Abstract: Medical devices and systems for treating a stricture, for example along the biliary and/or pancreatic tract, are disclosed. An example system may include a guidewire having a distal end and defining a lumen. A stiffening rod may be slidably disposed within the lumen. The stiffening rod may have a distal end and a distal end region disposed adjacent to the distal end. The stiffening rod may be configured to shift between a first position where the distal end of the stiffening rod is disposed proximally of the distal end of the guidewire and a second position where the distal end of the stiffening rod is disposed distally of the distal end of the guidewire.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

Abstract: Provided here are methods of making derivatives and prodrugs of substituted morpholines or pharmaceutically acceptable salts thereof.

Abstract: The invention provides DNA compositions that relate to transgenic insect resistant maize plants. Also provided are assays for detecting the presence of the maize DAS-59122-7 event based on the DNA sequence of the recombinant construct inserted into the maize genome and the DNA sequences flanking the insertion site. Kits and conditions useful in conducting the assays are provided.

Abstract: Non-human animals, expressing humanized CD3 proteins are provided. Non-human animals, e.g., rodents, genetically modified to comprise in their genome humanized CD3 proteins are also provided. Additionally, provided are methods and compositions of making such non-human animals, as well as methods of using said non-human animals.

Abstract: Anti-Epstein Barr Virus (EBV) vaccines are described herein. The EBV vaccine antigens are linked to a multimerization domain, for example, presented on a circular tandem repeat protein (cTRP) scaffold or linked to a C4b multimerization domain. The vaccines can be used to treat and/or reduce the risk of EBV infection and to treat and/or reduce the risk of complications associated with EBV infection, such as infectious mononucleosis, lymphoproliferative disorders, carcinomas, and smooth muscle tumors.

Abstract: A spray gun adapter establishes fluid communication between a fluid pump of a handheld airless spray gun and an applicator accessory. The adapter comprises an adapter body, a head attached to the adapter body, and a protrusion. The adapter body comprises an upper portion, a lower portion, a radial inlet located in a sidewall of the adapter body between the upper and lower portions, and an adapter bore having a first diameter in fluid communication with the radial inlet. The head comprises a cavity in fluid communication with the adapter bore and having a second diameter larger than the first diameter, an adapter outlet located in the upper portion of the adapter body and in fluid communication with the cavity, and a handle extending radially from the head. The protrusion extends radially from the adapter body between the upper and lower portions of the adapter body.

Abstract: A tray for a vaporization vessel that includes a tray having a side wall, a bottom plate, one or more apertures that extend through the bottom plate, and a duct that extends through and from the bottom plate. The tray configured to support a solid reagent to be vaporized. A method of assembling the tray that includes forming a first tray that has the side wall and the bottom plate. A vaporization vessel that includes one or more of the trays.

Abstract: The present disclosure describes a system with a power management device, a wakeup circuit, a battery management device, and a connector. During a powered down mode of operation, the battery management device can provide, via the connector, a bias voltage to the wakeup circuit. In response to a wakeup switch being activated, the battery management device can provide a power supply (e.g., from a battery) to the power management device. Benefits of the wakeup circuit include (1) a reduction of battery consumption—and thus improving battery lifetime—when the electronic system is in a powered down mode of operation because the wakeup circuit has lower number of active components compared to other designs and (2) a non-complex wakeup circuit design because one or more existing connector interconnects between the power management device and the battery management device can be re-used during electronic system's powered down mode of operation.

Abstract: A method of forming a semiconductor device comprising forming a patterned resist over a stack comprising at least one material and removing a portion of the stack exposed through the patterned resist to form a stack opening. A portion of the patterned resist is laterally removed to form a trimmed resist and an additional portion of the stack exposed through the trimmed resist is removed to form steps in sidewalls of the stack. A dielectric material is formed between the sidewalls of the stack to substantially completely fill the stack opening, and the dielectric material is planarized. Additional methods are disclosed, as well as semiconductor devices.

Abstract: This disclosure describes an implantable medical electrical lead and an ICD system utilizing the lead. The lead includes a lead body defining a proximal end and a distal portion, wherein at least a part of the distal portion of the lead body defines an undulating configuration. The lead includes a defibrillation electrode that includes a plurality of defibrillation electrode segments disposed along the undulating configuration spaced apart from one another by a distance. The lead also includes at least one electrode disposed between adjacent sections of the plurality of defibrillation sections. The at least one electrode is configured to deliver a pacing pulse to the heart and/or sense cardiac electrical activity of the heart.

