Abstract: Warehouse automation and methods of handling materials can be used to enhance the safety and efficiencies of warehouse operations. For example, automation systems and methods that make depalletization processes safer and more efficient are described. In some examples, the depalletization systems described herein include multiple work cells/stations and a depalletization robot that traverses the work cells/stations on a rail so the robot can autonomously move between the stations.

Abstract: Warehouse automation and methods of handling materials can be used to enhance the safety and efficiencies of warehouse operations. For example, automation systems and methods that make depalletization processes safer and more efficient are described. In some examples, a rotary lift table is used to automatically position a pallet load of boxes in an ergonomic position where a worker can readily transfer the boxes from the pallet to another location, such as a conveyor or another pallet. In some examples, a work cell for a worker includes two of the rotary lift tables that function in that manner.

Abstract: This document describes systems and methods for enhancing the efficiencies of order fulfillment and inventory management processes. For example, this document describes automated robotic systems that can autonomously pick and place a particular quantity of desired items from a container that is storing the items. The autonomous robotic systems can thereby facilitate order fulfillment and inventory management processes in an efficient manner. In particular, the systems and methods described herein can greatly reduce the amount of time required for a human worker to pick orders. Accordingly, the efficiency of item picking processes, as measured by the number of line items picked per human labor hour for example, is greatly enhanced.

Abstract: Warehouse automation and methods of handling materials can be used to enhance the safety and efficiencies of warehouse operations. For example, automation systems and methods that make depalletization processes safer and more efficient are described. In some examples, the depalletization systems described herein include multiple work cells/stations and a depalletization robot that traverses the work cells/stations on a rail so the robot can autonomously move between the stations.

Abstract: Warehouse automation and methods of handling materials can be used to enhance the safety and efficiencies of warehouse operations. For example, automation systems and methods that make depalletization processes safer and more efficient are described. In some examples, a rotary lift table is used to automatically position a pallet load of boxes in an ergonomic position where a worker can readily transfer the boxes from the pallet to another location, such as a conveyor or another pallet. In some examples, a work cell for a worker includes two of the rotary lift tables that function in that manner.

Abstract: Warehouse automation and methods of automatically sorting and sequencing items can be implemented to streamline and expedite order fulfillment and store replenishment processes in a cost-effective manner. Some embodiments described herein include: (i) picking or retrieving items from an inventory storage area, (ii) decanting individual items and placing them on carriers of a high-speed sorting and conveyance system, and (iii) final sortation as per customer orders. In some embodiments, the high-speed sorting and conveyance system includes multiple shuttles that each carry an individual item to a designated final order sortation system.

Abstract: Warehouse automation and methods of automatically sorting and sequencing items can be implemented to streamline and expedite order fulfillment and store replenishment processes in a cost-effective manner. Some embodiments described herein include: (i) picking or retrieving items from an inventory storage area, (ii) decanting individual items and placing them on carriers of a high-speed sorting and conveyance system, and (iii) final sortation as per customer orders. In some embodiments, the high-speed sorting and conveyance system includes multiple shuttles that each carry an individual item to a designated final order sortation system.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: The invention provides a pad removal apparatus and method that enables improved pad removal from a platen.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; (iv) dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) distributor (125) between the nozzles (126, 128) and head (116). In one embodiment, apparatus (100) further includes a wiper (180) between head (116) and distributor (125) to remove used slurry and polishing byproducts from surface (110), thereby reducing agglomerations or deposits that can damage substrate (102) and improving yield. Optionally, apparatus (100) further includes dispenser (186) for dispensing a fluid before and/or after wiper (180) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: The invention provides a chemical mechanical polishing pad and method that enables improved wafer removal from the polishing pad after completion of chemical mechanical polishing of the wafer.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.