Abstract: This invention relates to free abrasive slurries suited for use in polishing workpieces composed of materials varying in hardness, uniformly without selective polishing or working without difference in the amounts of polishing for different materials. The subject matter of this invention is a free abrasive slurry composition for polishing workpieces in which at least one soft material with a Vickers hardness in the range of 26 to 360 and at least one hard material with a Vickers hardness in the range of 700 to 4000 are mixedly present, comprising a polyol with a molecular weight ranging from 300 to 20000, a polishing powder, a dispersion medium, and optionally a surfactant.

Abstract: An object is to provide a method for processing a semiconductor substrate that can form an oxide film less prone to take in impurities affecting semiconductor characteristics on the surface. An RCA-cleaned semiconductor substrate is treated with diluted hydrofluoric acid (HF) to remove a native oxide film formed on the semiconductor substrate during the RCA cleaning process (step S8). For conditions of the treatment with diluted hydrofluoric acid, the concentration of hydrofluoric acid is about 50%, the ratio of hydrofluoric acid to pure water is 1:100, and the processing time is about one minute. Finally, the semiconductor substrate from which the native oxide film has been removed is stored in a clean atmosphere of oxygen for a predetermined time period to form an oxide film on the semiconductor substrate surface (step S9). The percentage of oxygen in the atmosphere of oxygen in the place for storage is about 20 to 100%.

Abstract: A system and method are provided for cleaning the printhead of a continuous ink jet printing system. A cleaning fluid is introduced and used to flush ink residues and debris from the interior of the drop generator, the exterior of the orifice plate, the charge plate face and the catcher face. This system and method removes dried ink residues and other debris and deposits by providing a cleaning fluid with a low surface tension to dissolve or flush away the unwanted material from the orifices. This is particularly advantageous in that the flushing and rinsing is accomplished without mechanical contact which could abrade or damage the orifices.

Abstract: A method and an apparatus for preventing silicon hole defect formation on a silicon wafer after a wet cleaning process are disclosed. In the method, a supply tank and a cleaning tank are provided which are connected together in fluid communication by a conduit. The conduit is cooled by a wrapped around cooling tube and a cooling water flowing through the tube at a temperature of less than 20° C. The apparatus of the wet cleaning station may further include a pump for transporting an aqueous solution of ammonia from the supply tank to the cleaning tank, a safety overflow conduit for protecting the supply tank that holds the aqueous solution of ammonia, and a flow control valve in the conduit between the supply tank and the cleaning tank. The present invention novel method and apparatus effectively prevents the formation of ammonia vapor in the mini-environment that surrounds the cleaning tank and the rinse tank.

Abstract: The invention generally relates to various aspects of a plasma process, and more specifically the monitoring of such plasma processes. One aspect relates in at least some manner to calibrating or initializing a plasma monitoring assembly. This type of calibration may be used to address wavelength shifts, intensity shifts, or both associated with optical emissions data obtained on a plasma process. A calibration light may be directed at a window through which optical emissions data is being obtained to determine the effect, if any, that the inner surface of the window is having on the optical emissions data being obtained therethrough, the operation of the optical emissions data gathering device, or both. Another aspect relates in at least some manner to various types of evaluations which may be undertaken of a plasma process which was run, and more typically one which is currently being run, within the processing chamber.

Abstract: In a test strip package having a plurality of test strips (20), each of which test strips has a test field (32) for evaluation by an optical measuring mechanism of a measuring device and including a container (12) for receiving the test strips (20) the container (12) is made as a rectangular closed flat envelope (12) for receiving a rectangular card (18), with the card (18) consisting of a plurality of test strips (20) which are separable from one another along tear lines (22).