Abstract: A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.

Abstract: A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes multiple semiconductor nanostructures over a substrate and two epitaxial structures over the substrate. Each of the semiconductor nanostructures is between the epitaxial structures, and the epitaxial structures are p-type doped. The semiconductor device structure also includes a gate stack wrapping around the semiconductor nanostructures. The semiconductor device structure further includes a dielectric stressor structure between the gate stack and the substrate. The epitaxial structures extend exceeding a top surface of the dielectric stressor structure.

Abstract: The present application discloses a media interaction method in a Digital Enhanced Cordless Telecommunications (DECT) network cluster. Communication with a DECT host is established through a DECT network cluster constructed in advance, to obtain first account information allocated by the DECT host, and information of a first call request to call a second account is sent to the DECT host, so as to make a call to the second account in a first communication manner. If no Real-time Transport Protocol (RTP) from the second account is received, information of a second call request to call the second account is sent to the DECT host, so as to make a call to the second account in a second communication manner. Embodiments of the present disclosure can solve the technical problem of a communication failure and reduce a waiting time for communication, thereby achieving optimal Voice over Internet Protocol (VOIP) call experience.

Abstract: The present disclosure relates to a method and apparatus for storing data, and belongs to the technical field of storage. The method includes: receiving a storage request carrying target data, wherein the target data includes at least one data stripe, each data stripe including a plurality of data blocks; determining, among a plurality of preset storage device groupings, a target storage device grouping for storing the target data; and storing, for each data stripe, the plurality of data blocks in the data stripe into different storage devices in the target storage device grouping respectively. The risk of data loss may be reduced by employing the present disclosure.

Abstract: A motor control system includes a motor and a processor, and the processor is electrically connected to the motor. The processor performs the following actions: calculating the d-axis magnetic flux and the q-axis magnetic flux in a synchronous rotating reference frame according to the information fed back by the motor; multiplying the d-axis magnetic flux and the q-axis magnetic flux by a d-axis current feedback and a q-axis current feedback to be a d-axis flux-current product and a q-axis flux-current product respectively; subtracting the q-axis flux-current product from the d-axis flux-current product to get a flux-current product error; sending the flux-current product error to a proportional-integral controller to generate a present compensation current-angle command; adding the present compensation current-angle command and a previous current-angle command to obtain the present current-angle command; sending the present current-angle command to a d-q axis current regulator for processing.

Abstract: Disclosed herein relates to a self-checkout anti-theft vehicle system, comprising: a self-checkout vehicle having a plurality of sensors and components implemented thereon, the self-checkout vehicle being used by shoppers for storing selected merchandises in a retail environment; and a centralized computing device. The centralized computing device is configured to: obtain information related to each merchandise selected and placed into the self-checkout vehicle by a shopper by exchanging data with the plurality of sensors and components via a first communication network, identify each merchandise via a second, different communication network based at least upon the information obtained from the plurality of sensors and components, and process payment information of each merchandise.

Abstract: A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes multiple semiconductor nanostructures over a substrate and two epitaxial structures over the substrate. Each of the semiconductor nanostructures is between the epitaxial structures. The semiconductor device structure also includes a gate stack wrapping around the semiconductor nanostructures. The semiconductor device structure further includes a stressor structure between the gate stack and the substrate. The epitaxial structures extend exceeding a top surface of the stressor structure.

Abstract: An imaging optical system includes six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one of the six lens elements is a freeform lens element, and at least one of the object-side surface and the image-side surface of the at least one freeform lens element is a freeform surface.

Abstract: An image capturing device is provided, which includes an image capture component and N light modules. The image capture component is configured to capture an appearance image of a component. The N light modules are disposed around the image capture component, to be turned on alternately, and N?4. When at least one of the N light modules is turned on, the image capture component captures the appearance image of the component.

Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, an aurum layer, and an electroplating copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.

Abstract: A human computer interaction system and a human computer interaction method are provided. The human computer interaction system includes a first sensor, a second sensor and a processor. The processor obtains first motion sensing data of the first operating portion from the first sensor, obtains second motion sensing data of the second operating portion from the second sensor different from the first operating portion, and determines an event according to both the first motion sensing data and the second motion sensing data. Accordingly, a hybrid motion tracking method for multiple operating portion of the user is provided.

