Patents Examined by Yartiza Guadalupe
  • Patent number: 10495523
    Abstract: Apparatuses and methods for measuring and characterizing ultrasound using thermoacoustic sensors are provided. Thermoacoustic sensors can include heat flux sensors for detecting a temperature difference (between the front and back of the heat flux sensor) and an absorber layer attached to the heat flux sensor for absorbing ultrasound, converting it to heat, and also acting as an acoustic impedance matching layer. An heat sink can also be used. In some embodiments, thermoacoustic sensors can be arranged into an acoustic integrating sphere and face inward to form a cavity. The sphere can have an opening to the cavity, wherein ultrasound emitted through the opening can cause a temperature difference that can be detected by the thermoacoustic sensors. These apparatuses and others can provide for methods of measuring ultrasound power and/or methods of determining an ultrasound profile as the angular distribution of emitted ultrasound power generated by an ultrasound transducer.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: December 3, 2019
    Assignee: SMILESONICA INC.
    Inventors: Cristian Scurtescu, Ilya Utkin
  • Patent number: 9551574
    Abstract: A spirit type level that may be used to plumb any vertical pole or post, may be used to horizontally set an object and may also be used to quickly and easily set a pipe at a selected slope of between 0 and 3 percent. The spirit type level of the invention includes a plurality of differently oriented spirit vials that are secured within the level body in a manner such that, if any one of the spirit vials become broken, or otherwise damaged, it can be easily replaced and the level need not be discarded. The spirit type level of the invention can be quickly and easily removably attached to the object to be leveled thereby freeing the hands of the user to position the object.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: January 24, 2017
    Inventor: Mark L. Silberberg
  • Patent number: 8732971
    Abstract: A thickness detection device comprises: a feed roller (130), a thickness detection unit (110,210) and a thickness measurement unit (120,220).
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: May 27, 2014
    Assignee: GRG Banking Equipment Co., Ltd.
    Inventors: Wenqing Wu, Weiping Xie, Wei Zhang, Yi Tao
  • Patent number: 7299558
    Abstract: A line marker includes a housing having a receiving cavity and an opening communicating with the receiving cavity, a retracting unit supported within the receiving cavity of the housing, an operating cable having an inner coupling end coupling with the retracting unit and an outer control end extending out of the receiving cavity through the opening, and an indicating element container supported in the housing, wherein the indicating element container includes an absorbing element disposed therein to absorb the indicating element, wherein the operating portion of the operating cable contacts with the absorbing element to evenly apply the indicating element along the operating cable when the operating cable is pulled out from the housing for marking a straight line on a surface.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: November 27, 2007
    Assignee: Leiyu (Shanghai) Packaging Products Co., Ltd.
    Inventor: Bilei Wang
  • Patent number: 6760976
    Abstract: A method for a robotic semiconductor wafer processing system to correct for wafers that have become offset or off-center during wafer processing. This is accomplished by determining the amount of offset and re-centering the wafer during wafer transport to the next process station using a single station sensor to locate the wafer center point. Each single sensor located at each station activates when the wafer's edge traverses through the sensor's path. Directional coordinates for the measured designated points on the wafer's edge are calculated, and the intersection points of two circles, analytically derived from using the measured designated points as their centers, are determined. The intersection point closest to the true wafer center position represents the measured wafer's center point. This point is compared to the true wafer center position, and the wafer is then adjusted for this difference.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: July 13, 2004
    Assignee: Novellus Systems, Inc.
    Inventors: Robert Martinson, Dhairya Shrivastava, Matthew Weis
  • Patent number: 6651350
    Abstract: Orbiting sight includes a pivotable sight-mounting member; and, attached in a pivoting relationship to said member, a sighting unit. The sighting unit can remain positioned in a fixed orientation in relation to an axis. The orbiting sight can be attached to a projectile-type weapon, especially, an archery bow. Provided also, in a projectile-type weapon other than an archery bow, the improvement of an orbiting sight including a pivotable sight-mounting member, which heed not necessarily be, but advantageously is, such that it remain positioned in a fixed orientation to an axis; and, attached to it, a sighting unit.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: November 25, 2003
    Inventors: Marvin L. Manns, Wayne A. Manns, Patrick A. Manns