Abstract: A method for removing a scuff mark from a shoe surface made from a synthetic material comprises the steps of: applying a fingernail polish remover composition to the shoe surface with a cotton ball; rubbing the composition into the surface; and removing the scuff mark and the composition from the surface. The composition may consist essentially of acetone; water; glycerin; diglycerol; and gelatin. The composition may alternately consist essentially of ethyl acetate; isopropyl alcohol; water; benzophenone 1; isopropyl myristate; butyl acetate; and mineral salts containing sodium, potassium, magnesium, calcium, chloride, bromide, iodide, sulfate, and carbonate. Still further, the composition may alternately consist essentially of other nail polish remover compositions.

Abstract: A non-aqueous negative photoresist stripping composition which consists essentially of about 40 to 80% by weight of an alkylnaphthalene solvent, about 5 to 20% by weight of an alkyl phenol which provides a corrosion inhibitory effect, about 5 to 20% by weight of a linear monoalkylbenzene sulfonic acid which is a surfactant and about 1 to 10% by weight of a dialkylbenzene sulfonic acid. There is further provided a process for removing coatings from a photoresist with the compositions of the invention.

Abstract: A complex building agent, such as EDTA is added in a predetermined concentration to the "SC 1" step of a "PIRANHA-RCA" cleaning sequence for reducing the metal contamination left on the surface of a silicon wafer after completion of this cleaning step.