Patents by Inventor A. Jay Stutzman
A. Jay Stutzman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8074353Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: GrantFiled: September 11, 2008Date of Patent: December 13, 2011Assignee: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Patent number: 8063646Abstract: Microelectronic devices, methods for testing microelectronic devices, and detachable electrical components. One embodiment of an apparatus for testing microelectronic devices in accordance with the invention comprises a board having a primary side, a secondary side, a plurality of test sites at the primary side, and electrical lines electrically coupled to the test sites. The testing apparatus can further include a plurality of lead holes in the board. Individual lead holes have a sidewall and a conductive section plated onto the sidewall. In several embodiments, individual pairs of first and second lead holes are electrically coupled to electrical lines corresponding to an associated test site. The apparatus can further include a plurality of permanent fuses fixed to the board. Individual permanent fuses are electrically coupled to electrical lines associated with an individual test site and an individual pair of first and second lead holes.Type: GrantFiled: August 23, 2006Date of Patent: November 22, 2011Assignee: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Patent number: 8011092Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: GrantFiled: September 11, 2008Date of Patent: September 6, 2011Assignee: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Patent number: 7857646Abstract: An apparatus for forming a temporary electrical connection with a microelectronic component and associated systems and methods are disclosed herein. Embodiments of the apparatus can include a base, a plurality of electrical contacts coupled to the base, and a nest attached to the base. The nest includes a plurality of contact compartments aligned with peripheral leads of the microelectronic component and at least partially covering the contacts. Individual contact compartments are masked to prevent a corresponding contact from electrically contacting the peripheral leads of the microelectronic component. In one embodiment, the masked contact compartments are used as a guide zone to guide individual peripheral leads when the microelectronic component is seated at or unseated from the support surface. In an additional or alternative embodiment, the masked contact compartments are used to selectively isolate contacts, for example, from supply or ground electrical potentials.Type: GrantFiled: May 2, 2008Date of Patent: December 28, 2010Assignee: Micron Technology, Inc.Inventors: A. Jay Stutzman, Daniel P. Cram
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Patent number: 7692437Abstract: Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of test contacts aligned with external contacts of the device when the device is received within the test socket. The system further includes a mask proximate to the test socket and the test contacts. The mask includes a plurality of apertures arranged in a pattern corresponding to the plurality of test contacts and corresponding at least in part to the array of external contacts when the device is received within the test socket. The apertures include (a) first apertures sized to allow the corresponding test contacts to extend completely through the mask, and (b) one or more second apertures sized to allow the corresponding test contacts to extend only partially through the mask.Type: GrantFiled: September 10, 2008Date of Patent: April 6, 2010Assignee: Micron Technology, Inc.Inventors: A. Jay Stutzman, Daniel P. Cram
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Publication number: 20090273359Abstract: An apparatus for forming a temporary electrical connection with a microelectronic component and associated systems and methods are disclosed herein. Embodiments of the apparatus can include a base, a plurality of electrical contacts coupled to the base, and a nest attached to the base. The nest includes a plurality of contact compartments aligned with peripheral leads of the microelectronic component and at least partially covering the contacts. Individual contact compartments are masked to prevent a corresponding contact from electrically contacting the peripheral leads of the microelectronic component. In one embodiment, the masked contact compartments are used as a guide zone to guide individual peripheral leads when the microelectronic component is seated at or unseated from the support surface. In an additional or alternative embodiment, the masked contact compartments are used to selectively isolate contacts, for example, from supply or ground electrical potentials.Type: ApplicationFiled: May 2, 2008Publication date: November 5, 2009Applicant: MICRON TECHNOLOGY, INC.Inventors: A. Jay Stutzman, Daniel P. Cram
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Patent number: 7586319Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: GrantFiled: September 11, 2008Date of Patent: September 8, 2009Assignee: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Patent number: 7514945Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: GrantFiled: December 6, 2007Date of Patent: April 7, 2009Assignee: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Publication number: 20090009202Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: ApplicationFiled: September 11, 2008Publication date: January 8, 2009Inventors: Daniel P. Cram, A. Jay Stutzman
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Publication number: 20090009199Abstract: Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of test contacts aligned with external contacts of the device when the device is received within the test socket. The system further includes a mask proximate to the test socket and the test contacts. The mask includes a plurality of apertures arranged in a pattern corresponding to the plurality of test contacts and corresponding at least in part to the array of external contacts when the device is received within the test socket. The apertures include (a) first apertures sized to allow the corresponding test contacts to extend completely through the mask, and (b) one or more second apertures sized to allow the corresponding test contacts to extend only partially through the mask.Type: ApplicationFiled: September 10, 2008Publication date: January 8, 2009Applicant: MICRON TECHNOLOGY, INC.Inventors: A. Jay Stutzman, Daniel P. Cram
