Patents Examined by Yuechan Yu
  • Apparatus and method for processing substrate using plasma
    Patent number: 12176185
    Abstract: Provided are a substrate processing apparatus and method for increasing the uniformity of substrate processing.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: December 24, 2024
    Assignee: SEMES CO., LTD.
    Inventors: Min Sung Han, Jae Hoo Lee, Yoon Jong Ju, Wan Jae Park