Abstract: Methods and apparatuses are provided that remove a scrubber brush from contact with a wafer surface prior to slowing down the scrubber brush's rotational rate. The scrubbing method may include rotating a scrubber brush at a non-reduced rate, while the scrubber brush is in contact with the wafer and removing the scrubber brush from contact with the wafer while rotating the scrubber brush at the non-reduced rate. The scrubbing apparatus has a controller programmed to perform the scrubbing method.
Type:
Grant
Filed:
January 26, 2001
Date of Patent:
May 6, 2003
Assignee:
Applied Materials, Inc.
Inventors:
Brian J. Brown, Yufei Chen, David G. Andeen, Madhavi Chandrachood