Patents by Inventor A. Mei Lan Shepherd-Murray

A. Mei Lan Shepherd-Murray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal management apparatus
    Patent number: 7283364
    Abstract: The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.
    Type: Grant
    Filed: November 29, 2004
    Date of Patent: October 16, 2007
    Assignee: ATI Technologies Inc.
    Inventors: Gamal Refai-Ahmed, Xiaohua H. Sun, Nima Osqueizadeh, Salim Lakhani, Jim E. Loro, A. Mei Lan Shepherd-Murray, Ross Lau
  • Thermal management apparatus
    Publication number: 20060114657
    Abstract: The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.
    Type: Application
    Filed: November 29, 2004
    Publication date: June 1, 2006
    Applicant: ATI Technologies, Inc.
    Inventors: Gamal Refai-Ahmed, Xiaohua Sun, Nima Osqueizadeh, Salim Lakhani, Jim Loro, A. Mei Lan Shepherd-Murray, Ross Lau