Abstract: The present disclosure relates to the field of power electronics technology, and proposes a power module, including: a case and an isolating part disposed in the case; a first air duct and a second air duct stacked to each other, separated by the isolating part, and penetrated in a front-to-rear direction in the case; a high-voltage power unit; a low-voltage power unit; and a transformer, including a high-voltage portion and a low-voltage portion, wherein the high-voltage portion includes a first magnetic core and a high-voltage coil disposed on the first magnetic core, and the low-voltage portion includes a second magnetic core and a low-voltage coil disposed on the second magnetic core, wherein the high-voltage power unit and the high-voltage portion are disposed in the first air duct, and the low-voltage power unit and the low-voltage portion are disposed in the second air duct.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure and a second fin structure formed over a substrate. The semiconductor device structure includes a first gate structure formed over the first fin structure, and the first gate structure includes a first portion of a gate dielectric layer and a first portion of a filling layer. The semiconductor device structure also includes a second gate structure formed over the second fin structure, and a first isolation sealing layer between the first gate structure and the second gate structure. The first isolation sealing layer is in direct contact with the first portion of the gate dielectric layer and the first portion of the filling layer.

Abstract: A design method of a dummy pattern layout including the following steps is provided. An integrated circuit layout design including resistor elements is obtained via a computer. The locations of dummy conductive structures are configured, wherein the dummy conductive structures are aligned with the resistor elements. The locations of dummy support patterns are configured, wherein each of the dummy support patterns is configured between two adjacent dummy conductive structures, and each of the dummy conductive structures is equidistant from the dummy support patterns on both sides.

Abstract: A filtering circuit for filtering a pulse width modulated (PWM) signal includes a D flip-flop having an input terminal configured to be coupled to a logic high signal and having an output terminal coupled to an output terminal of the filtering circuit; and a circuit coupled between an input terminal of the filtering circuit and the D flip-flop, the circuit configured to, for a first pulse of the PWM signal having a duty cycle within a pre-determined range: generate a positive pulse at a clock terminal of the D flip-flop as a clock signal of the D flip-flop; and generate a negative pulse at a reset terminal of the D flip-flop as a reset signal of the D flip-flop, wherein a duration between a rising edge of the positive pulse and a falling edge of the negative pulse is equal to a duration of the first pulse of the PWM signal.

Abstract: A method for transmitting feedback information, a terminal device, and a network device are provided. The method includes: a terminal device determines a target feedback mode used for transmitting feedback information, wherein the feedback information is feedback information for a transport block (TB) sent by a network device and received by the terminal device; and the terminal device uses the target feedback mode to transmit the feedback information.

Abstract: In a method of manufacturing a semiconductor device, an isolation structure is formed in a substrate defining an active region, a first gate structure is formed over the isolation structure and a second gate structure over the active region adjacent to the first gate structure, a cover layer is formed to cover the first gate structure and a part of the active region between the first gate structure and the second gate structure, the active region between the first gate structure and the second gate structure not covered by the cover layer is etched to form a recess, and an epitaxial semiconductor layer is formed in the recess.

Abstract: A method and apparatus are disclosed. In an example from the perspective of a User Equipment (UE), the UE may receive a configured grant. The UE may receive a Random Access Response (RAR) grant, wherein a first Physical Uplink Shared Channel (PUSCH) of the RAR grant overlaps with a second PUSCH of the configured grant. The UE may transmit the second PUSCH based upon the configured grant.

Abstract: A dynamic voltage compensation circuit suitable for performing voltage compensation between an electronic device and a multimedia device, and includes a current detection unit, a calculation module and a voltage output unit. The current detection unit is configured to obtain the output current of the electronic device outputting the multimedia device from the bus power terminal. The calculation module is configured to receive the output current and an ideal reference voltage, execute a voltage compensation algorithm to calculate a predetermined output voltage based on the output current, the ideal reference voltage, and a compensation coefficient, and generate a control signal according to the predetermined output voltage. The voltage output unit is configured to receive a control signal, and is controlled by the control signal to generate a compensated output voltage and output it to a bus power terminal.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.