Patents Examined by Zandra V Smtih
  • Semiconductor device and method
    Patent number: 10867874
    Abstract: A semiconductor device and method includes forming a conductive post on a die; coupling a test probe to the conductive post with solder; and etching the solder and the conductive post with a plurality of etching processes, the plurality of etching processes including a first etching process, the first etching process comprising etching the conductive post with a nitric-based etchant.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: December 15, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Hui-Jung Tsai, Yun Chen Hsieh, Hung-Jui Kuo