Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

Abstract: An enclosure for electrical equipment is provided. The enclosure includes a frame, a first plate, and a first member coupled to the frame and configured to receive the first plate. The first plate is configured to receive a transformer, movable between a first position and a second position, at least partially supported by the first member when the first plate is in the first position, and offset from the first member when the first plate is in the second position.

Abstract: An example method includes positioning a thermal bus bar into a bus bar support channel of a cooling wall, the cooling wall comprising a plurality of thermal bus bars. The positioning comprises removably connecting first portions of at least two dripless connectors coupled to a fluid flow path of the thermal bus bar to second portions of the dripless connectors coupled to coolant transport lines that receive and return coolant from a coolant source. The method further includes flowing coolant received from the coolant transport lines through the fluid flow path and returning the coolant to the coolant transport lines. The thermal bus bar is positioned while coolant provided by the coolant transport lines is flowing through other thermal bus bars of the cooling wall.

Abstract: A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.

Abstract: A display device includes a display panel, a member, a first fixing portion, a second fixing portion, and a roll-up portion. The display device has a function that enables selection between a first state in which an image is displayed with the display panel not folded and a second state in which an image is displayed with the display panel folded. The display panel is fixed to the first fixing portion and the second fixing portion. One end of the member is fixed to the first fixing portion. The other end of the member is connected to the roll-up portion. The roll-up portion has a function that enables rolling up of the member from the other end of the member. The display panel is folded by rolling up the member. The display panel is unfolded by pulling out the rolled-up member from the roll-up portion.

Abstract: A liquid immersion bath for an electronic device includes: a bath body that is capable of housing the electronic device, is coupled to a circulation path through which a liquid coolant which cools the electronic device immersed in the liquid coolant circulates, and includes a gas phase portion corresponding to a space free from the liquid coolant; and a container that is disposed in the gas phase portion and has a volume which changes in accordance with a pressure of the gas phase portion, wherein an inside of the container is coupled to an outside of the bath body.

Abstract: An underwater data center includes an electronic device; a housing member that houses the electronic device and that is configured to be disposed under water; and a heat exchanger that is provided at the housing member and that is configured to discharge, into the water, heat discharged from the electronic device, with a face of the heat exchanger that discharges the heat making contact with the water, an opening being formed in a bottom face of the housing member and placing an inside of the housing member in communication with the water.

Abstract: Provided are a heat-radiating adhesive member, a heat-radiating sheet using the heat-radiating adhesive member, and an electronic apparatus having the heat-radiating sheet. The heat-radiating adhesive member includes: an adhesive layer; first thermally conductive fillers that are dispersed inside the adhesive layer and spreads heat generated from a heat-generating component of an electronic apparatus in a horizontal direction of the adhesive layer; and second thermally conductive fillers that are dispersed inside the adhesive layer and transfer the heat generated from the heat-generating component of the electronic apparatus to the first thermally conductive fillers.

Abstract: The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.

Abstract: An ultrasound apparatus includes a base, a housing extending upwardly from the base and having opposed lateral sides, the housing being configured to support an operator console and display, and a storage bin received in a recess in the housing. The storage bin is movable from a first position in which the storage bin is received within the recess of the housing, and a second position in which the storage bin extends from one of the lateral sides of the housing.

Abstract: Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

Abstract: A mounting assembly is for an electrical switch. The electrical switch has a heat sink. The mounting assembly includes a switching member, an insulator structured to be located between the switching member and the heat sink, and a separate cover member overlaying the switching member and being structured to secure the switching member and the insulator to the heat sink. The separate cover member includes a body portion and a plurality of protrusions extending outwardly from the body portion. The plurality of protrusions includes a first protrusion and a second protrusion. The switching member is located between the first protrusion and the second protrusion. The plurality of protrusions are structured to extend through the heat sink in order to removably couple the separate cover member and the switching member to the heat sink without requiring a separate fastener to be inserted through the separate cover member.

Abstract: An electronic equipment chassis assembly includes a housing, and a plurality of openings defined in the housing that allow airflow there-through. The openings include at least one intake opening defined in the front surface of the housing and at least one exit opening defined in the rear surface of the housing. The chassis also includes an air filter, and one or more rails disposed within the housing defining receiving slots that releasably secure a first plurality of circuit boards, and a second plurality of circuit boards, which second plurality of circuit boards are orthogonally oriented relative to the first plurality of circuit boards. The chassis includes an airflow assembly proximate the top surface of the housing, and one or more output fans proximate the rear surface of the housing. The airflow assembly and the output fans balance airflow throughout the chassis.

Abstract: Various heat sink/circuit board combinations are disclosed. In one aspect, an apparatus is provided that includes a heat sink and plural contact pins coupled to the heat sink. Each of the contact pins is operable to selectively contact at least one of plural ground conductors of a circuit board. A given contact pin may be selectively moved relative to the heat sink to contact or not contact one of the ground conductors to provide the capability of controlling a number and location of ground points of the heat sink.

Abstract: A heat-dissipating sheet includes a thermally-conductive resin sheet, an adhesive layer on an upper surface of the thermally-conductive resin sheet, and a thermally-conductive film on an upper surface of the adhesive layer. The thermally-conductive film has a higher thermal conductivity than the thermally-conductive resin sheet. The thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet. The recess may be an aperture passing through the thermally-conductive resin sheet. The adhesive layer is exposed from the aperture.

Abstract: Discussed generally herein are devices that include a switchable heat path. A device can include a device skin, a circuit board, a plurality of components on the circuit board, and a switchable heat path situated between the components and the device skin, the switchable heat path configured to be switched between an on state and an off state, the switchable heat path configured to conduct a first amount of heat from the components to the device skin when in the on state and configured to conduct a second, lesser amount of heat from the components to the device skin when in an off state.

Abstract: A cooling apparatus includes an assembly including an electronic device and a potting material that covers a side portion and an upper portion of the electronic device, the assembly having a conical upper portion, and a cooling plate including a conical hole, into which the upper portion of the assembly is fitted, and a flow path, through which a coolant flows.

Abstract: A container fitted in a technical infrastructure including on a longitudinal side face, at least one opening arranged to allow the intake of air inside the container; on the opposite longitudinal side face, at least one fan arranged to expel the air from the inside to the outside of the container; and computer racks disposed in the middle of the container along its longitudinal axis.

Abstract: An apparatus and a system including the apparatus. The apparatus may include a modular electronics enclosure. The modular electronics enclosure may be configured to house an electronics device. The modular electronics enclosure may include a side portion. The modular electronics enclosure may further include angled external heat sink fins extending from the side portion.

Abstract: A cooling fan with shapes, sizes, and placements of frame and supporting ribs tuned to reduce operational vibration and noise includes a fan frame, a supporting base, and a plurality of ribs. The fan frame includes a bottom plate and a sidewall connected to the bottom plate. The supporting base is formed at the bottom plate. The plurality of ribs extends from an outer circumferential surface of the supporting base to the sidewall. At least one of the plurality of ribs and the fan frame is asymmetrical with respect to the supporting base.