kim, Dongwon Kang, Joungwook Kim
  • Patent number: 12168818
    Abstract: A diffusion-bonded powder having an iron powder having 1-5%, preferably 1.5-4% and most preferably 1.5-3.5% by weight of copper particles diffusion bonded to the surfaces of the iron powder particles. The diffusion bonded powder is suitable for producing components having high sintered density and minimum variation in copper content. The iron powder may be produced by providing an atomized iron powder with an oxygen content of 0.3-1.2% by weight and with a carbon content of 0.1-0.5% by weight, and subjecting the atomized iron powder and a copper containing powder to a reduction annealing process in a reducing atmosphere to obtain the iron based powder.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: December 17, 2024
    Assignee: HÖGANÄS AB (PUBL)
    Inventors: Caroline Larsson, Ulf Engström, Christophe Szabo
  • Patent number: 12163245
    Abstract: A coated titanium material includes a titanium material and a coating film formed on a surface of the titanium material. A Ti-based oxide is included in an interface between the titanium material and the coating film. The Ti-based oxide is one or both rutile type TiO2 and Ti2O3. In a case where a cut surface of the coating film is formed by using a SAICAS method under conditions that a horizontal speed is 2 ?m/s and a vertical speed is 0.1 ?m/s, on the cut surface, an area percentage of the Ti-based oxide is 30.0% or more in a region having a distance of 15 ?m from a reference line specified on the basis of a boundary line, which is an intersection line between the cut surface and the interface, to a coating film side.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: December 10, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Kazuhiro Takahashi, Koji Akioka, Eiji Ikeda, Hideya Kaminaka
  • Patent number: 12157602
    Abstract: An aluminum can that has a maximum height of roughness Rz1 in the circumferential direction of not more than 0.5 ?m on the outer surface of the thinnest portion of the body portion and, as viewed on the side surface, has a ratio Ra1/Ra2 in a range of 0.8 to 1.2, the ratio Ra1/Ra2 being that of a mean surface roughness Ra1 in the circumferential direction on the outer surface of the thinnest portion of the body portion and a mean surface roughness Ra2 in the circumferential direction on the outer surface of the lower end portion of the body portion.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: December 3, 2024
    Assignees: TOYO SEIKAN CO., LTD., TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Norihisa Hirota, Ryozo Shiroishi, Takuho Kumagai, Kenichi Takao
  • Patent number: 12155142
    Abstract: A layered structure for forming charging terminals for high power applications. In some embodiments, the layered structure may include a substrate and a contact layer disposed over at least a portion of the substrate. The substrate may have a conductivity greater than 40% International Annealed Copper Standard (IACS). The contact layer may demonstrate a coefficient of friction of less than 1.4, such as from 0.1 to 1.4, as measured in accordance with American Society of Testing and Materials (ASTM) G99-17. The contact layer may include a precious-metal-based alloy, such as a silver-samarium alloy.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: November 26, 2024
    Assignee: Materion Corporation
    Inventors: Joseph G. Kaiser, Alejandro J. Lluberes
  • Patent number: 12150263
    Abstract: An electronic device is provided. The electronic device includes a housing that forms a portion of an outer surface of the electronic device and a display disposed in the housing and visually exposed through one side of the housing. The housing includes a first portion containing a metallic material, and the first portion includes a base material layer made of the metallic material, a first film layer that is disposed adjacent to a surface of the housing and that contains oxide of the metallic material, and a second film layer that is disposed between the base material layer and the first film layer and that contains oxide of the metallic material. The first film layer includes a first pore structure that extends in a direction substantially perpendicular to a surface of the first film layer, and the second film layer includes a second pore structure that is at least partially in fluid communication with the first pore structure and that extends in a radial shape toward the base material layer.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: November 19, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongsu Lee, Yoonhee Lee, Kiseok Kwon, Sungho Cho
  • Patent number: 12142864
    Abstract: An electrical contact element for a connector has a metallic base body and a wear layer applied to the base body. The wear layer consists of an alloy having the components 82-91% by weight nickel, 9-18% by weight phosphorous, and 0-1% by weight further alloy elements.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: November 12, 2024
    Assignee: ERNI INTERNATIONAL AG
    Inventor: Michael Burger
  • Patent number: 12134814
    Abstract: A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio SB/Ss of 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein Ss represents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112>orientation of 10° or less or a crystal orientation difference from the S2 {231}<124>orientation of 10° or less, and SB represents an area of a region having a crystal orientation difference from the Brass {011}<211>orientation of 10° or less.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: November 5, 2024
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Wanqing Jiang, Hiroshi Hyodo, Hisashi Suda, Akira Sugawara
  • Patent number: 12135059
    Abstract: A sliding member of the present invention includes a base material and a coating layer that is formed on the base material. The coating layer includes a particle aggregate that contains precipitation hardened copper alloy particles. The precipitation hardened copper alloy particles contain cobalt (Co) and silicon (Si). The sliding member has high coating strength and superior wear resistance.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: November 5, 2024
    Assignees: NISSAN MOTOR CO., LTD., FUKUDA METAL FOIL & POWDER CO., LTD.
    Inventors: Yoshinori Izawa, Junichi Arai, Katsunori Otobe, Shinichi Nishimura
  • Patent number: 12132847
    Abstract: The present invention provides a composite plate, a composite plate roughening device, and a method for manufacturing a composite plate, and relates to the technical field of metal plate materials. The composite plate includes a first plate and a second plate, wherein a first side surface of the first plate is provided with striations, the first side surface of the second plate and the first side surface of the first plate are rolled to connect, and the striations of which adjacent ones have a pitch of 0.005 mm to 0.03 mm account for more than 90% of all the striations.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: October 29, 2024
    Assignee: Jiangsu Kangrui New Material Technology Co., Ltd.
