Patents by Inventor A-Seo Cho

A-Seo Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8236806
    Abstract: The present invention relates to a novel piperazinyl-propyl-pyrazole derivative, a method of its preparation and a pharmaceutically acceptable composition comprising the same. The novel piperazinyl-propyl-pyrazole derivative of the present invention has superior selective affinity for dopamine D4 receptor, can effectively inhibit psychotic behavior (cage climbing) induced by apomorphine, and has relatively low adverse effects in mouse rotarod test. Therefore, it can be developed as a therapeutic agent for the treatment and prevention of central nervous system (CNS) disorders, in particular, schizophrenia, attention deficit hyperactivity disorder, depression, stress diseases, panic disorder, phobia, obsessive-compulsive disorder, posttraumatic stress disorder, cognitive disorder, Alzheimer's disease, Parkinson's disease, anxiety, paraphrenia, mania, seizure disorder, personality disorder, migraine, drug addiction, alcohol addiction, obesity, eating disorder, and sleeping disorder.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: August 7, 2012
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Jae Yang Kong, Woo-Kyu Park, Heeyeong Cho, Daeyoung Jeong, Gildon Choi, Hun Yeong Koh, Sang Hee Kim, Ae Nim Pae, Yong Seo Cho, Joo Hwan Cha, Hyunah Choo, Sang Eun Chae, Hee-Yoon Lee
  • Patent number: 8232279
    Abstract: The present invention relates to a novel medicinal use of pyrazolopyrimidine compounds having superior effect as serotonin 5-HT2C receptor ligand thus being useful for the prevention and treatment of central nervous system (CNS) diseases. Accordingly, the pharmaceutical composition comprising pyrazolopyrimidine compounds and their pharmaceutically acceptable salts as active ingredients are useful for the prevention and treatment of serotonin 5-HT2C-related central nervous system diseases such as obesity, depression, anxiety and withdrawal symptoms due to drug abuse.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: July 31, 2012
    Assignee: Korea Institute of Science and Technology
    Inventors: Ae Nim Pae, Hyunah Choo, Yong Seo Cho, Ahmed Asif, Woo-Kyu Park
  • Publication number: 20120171624
    Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.
    Type: Application
    Filed: March 14, 2012
    Publication date: July 5, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joon Sung KIM, Sang Hoon Kim, Jae Hyun Jung, Han Seo Cho
  • Patent number: 8204345
    Abstract: A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: June 19, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hoon Kim, Han Seo Cho, Jae Hyun Jung, Joon Sung Kim
  • Patent number: 8159824
    Abstract: A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board unit and the other side stacked on the second board unit, where the flexible optical board includes a core through which the optical signals travel, a cladding surrounding the core, and a circuit pattern buried in the cladding which transmits electrical signals. By forming the rigid boards and the flexible optical board as an integrated structure, the need for separate connectors is obviated, and thus the cost of the product can be lowered.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: April 17, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han-Seo Cho, Je-Gwang Yoo, Joon-Sung Kim, Sang-Hoon Kim
  • Patent number: 8160417
    Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: April 17, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Joon Sung Kim, Sang Hoon Kim, Jae Hyun Jung, Han Seo Cho
  • Patent number: 8148402
    Abstract: Disclosed are isoindolinone derivatives, represented by Chemical Formula 1, having inhibitory activity against T-type calcium channels, pharmaceutically acceptable salts thereof, a preparation method thereof, and a pharmaceutical composition comprising the same as an active ingredient. wherein R1˜R6 are as defined in the specification.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: April 3, 2012
    Assignee: Korea Institute of Science and Technology
    Inventors: Yong Seo Cho, Ae Nim Pae, Hyunah Choo, Jae Kyun Lee, You Na Oh, Seon Hee Seo, Hyewhon Rhim
  • Patent number: 8115019
    Abstract: Disclosed are cis-2,6-disubstituted tetrahydropyran derivatives represented by Chemical Formula 1 and a preparation method thereof. The tetrahydropyran derivatives can be prepared by Prins-reacting tetrahydropyran derivatives with homopargylicalcohol derivatives in the presence of trimethylsilyltriflate. The tetrahydropyran derivatives with cis-substituents at both C2 and C6 positions of the tetrahydropyran ring are useful as intermediates for use in the synthesis and development of therapeutically effective, naturally occurring compounds. (wherein, R1, R2 and R3 are as defined in the specification.).
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: February 14, 2012
    Assignee: Korea Institute of Science and Technology
    Inventors: Yong Seo Cho, You Seung Kim, Jae Kyun Lee, Hyunah Choo, Ae Nim Pae
  • Publication number: 20120030940
    Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.
