Patents Examined by Xiaoling Chen
  • Patent number: 10299376
    Abstract: A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle and a surface insulating layer covering the metal particle and containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: May 21, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Hidefumi Nakamura, Taku Kawasaki
  • Patent number: 8809696
    Abstract: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 ?m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: August 19, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tomoaki Yamashita, Sumiko Nakajima, Sadao Itou, Fumio Inoue, Shigeharu Arike
  • Patent number: 7570494
    Abstract: A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: August 4, 2009
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Shigeru Suzuki, Yasuhiro Kato, Tomoyuki Kubo, Koji Imai