Patents Examined by Y. M. Quach Lee
  • Patent number: 10649126
    Abstract: A holder has a support structure in which a groove is formed and is sized to receive therein a side of a waveguide that is fixed in position next to a surface of the groove. The groove runs in a longitudinal direction, along the length direction of the waveguide. The holder a) reflects, diffuses or absorbs some of the out-coupled from the side of the waveguide, or b) wavelength converts some of the out-coupled light, to produce side illumination that emerges from a side of the holder. Other embodiments are also described and claimed.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: May 12, 2020
    Assignee: L.E.S.S. LTD
    Inventor: Yann Tissot
  • Patent number: 10634293
    Abstract: A retrofit assembly has a pan and a light emitting diode (LED) light source. The pan has a base extending along a longitudinal axis. The base is defined by a plurality of segments, including a seat, first and second legs, a first foot, a second foot, and retaining walls. The seat extends in a first plane. The first and second legs angle laterally and vertically away from opposite sides of the seat. The first foot extends away from the first leg within a second plane offset from and parallel to the first plane. The second foot extends away from the second leg within a third plane offset from and parallel to the first plane. The retaining walls extend vertically away from each of the first and second feet toward the first plane. The LED light source supports a plurality of LEDs coupled to the base.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: April 28, 2020
    Assignee: Orion Energy Systems, Inc.
    Inventors: Scott Green, Matthew Tlachac, George Wilson, Marc Meade, Daniel Fonseca, Ron Ogletree
  • Patent number: 10591124
    Abstract: In an embodiment, a heat dissipating system for a light can include: a light source comprising an LED; a reflector adjacent the LED; a housing around the LED module; and a flexible conductive connector attached at one end to a heat sink and at another end to the light source, and configured to conduct heat away from the light source and to the heat sink. The heat sink is located remote from the light source. In an embodiment, a method of dissipating heat away from a LED module can include: conducting heat from the LED module through a flexible conductive connector to a heat sink, wherein a lamp comprises the LED module, a housing, and a reflector, and wherein the heat sink is located external to the LED housing.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: March 17, 2020
    Assignee: SABIC GLOBAL TECHNOLOGIES B.V.
    Inventors: Poovanna Theethira Kushalappa, Triloka Chander Tankala, Arunachala Parameshwara