Patents Examined by Yuri Semenenko
  • Multi-die MEMS package
    Patent number: 9095072
    Abstract: This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: July 28, 2015
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Janusz Bryzek, John Gardner Bloomsburgh, Cenk Acar