Abstract: Provided are a silicon-based display assembly and a display device. The silicon-based display assembly is provided with a silicon-based panel, a flexible circuit board, and a logic control board. An end of the flexible circuit board is bonded to a first bonding region of the silicon-based panel. The logic control board is disposed on the flexible circuit board. The logic control board is integrated with a timing controller module, an algorithm processing module, a first input interface module, a first output interface module, and a power module. The logic control board is configured to at least perform high-speed data receiving and high-speed data processing.

Abstract: A device includes a fin protruding from a semiconductor substrate; a gate stack over and along a sidewall of the fin; a gate spacer along a sidewall of the gate stack and along the sidewall of the fin; an epitaxial source/drain region in the fin and adjacent the gate spacer; and a corner spacer between the gate stack and the gate spacer, wherein the corner spacer extends along the sidewall of the fin, wherein a first region between the gate stack and the sidewall of the fin is free of the corner spacer, wherein a second region between the gate stack and the gate spacer is free of the corner spacer.

Abstract: A system for use in a poultry house includes a control server, a network gateway disposed in the poultry house and equipping with a wireless communication capability; a movable sensor module disposed in the poultry house, wherein the movable sensor module is movable within the poultry house for obtaining a plurality of environmental parameters associated with specific locations within the poultry house, and a sampling machine disposed in the poultry house for obtaining a sample of poultry waste on the ground of the poultry house. The movable sensor module transmits the environmental parameters to the network gateway, and the network gateway transmits the environmental parameters to the control server for processing the environmental parameters.

Abstract: Semiconductor structures and methods for fabricating semiconductor structures are provided. A semiconductor structure includes a first fin extending in an X-direction and a second fin parallel to the first fin and distanced from the first fin in a Y-direction perpendicular to the X-direction. Each fin is formed with a first device area and a second device area aligned in the X-direction; an isolation region disposed between the fins; an isolation structure disposed between the device areas in each fin; and an isolation layer disposed under the fins. The isolation region contacts the isolation layer, the isolation structure contacts the isolation layer, and the isolation region contacts the isolation structure to isolate the first fin from the second fin and to isolate the first device area from the second device area in each fin.

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a plurality of conductive interconnects arranged within a dielectric structure having a plurality of inter-level dielectric (ILD) layers stacked onto one another. A heat pipe vertically extends through the plurality of ILD layers. A high thermal conductivity layer is sandwiched between neighboring ones of the plurality of ILD layers. The high thermal conductivity layer laterally extends from over one or more of the plurality of conductive interconnects to the heat pipe.

Abstract: A signal sensing device includes a signal amplifying structure to amplify the strength of the measured signal. The signal sensing device includes a body, a signal sensing element, and a signal amplifying portion. The signal sensing element is disposed in the body and includes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal amplifying portion includes a plurality of protruding structures protruding outward from the body. Each of the plurality of protruding structures is cylindrical and has a diameter of 250-400 ?m and a height of 40-75 ?m. When a portion of the body forms a surrounding portion surrounding a to-be-sensed target, a portion or an entirety of the signal sensing section is located on the surrounding portion, and the signal amplifying portion is partially or entirely in contact with the to-be-sensed target.

Abstract: An electrochromic composition is provided, including: a first oxidizable compound with a concentration range of 0.01M-0.5M; a reducible compound with a concentration range of 0.01M-0.5M; an electrolyte with a concentration range of 0.01M-0.

Abstract: A preparation method for a tungsten sulfide (WS2) solid lubricating film based on high power impulse magnetron sputtering (HiPIMS) is provided. The preparation method includes the following steps: step 1: depositing a metal conductive film on a surface of a WS2 target; step 2: using magnetic field sputtering to remove the metal conductive film in a target sputtering area on the surface of the WS2 target, thereby obtaining a first WS2 target; and step 3: performing the HiPIMS on the first WS2 target to obtain the WS2 solid lubricating film. The preparation method can achieve stable glow discharge of a WS2 target and use the high deposition energy of HiPIMS to prepare the WS2 solid lubricating film with high compactness and excellent wear resistance.

Abstract: A cyclic process including an etching process, a passivation process, and a pumping out process is provided to prevent over etching of the sacrificial gate electrode, particularly when near a high-k dielectric feature. The cyclic process solves the problems of failed gate electrode layer at an end of channel region and enlarges filling windows for replacement gate structures, thus improving channel control. Compared to state-of-art solutions, embodiments of the present disclosure also enlarge volume of source/drain regions, thus improving device performance.

