Patents Examined by Zeinabg El-Arini
  • Patent number: 6558471
    Abstract: Methods and apparatuses are provided that remove a scrubber brush from contact with a wafer surface prior to slowing down the scrubber brush's rotational rate. The scrubbing method may include rotating a scrubber brush at a non-reduced rate, while the scrubber brush is in contact with the wafer and removing the scrubber brush from contact with the wafer while rotating the scrubber brush at the non-reduced rate. The scrubbing apparatus has a controller programmed to perform the scrubbing method.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: May 6, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Brian J. Brown, Yufei Chen, David G. Andeen, Madhavi Chandrachood