Abstract: A latch assembly for latching a heat sink onto a printed circuit board (PCB). The latch assembly includes a clamp having a connector for connecting the latch assembly to the heat sink. A spring is mounted to the clamp for biasing the clamp away from the heat sink. A handle is rotatably connected to the clamp, and a cam extends from the handle. A hook is moveably mounted to the clamp and has a cam surface engaged with the cam. The hook has an engagement portion for engaging the PCB. Rotation of the handle causes (i) rotation of the hook, which causes the engagement portion to engage the PCB, followed by (ii) movement of the cam along the cam surface, which causes translation of the clamp toward the PCB against the bias of the spring, which causes the heat sink to contact an IC for dissipating heat from the IC.

Abstract: A display device includes a display panel, a bottom cover at a rear surface of the display panel, and a heat dissipation assembly. The heat dissipation assembly includes a housing between the display panel and the bottom cover, conductive lines on two lateral sides within the housing and configured to supply electricity therethrough, and a movable member having both ends thereof supported by and electrically connected to the conductive lines to thereby be movable in a longitudinal direction of the housing.

Abstract: A mobile hardware heat dissipating and protection device is disclosed. The device comprises a front layer, back layer, and protective housing into which a mobile device may be installed. The front layer and back layer attach around the mobile device, and are then enclosed by the protective housing. The back layer may comprise a series of heat-dissipating devices, which may include a thermal gel layer and a plurality of heat-dissipating fins. The protective layer may encompass the heat-dissipating fins so as to protect them from damage and contamination, and may create an open space into which air may flow. The protective layer also incorporates a plurality of vents or openings through which the air may flow into the case and over the fins. The device may also incorporate a micro fan to assist with air flow.

Abstract: A cold energy recovery apparatus for a self-powered data centre is disclosed. The apparatus comprises a fluid storage tank having at least a pair of inlet and outlet, the inlet configured to receive a coolant; and a heat exchanger arranged in the tank, the heat exchanger having a pair of inlet and outlet, the inlet configured to receive liquefied natural gas. The apparatus is operable to permit the coolant to flow from the inlet to the outlet of the tank causing the coolant to be in fluid contact with the heat exchanger, in which the coolant is progressively cooled to a lower temperature by heat transfer to the liquefied natural gas via fluid contact with the heat exchanger. The liquefied natural gas is vaporized into natural gas due to the heat transfer and is directed out from the outlet of the heat exchanger.

Abstract: In one embodiment, a pluggable module for insertion into a socket of a network cabinet is disclosed, the pluggable module comprising a body having first and second portions arranged along an axis, wherein the module is arranged for insertion of the first portion into said socket in a direction of insertion along the axis, whereupon the second portion protrudes from said socket along the axis and away from the direction of insertion, and wherein the second portion comprises a first heat sink on a surface of the second portion, wherein the first heat sink comprises a plurality of parallel fins aligned with the axis of insertion.

Abstract: A tablet computer includes a housing and a touch screen. The housing supports a touch screen for manipulation by a user of the computer. At least one hand pad is selectively secured to the tablet housing. The at least one hand pad is positioned at the back of the tablet for supporting the hand of a user as the user manipulates the touch screen. The pad includes a bottom surface shaped and dimensioned to rest firmly upon the tablet housing and a top surface contoured to comfortably support a hand of a user. The hand pad may also include side walls designed to wrap around the edges of the tablet housing.

Abstract: The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first non-cryogenic temperature domain, a second component located in a second temperature domain that is lower in temperature than the first cryogenic temperature domain, and a third component located in a cryogenic temperature domain that is lower in temperature than the second cryogenic temperature domain.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: Interconnectors, interconnector assemblies, and methods for supporting components are provided. An interconnector as disclosed connects a supported component to another component or assembly securely and accurately, even where the supported component and the other component have different expansion or contraction characteristics. The interconnector includes a plurality of support elements disposed in an array. Each support element includes a support surface at a free end of the support element. The areas of the support surfaces decrease with distance from a center of the array. In a completed assembly, the free ends of the support elements in the array are joined to the supported component.

Abstract: Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.

Abstract: A heat dissipation apparatus includes a heat sink unit, a flow guiding structure and a fan. In addition, the heat sink unit includes a base and a fin set arranged on the base. The flow guiding structure includes an air shield and an engagement frame arranged at one end of the air shield. The air shield includes an enclosure space formed at an internal thereof. The enclosure space includes an opening formed at two ends of the air shield respectively, and the air shield covers an exterior of the fin set with the enclosure space. The engagement frame is selectively arranged at an exterior of any one of the openings of the air shield; and a fan is arranged on the engagement frame.