Abstract: The disclosure concerns methods of forming a semiconductor device with a repairable redistribution layer (RDL) design, comprising: preparing an original repairable RDL design; forming first conductive segments of the repairable RDL design; inspecting the first conductive segments of the repairable RDL design to detect manufacturing defects; detecting at least one defect in the first conductive segments; and forming second conductive segments of the repairable RDL design according to a new custom RDL design to mitigate the negative effects of the at least one defect among the first conductive segments. The disclosure also concerns semiconductor devices with a repairable RDL design.

Abstract: A method and related structure for a quad flat no-lead (QFN), dual flat no-lead (DFN) or small outline no-lead (SON) package without a leadframe. A semiconductor chip with conductive stumps over an active surface, a first layer of encapsulant disposed around the semiconductor chip, over the active surface, and around the conductive stumps, a first conductive layer and first vertical conductive contacts electrically coupled with the conductive stumps, the first conductive layer comprising conductive traces formed over a planarized surface of the encapsulant and conductive stumps, a second layer of encapsulant disposed over the first encapsulant layer, conductive layer, conductive traces, and first vertical conductive contacts, a plurality of conductive pads formed over a planarized surface, and a solderable metal system (SMS) formed or an organic solderability preservative (OSP) applied over at least a portion of the conductive pads.

Abstract: The disclosure concerns electronic assemblies, comprising: a component comprising conductive studs on a surface of the component; a first encapsulant disposed around four side surfaces of the component, over the surface of the component, and around at least a portion of sidewalls of the conductive studs; a conductive backside material disposed over at least a portion of a backside of the component; a substantially planar surface disposed over the surface of the component, wherein the substantially planar surface comprises ends of the conductive studs and a planar surface of the first encapsulant, wherein the planar surface of the first encapsulant comprises a roughness less than 500 nanometers over a characteristic measurement distance; conductive structures disposed over the planar surface and configured to be electrically coupled with the component; a second encapsulant disposed over the conductive structures; and conductive pads disposed over, or within, the second encapsulant for TO interconnection.

Abstract: A spray tip includes a cylindrical body having a through hole oriented along a fluid flow axis, and a spray outlet piece and upstream chamber piece located in the through hole. The spray outlet piece includes an outlet aperture configured to atomize a spray fluid. The upstream chamber piece includes an internal aperture wall with an upstream surface and a downstream surface, and an aperture through the wall. The aperture includes an inlet orifice and an outlet orifice. The spray tip further includes a turbulation chamber defined by the spray outlet piece and the upstream chamber piece.

Abstract: Various embodiments of a speaker and a method of forming such speaker are disclosed. The speaker includes a frame having a first major surface, a second major surface, and an opening disposed between the first and second major surfaces; a cone disposed adjacent the first major surface of the frame; and an adhesive layer disposed on at least a portion of the second major surface of the frame. The adhesive layer occludes the opening of the frame.

Abstract: The present invention is directed to a tire chain tensioner having a central hub, a tension adjuster, and a tensioning member. There may be one or more tension adjusters attached to the central hub and there may be one or more tensioning members attached to each tension adjuster. The tension adjuster may be rotated so as to cause a corresponding tensioning member to pull a tire chain tight against a tire, thus minimizing slipping of the tire chain on the tire.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.

Abstract: The disclosure concerns method of making a molded substrate, comprising providing a carrier; forming a first conductive layer and first vertical conductive contacts over the carrier; disposing a first layer of encapsulant over the first conductive layer and first vertical conductive contacts; planarizing the first vertical conductive contacts and the first layer of encapsulant to form a first planar surface; forming a second conductive layer and second vertical conductive contacts over the first layer of encapsulant and configured to be electrically coupled with the first conductive layer and first vertical conductive contacts; disposing a second layer of encapsulant over the second conductive layer and second vertical conductive contacts; planarizing the second vertical conductive contacts and the second layer of encapsulant to form a second planar surface; and forming first conductive bumps over the second planar surface, opposite the carrier.

Abstract: An electronic assembly may include a component comprising conductive studs disposed over an active layer of the component. A first encapsulant layer may be disposed around four side surfaces of the component, over the active layer of the component, and contacting at least a portion of the sides of the conductive studs. A substantially planar surface may be disposed over the active layer of the component, wherein the substantially planar surface comprises ends of the conductive studs and the first encapsulant layer. The first encapsulant layer comprises a roughness less than 500 nanometers. First conductive elements may be disposed over the encapsulant and coupled with the conductive studs. A second layer of encapsulant may be disposed over the first conductive elements.