    Inventors: Wei Zhu, Zhong Zhang
  • Patent number: 12129569
    Abstract: A method for making a component for use in a semiconductor processing chamber is provided. A component body is formed from a conductive material having a coefficient of thermal expansion of less than 10.0×10?6/K. A metal oxide layer is then disposed over a surface of the component body.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: October 29, 2024
    Assignee: Lam Research Corporation
    Inventors: Lin Xu, David Joseph Wetzel, John Daugherty, Hong Shih, Satish Srinivasan, Yuanping Song, Johnny Pham, Yiwei Song, Christopher Kimball
  • Patent number: 12121839
    Abstract: A metallic filter (1) includes a microstructured architecture (2) defined in a three-dimensional space having orthogonal axes, microstructured architecture (2) includes a metallic network (10) formed by a plurality of longitudinal connecting strands (12), namely extending along a longitudinal axis direction (X), and a network (20) of pores formed of a plurality of longitudinal interstices (22) located along connecting strands (12). Each longitudinal interstice corresponding to a subset of pores (24) of the network (20) of pores. The subset of pores (24) for which the pores are aligned along the longitudinal axis (X), the longitudinal interstices (22) thereby defining an axis of anisotropy of the microstructured architecture.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: October 22, 2024
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Hicham Maskrot, Olivier Hercher, Frédéric Schuster, Alexandre Michau
  • Patent number: 12110446
    Abstract: The present invention relates to a composite material of a metal and a non-metal and a heat dissipation part composed of the composite material. More specifically, the present invention relates to a composite material including a structure in which diamond particles which have excellent thermal conductivity are dispersed in a metal matrix, and particularly, to a highly reliable composite material capable of maintaining excellent heat dissipation properties even in a use environment such as military, aviation, space, or the like to which severe thermal cycles are applied, and to a heat dissipation part including the composite material.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: October 8, 2024
    Assignee: THE GOODSYSTEM CORP.
    Inventors: Meoung-whan Cho, Seog-woo Lee, Young-suk Kim
  • Patent number: 12110576
    Abstract: Provided are a WC-based cemented carbide powder from which a WC-based cemented carbide member excellent in high thermal conductivity and high abrasion resistance can be manufactured, a WC-based cemented carbide member, and a manufacturing method for a WC-based cemented carbide member. The WC-based cemented carbide powder of the present invention includes WC, Cu, and at least one of Co, Fe, and Cr. The content of WC is equal to or more than 40 mass %, the content of at least one of Co, Fe, and Cr is equal to or more than 25 mass % and less than 60 mass %, and the ratio a/b of the content ‘a’ of Cu and the content ‘b’ of at least one of Co, Fe, and Cr satisfies 0.070?a/b?1.000.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: October 8, 2024
    Assignee: Proterial, Ltd.
    Inventors: Hiroshi Shiratori, Kazuya Shinagawa, Shuho Koseki, Kousuke Kuwabara, Yasuhiko Otsubo, Shinya Okamoto
  • Patent number: 12104230
    Abstract: A pressed powder material according to embodiments is a pressed powder material including first magnetic metal particles having a first magnetic metal phase containing Fe and Co; and second magnetic metal particles having a second magnetic metal phase containing Fe, in which when the amounts of Co with respect to the total amounts of Fe and Co of the first and second magnetic metal particles are designated as Co1 and Co2, respectively, the ratio of Co2 to Co1 (Co2/Co1) is from 0 to 0.5, the average value of the ratio of the major axis to the minor axis is 2 or greater for the first magnetic metal particles and 1 or greater for the second magnetic metal particles, the second magnetic metal particles are present between the particles of the first magnetic metal particles, and the average value of the major axis of the second magnetic metal particles is equal to or longer than the average value of the major axis of the first magnetic metal particles.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: October 1, 2024
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masaya Hagiwara, Tomohiro Suetsuna, Naoyuki Sanada, Hiroaki Kinouchi
  • Patent number: 12091730
    Abstract: A tantalum-titanium alloy powder that is highly spherical is described. The alloy powder can be useful in additive manufacturing and other uses. Methods to make the alloy powder are further described as well as methods to utilize the alloy powder in additive manufacturing processes. Resulting products and articles using the alloy powder are further described.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: September 17, 2024
    Assignee: GLOBAL ADVANCED METALS USA, INC.
    Inventors: Craig Sungail, Aamir Abid
  • Patent number: 12085991
    Abstract: The present application proposes a display panel and a display device. The display panel includes a panel body and a composite bending support layer, and the composite bending support layer includes a first metal layer and a second metal layer; wherein, the first metal layer, at least located in the bending area of the display panel, includes a damascene area located in the non-bending area; the second metal layer, located in the non-bending area of the display panel, fills the damascene area; the material hardness of the first metal layer is greater than the material hardness of the second metal layer.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: September 10, 2024
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Xia Chen
  • Patent number: 12077833
    Abstract: A metal strip is provided having a casting-wheel side that has been solidified on an outer surface of a heat sink, an opposing, air side and a microstructure. The microstructure is at least 80 vol. % amorphous or has at least 80 vol. % nanocrystalline grains and a residual amorphous matrix in which at least 80% of the nanocrystalline grains have an average grain size of less than 50 nm and a random orientation. The air side of the metal strip has a surface crystallisation proportion of less than 23%.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: September 3, 2024
    Assignee: VACUUMSCHMELZE GMBH & CO. KG
    Inventor: Mie Marsilius
  • Patent number: 12070801
    Abstract: A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: August 27, 2024
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Kei Anai, Jung-Lae Jo