Abstract: A display apparatus (2) and an electronic device (0). The display apparatus (2) comprises a first functional layer (211) of a touch screen (21), a touch sensing layer (212) of the touch screen (21), a second functional layer (223) of a display screen (22), a liquid crystal panel (221) of the display screen (22), a third functional layer (224) of the display screen (22), and a backlight module (222) of the display screen (22), which are arranged in a stacked manner, wherein the touch screen (21) is bonded with the display screen (22), and at least two of the first functional layer (211), the touch sensing layer (212), an adhesive (23), the second functional layer (223) and the third functional layer (224) are provided with an anti-glare structure and/or a blue light blocking structure.

Abstract: One aspect of the present disclosure pertains to a device. The device includes a memory macro having a frontside and a backside along a vertical direction. The memory macro includes edge strap areas extending lengthwise along a first direction at edges of the memory macro, a memory cell area having a plurality of memory cells, where the memory cell area is disposed between the edge strap areas along a second direction perpendicular to the first direction, and a middle strap area extending lengthwise along the first direction and disposed between the edge strap areas along the second direction, where the middle strap area divides the memory cell area into two memory cell domains. The middle strap area includes a feedthrough circuit that routes a power signal line of one of the plurality of memory cells to the backside of the memory macro.

Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.

Abstract: A method for forming a semiconductor structure is provided. The method includes forming a first active region in which first semiconductor layers and second semiconductor layers are alternatingly stacked over a first lower fin element. In a plan view, the active region includes a first portion and a second portion narrower than the first portion. The method also includes removing the first semiconductor layers of the first active region. The second semiconductor layers of the first portion of the first active region form first nanostructures, and the second semiconductor layers of the second portion of the first active region form second nanostructures. The method also includes forming a first gate stack to surround the first nanostructures, and forming a second gate stack to surround the second nanostructures.

Abstract: A semiconductor structure according to the present disclosure includes a first memory cell that includes a first pull-down transistor and a first pull-up transistor sharing a first gate structure extending along a first direction, a second pull-down transistor and a second pull-up transistor sharing a second gate structure extending along the first direction, a first pass-gate transistor having a third gate structure spaced apart but aligned with the second gate structure along the first direction, and a second pass-gate transistor having a fourth gate structure spaced apart but aligned with the first gate structure along the first direction, a frontside interconnect structure disposed over the first memory device, a backside interconnect structure disposed below the first memory device. A source of the second pull-down transistor is electrically coupled to the backside interconnect structure by way of a first backside contact via.

Abstract: A gate stack can be etched to form a trench extending through the gate stack, the trench removing a portion of the gate stack to separate the gate stack into a first gate stack portion and a second gate stack portion. A dielectric material is deposited in the trench to form a dielectric region, the dielectric region having an air gap in the dielectric material. The air gap may extend upward from beneath the gate stack to an area interposed between the end of the first gate stack portion and the end of the second gate stack portion. Contacts to the first gate stack portion and contacts to the second gate stack portion may be formed which are electrically isolated from each other by the dielectric material and air gap formed therein.

Abstract: A support structure including a first bracket, a second bracket, and at least one elastic member is provided. The first bracket includes multiple first alignment hole groups. The second bracket is detachably connected to the first bracket along a first axis. The second bracket includes multiple second alignment hole groups. The second bracket is adapted to slide relative to the first bracket along the first axis to change a length of the support structure along the first axis. The at least one elastic member is detachably connected to the first bracket and the second bracket. When the second bracket is connected to the first bracket, at least one of the first alignment hole groups is aligned with at least one of the second alignment hole groups to form at least one insertion space. A portion of the at least one elastic piece is located in the corresponding at least one insertion space and connected to the first bracket and the second bracket.

Abstract: A semiconductor structure according to the present disclosure includes a first memory array in a first cache and a second memory array in a second cache. The first memory array includes a plurality of first memory cells arranged in M1 rows and N1 columns. The second memory array includes a plurality of second memory cells arranged in M2 rows and N2 columns. The semiconductor structure also includes a first bit line coupled to a number of N1 first memory cells in one of the M1 rows, and a second bit line coupled to a number of N2 second memory cells in one of the M2 rows. N1 is smaller than N2, and a width of the first bit line is smaller than a width of the second bit line.

Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another, a gate structure that comprises a lower portion and an upper portion, a gate spacer that extends along a sidewall of the upper portion of the gate structure and has a bottom surface, and an etch stop layer extends between the portion of the bottom surface of the gate spacer and the top surface of the topmost semiconductor layer.

Abstract: A method of fabricating a semiconductor structure includes forming a recess in an active channel structure by removing a portion thereof, filling the recess with a dielectric material, forming a cladding layer adjacent the active channel structure but not adjacent the dielectric material, and forming a gate structure comprising a first gate structure and a second gate structure around the active channel structure. A width of the dielectric material in the recess is greater than a width of the first gate structure and a width of the second gate structure.