Patent number: 10593604
Abstract: Improved processes for manufacturing wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes. Such processes may involve evaluating Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).
Type:
Grant
Filed:
April 4, 2016
Date of Patent:
March 17, 2020
Assignee:
PDF Solutions, Inc.
Inventors:
Stephen Lam, Dennis Ciplickas, Tomasz Brozek, Jeremy Cheng, Simone Comensoli, Indranil De, Kelvin Doong, Hans Eisenmann, Timothy Fiscus, Jonathan Haigh, Christopher Hess, John Kibarian, Sherry Lee, Marci Liao, Sheng-Che Lin, Hideki Matsuhashi, Kimon Michaels, Conor O'Sullivan, Markus Rauscher, Vyacheslav Rovner, Andrzej Strojwas, Marcin Strojwas, Carl Taylor, Rakesh Vallishayee, Larg Weiland, Nobuharu Yokoyama