Patents Examined by Ymelody Tsui
  • High modulus spunbond
    Patent number: 10682795
    Abstract: The present invention is directed at a relatively high modulus spunbond nonwoven material that is suitable for use in relatively high deep draw molding applications.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: June 16, 2020
    Assignee: FREUDENBERG PERFORMANCE MATERIALS LP
    Inventors: Doug Clark, Hoa Pham