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Publication number: 20090007423Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: ApplicationFiled: September 11, 2008Publication date: January 8, 2009Inventors: Daniel P. Cram, A. Jay Stutzman
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Publication number: 20090000116Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: ApplicationFiled: September 11, 2008Publication date: January 1, 2009Inventors: Daniel P. Cram, A. Jay Stutzman
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Patent number: 7439752Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.Type: GrantFiled: May 3, 2006Date of Patent: October 21, 2008Assignee: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Patent number: 7425839Abstract: Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of test contacts aligned with external contacts of the device when the device is received within the test socket. The system further includes a mask proximate to the test socket and the test contacts. The mask includes a plurality of apertures arranged in a pattern corresponding to the plurality of test contacts and corresponding at least in part to the array of external contacts when the device is received within the test socket. The apertures include (a) first apertures sized to allow the corresponding test contacts to extend completely through the mask, and (b) one or more second apertures sized to allow the corresponding test contacts to extend only partially through the mask.Type: GrantFiled: August 25, 2006Date of Patent: September 16, 2008Assignee: Micron Technology, Inc.Inventors: A. Jay Stutzman, Daniel P. Cram
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Publication number: 20080048704Abstract: Microelectronic devices, methods for testing microelectronic devices, and detachable electrical components. One embodiment of an apparatus for testing microelectronic devices in accordance with the invention comprises a board having a primary side, a secondary side, a plurality of test sites at the primary side, and electrical lines electrically coupled to the test sites. The testing apparatus can further include a plurality of lead holes in the board. Individual lead holes have a sidewall and a conductive section plated onto the sidewall. In several embodiments, individual pairs of first and second lead holes are electrically coupled to electrical lines corresponding to an associated test site. The apparatus can further include a plurality of permanent fuses fixed to the board. Individual permanent fuses are electrically coupled to electrical lines associated with an individual test site and an individual pair of first and second lead holes.Type: ApplicationFiled: August 23, 2006Publication date: February 28, 2008Applicant: Micron Technology, Inc.Inventors: Daniel P. Cram, A. Jay Stutzman
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Publication number: 20080048694Abstract: Systems and methods for testing packaged microelectronic devices are disclosed herein. One such system for testing a packaged microelectronic device includes a test socket configured to receive the device for testing and a tester interface including a plurality of test contacts aligned with external contacts of the device when the device is received within the test socket. The system further includes a mask proximate to the test socket and the test contacts. The mask includes a plurality of apertures arranged in a pattern corresponding to the plurality of test contacts and corresponding at least in part to the array of external contacts when the device is received within the test socket. The apertures include (a) first apertures sized to allow the corresponding test contacts to extend completely through the mask, and (b) one or more second apertures sized to allow the corresponding test contacts to extend only partially through the mask.Type: ApplicationFiled: August 25, 2006Publication date: February 28, 2008Applicant: Micron Technology, Inc.Inventors: A. Jay Stutzman, Daniel P. Cram
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Patent number: 7030638Abstract: An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.Type: GrantFiled: July 24, 2003Date of Patent: April 18, 2006Assignee: Wells-CTI, LLCInventor: Jay Stutzman
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Publication number: 20050017742Abstract: An integrated circuit (IC) package testing device using a selectable number of leaf springs to provide a resilient and consistent normal force to the IC package and the method of operating the device. The leaf springs are shaped to provide the proper compliance and resilient force and are shaped to fit side-by-side within the lid of the device. The springs can be easily changed for differently sized IC packages.Type: ApplicationFiled: July 24, 2003Publication date: January 27, 2005Applicant: WELLS-CTI, LLC, an Oregon limited liability companyInventor: Jay Stutzman
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Patent number: 5547045Abstract: An adjustable wheel chock mechanism for use on tandem axle vehicles that includes an adjustable wheel chock to accommodate vehicles with larger or smaller spacing between the tandem axles. The wheel chocks are comprised of a rigid quadrilateral frame which allows the use of a single rotating spindle and eliminates the need for additional hardware to construct each separate wheel chock. The present device also includes a removable crank to provide additional theft deterrence.Type: GrantFiled: April 11, 1995Date of Patent: August 20, 1996Inventor: Jay Stutzman