    Type: Application
    Filed: October 5, 2011
    Publication date: February 9, 2012
    Applicants: SAMSUNG LED CO.,LTD., SAMSUNG ELECTRO-MECHANICS CO.,LTD.
    Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
  • Publication number: 20120005890
    Abstract: A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.
    Type: Application
    Filed: September 9, 2011
    Publication date: January 12, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Han Seo Cho, Jae Hyun Jung, Joon Sung Kim
  • Publication number: 20110319456
    Abstract: Novel benzoarylureido compounds and a use thereof for prevention and/or treatment of the neurodegenerative brain disease are provided. The neurodegenerative brain diseases may include Alzheimer's disease, dementia, Parkinson's disease, stroke, amyloidosis, Pick's disease, Lou Gehrig's disease, Huntington's disease, Creutzfeld-Jakob disease, and the like.
    Type: Application
    Filed: December 29, 2009
    Publication date: December 29, 2011
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hoh-Gyu Hahn, Kee-Dal Nam, Dong-Yun Shin, Chan-Ho Park, Sung-Woo Cho, Eun-A Kim, Ghil-Soo Nam, Kyung-Il Chol, Seon-Hee Seo, Hee-Sup Shin, Dong-JIn Kim, Ae-Nim Pae, Hye-JIn Chung, Hyun-Ah Choo, Hye-Whon Rhim, Yong-Seo Cho, Eun-Jon Roh, Gyo-Chang Keum, Kee-Hyun Choi, Kye-Jung Shin, Chan-Seong Cheong, Jae-Kyun Lee, Yong-Koo Kang, Young-Soo Kim, Woong-Seo Park, Key-Sun Kim, He-Sson Chung, Chi-Man Song, Sun-Joon Min, Eunlce Eun-Kyeong Kim, Cheol-Ju Lee, Soon-Bang Kang
  • Publication number: 20110317957
    Abstract: The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer.
    Type: Application
    Filed: November 12, 2010
    Publication date: December 29, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hoon KIM, Jong Ha PARK, Han Seo CHO, Joon Sung KIM, Jae Hyun JUNG
  • Patent number: 8064217
    Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: November 22, 2011
    Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung LED Co., Ltd.
    Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
  • Patent number: 8056220
    Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: November 15, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang-Hoon Kim, Je-Gwang Yoo, Joon-Sung Kim, Han Seo Cho
  • Patent number: 8048324
    Abstract: A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: November 1, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Han-Seo Cho, Je-Gwang Yoo, Sang-Hoon Kim, Joon-Sung Kim
  • Patent number: 8036501
    Abstract: The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: October 11, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Hoon Kim, Han Seo Cho, Jae Hyun Jung, Joon Sung Kim
  • Patent number: 7991250
    Abstract: A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: August 2, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang-Hoon Kim, Je-Gwang Yoo, Joon-Sung Kim, Jae-Hyun Jung, Han-Seo Cho
  • Publication number: 20110168666
    Abstract: A method of manufacturing an optical waveguide is disclosed. The method in accordance with an embodiment of the present invention includes providing a carrier, fixing a base substrate to the carrier by using a first insulation layer such that the base substrate is directly stacked on the carrier, stacking an optical waveguide layer on at least one of the base substrate and the first insulation layer, and severing the base substrate such that the base substrate and the optical waveguide layer are separated from the carrier. Accordingly, the optical waveguide layer can be formed with a uniform thickness since wrinkles in the base substrate supporting the optical waveguide layer are prevented from forming during the manufacturing process.
    Type: Application
    Filed: January 7, 2011
    Publication date: July 14, 2011
    Inventors: Joon-Sung KIM, Han-Seo Cho, Jae-Hyun Jung, Jong-Ha Park, Sang-Hoon Kim
  • Publication number: 20110116736
    Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.
    Type: Application
    Filed: April 14, 2010
    Publication date: May 19, 2011
    Inventors: Sang-Hoon KIM, Han-Seo Cho, Joon-Sung Kim, Jae-Hyun Jung
  • Publication number: 20110116737
    Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a flexible optical waveguide layer, selectively forming a reinforcing clad on one surface of the optical waveguide layer and forming a mirror groove on the other surface of the optical waveguide layer in accordance with where the reinforcing clad is formed. Thus, the clad can be formed thick only on the place where the mirror groove is to be formed, and thus a flexible optical wiring board having flexibility can be manufactured even though the optical wiring board is generally made thin.
    Type: Application
    Filed: April 16, 2010
    Publication date: May 19, 2011
    Inventors: Sang-Hoon KIM, Han-Seo Cho, Joon-Sung Kim, Jae-Hyun Jung