Patents by Inventor A Leam Choi

A Leam Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100148354
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a through silicon via die having an interconnect through a silicon substrate; depositing a re-distribution layer on the through silicon via die and connected to the interconnects; mounting a structure over the through silicon via die; connecting the structure to the interconnect of the through silicon via die with a direct interconnect; and encapsulating the through silicon via die and partially encapsulating the structure with an encapsulation.
    Type: Application
    Filed: December 11, 2008
    Publication date: June 17, 2010
    Inventors: A Leam Choi, Jae Han Chung, DeokKyung Yang, HyungSang Park
  • Publication number: 20090283888
    Abstract: A package system including providing a first semiconductor die; mounting a second semiconductor die on the first semiconductor die using an inter-die interconnect to form a flip-chip assembly; and attaching the flip-chip assembly on a package substrate with a contact pad, a test connection, a z-bond pad, and a die receptacle, with the first semiconductor die in the flip-chip assembly fitting inside the die receptacle.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 19, 2009
    Inventors: A Leam Choi, Young Jin Woo, Junwoo Myung
  • Publication number: 20090072377
    Abstract: An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 19, 2009
    Inventors: DongSam Park, A Leam Choi, Keon Teak Kang