Abstract: A device cooling system disclosed herein includes a ventilated shield can coupled to a printed circuit board assembly. The ventilated shield can includes a first side surface with input holes and a second side surface with output holes. The ventilated shield can is positioned related to a predefined airflow path such that the input holes and the output holes facilitate airflow along the predefined airflow path through the ventilated shield can in a direction substantially parallel to the PCBA while the shield can encases and shields at least one electrical component from RF radiation at a target shield frequency.

Abstract: The present disclosure relates to a cooling apparatus (1) comprising a metal and/or electrically conductive EMC enclosure (2) and a converter (E1) and also a plurality of electrically operated units (E2, . . . , En) within the EMC enclosure (2) which are designed to influence a local temperature in at least one region (30, 31) inside or outside the EMC enclosure (2), wherein the converter (E1) directly supplies at least one or more of the units (E2, . . . , En) with a respective supply voltage, and wherein the converter (E1) and the units (E2, . . . , En) are each designed such that the line-bound and/or field-bound interference (Sxy) which is specifically generated by this unit during operation of the cooling apparatus (1) is compensated for by a line-bound and/or field-bound interference (Sxy) of at least one of the respectively other units (E1, . . . , En) partially or completely in terms of its respective interference level (Pn).

Abstract: Disclosed is a liquid cooling module for computer servers, including: a pump, a fan, a heat exchanger, at least two ventilation grilles, an open central longitudinal space between the pump and the heat exchanger that is arranged to facilitate airflow therein from a grille of one short side wall to a grille of the other short side wall, this airflow being driven by the fan, a portion of secondary hydraulic circuit located in the liquid cooling module, for circulating a fluid coolant, including no bypass that would allow the pump to operate as a closed circuit and likely to clutter this open longitudinal space, a circuit control board positioned in the longitudinal extension of the open central longitudinal space so as to be directly swept by the airflow.

Abstract: An avionics power management panel and door assembly where the panel includes a cabinet including a set of walls at least partially defining an interior with an open face and door assembly includes a central panel a front panel that includes a set of rows with apertures formed between two adjacent rows and where the set of rows have a crimped profile.

Abstract: According to one embodiment, an information technology (IT) equipment cooling system includes an IT cooling module having one or more pieces of IT equipment that is configured to provide IT services and is at least partially submerged within a liquid coolant. While the equipment provides the services, heat is generated and transferred into the coolant thereby causing at least some of the coolant to turn into a vapor. The system also includes a condenser that is positioned above the module and is configured to condense the vapor back into liquid coolant. The system includes return and supply lines that are both coupled to the condenser and to the module to create a heat exchanging loop. The system includes an accumulator that is disposed on the supply line and is configured to accumulate the condensed liquid coolant before the coolant is provided to the module. The accumulator provides backup cooling capacity for the system.

Abstract: The disclosed apparatus may include (1) a plurality of fluid-cooled plates that thermally couple to a plurality of electronic components included on a multi-chip module, (2) at least one source conduit that (A) is operatively coupled to at least one fluid-cooled plate within the plurality of fluid-cooled plates and (B) feeds cooling fluid from a condenser to the fluid-cooled plate, (3) at least one return conduit that (A) is operatively coupled to at least one additional fluid-cooled plate within the plurality of fluid-cooled plates and (B) returns the cooling fluid from the additional fluid-cooled plate toward the condenser, and (4) an assembly that (A) is mechanically coupled to the fluid-cooled plates and (B) reinforces the thermal couplings between the fluid-cooled plates and the electronic components included on the multi-chip module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A heat dissipation structure of a heat generating component includes a heat conductive plate that includes a heat receiving connecting part thermally connected to the heat generating component and a heat dissipation connecting part thermally connected to the chassis and an air cooling fan that generates cooling air for cooling the heat conductive plate. The heat conductive plate further includes a first heat dissipation area from which heat is dissipated by flowing the cooling air along a surface of the plate and a second heat dissipation area that is bent and extends from the first heat dissipation area so as to cross an advancing direction of the cooling air that flows along the surface of the plate at the first heat dissipation area, and from which heat is dissipated by receiving the cooling air that has flown along the surface of the plate at the first heat dissipation area.

Abstract: A liquid immersion cooling apparatus includes a first receptacle in which a refrigerant liquid is accommodated, configured to include a first tank having a first sidewall, a first lid configured to cover the first tank, and a first space provided between the refrigerant liquid and the first lid, a second receptacle in which a sealing material is accommodated, configured to include a second tank having a second sidewall facing the first sidewall, a second lid configured to cover the second tank, a second space provided between the sealing material and the second lid, and configured to communicate with the first space, and a third space provided between the sealing material and the second lid, partitioned from the second space, and configured to communicate with an outside, and a heat insulator provided between the first sidewall and the second sidewall.

Abstract: Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.