Abstract: A method for the deposition of a metal layer on a substrate (1) uses a cold plasma inside an enclosure (7) heated to avoid the formation of a metal deposit at its surface. The enclosure has an inlet (21) and an outlet (22) for the substrate with a source of metal vapor between them, made up of an electrode to form a plasma (6) with the substrate or a separate electrically conducting element as a counter-electrode. The deposition metal is introduced in the liquid state in a retention tank (8) and is maintained as a liquid at an essentially constant level during the formation of the metal layer on the substrate. An Independent claim is included for the device used to put this method of coating a substrate into service.

Abstract: The invention relates to a method of treatment, in particular cleaning and/or heating, for a metal substrate (1) fed in a substantially continuous manner through a vacuum chamber (3), having a treatment zone in which an electric discharge (10), i.e. a plasma, and a magnetic field are produced in a gas maintained at a pressure below atmospheric pressure between at least the substrate (1), acting as an electrode, and at least one counter-electrode (9) to enable the substrate (1) to be bombarded by the ions produced in the electric discharge (10). This method is characterised in that a confining magnetic induction field is produced entirely around the substrate (1) in the treatment zone so that the electric discharge (10) is also confined entirely around the substrate (1) inside this treatment zone by the confinement of electrons released in the electric discharge (10).

Abstract: The invention relates to a method of treatment, in particular cleaning and/or heating, for a metal substrate (1) fed in a substantially continuous manner through a vacuum chamber (3), having a treatment zone in which an electric discharge (10), i.e. a plasma, and a magnetic field are produced in a gas maintained at a pressure below atmospheric pressure between at least the substrate (1), acting as an electrode, and at least one counter-electrode (9) to enable the substrate (1) to be bombarded by the ions produced in the electric discharge (10). This method is characterised in that a confining magnetic induction field is produced entirely around the substrate (1) in the treatment zone so that the electric discharge (10) is also confined entirely around the substrate (1) inside this treatment zone by the confinement of electrons released in the electric discharge (10).

Abstract: A method for the deposition of a metal layer on a substrate (1) uses a cold plasma inside an enclosure (7) heated to avoid the formation of a metal deposit at its surface. The enclosure has an inlet (21) and an outlet (22) for the substrate with a source of metal vapor between them, made up of an electrode to form a plasma (6) with the substrate or a separate electrically conducting element as a counter-electrode. The deposition metal is introduced in the liquid state in a retention tank (8) and is maintained as a liquid at an essentially constant level during the formation of the metal layer on the substrate. An Independent claim is included for the device used to put this method of coating a substrate into service.

Abstract: Vacuum pump with a chamber (1) having, on one side, an intake (2) for pumping gas and, on the opposite side, an outlet (3) for the gas, displacement elements (4) being provided to drive the gas from the intake (2) towards the outlet (3), the displacement elements (4) including at least a vibrating element (4) for generating sound waves moving in the chamber (1), elements for closing (6) the outlet (3) being provided synchronously co-operating with the displacement elements (4) so as to clear the outlet opening (3) when the gas pressure in the proximity of the outlet (3) is higher than that in the proximity of the intake (2).

Abstract: The invention concerns a molecular pump for evacuating a gas from a chamber, comprising a substantially sealed box (1) having on one of its sides an intake orifice (2) to be connected to said chamber and, on the opposite side, an outlet orifice (3), to be preferably connected to a discharge pump, whereby elements (4) are mounted between those two orifices (2) and (3) at some distance from one another in substantially fixed sites inside said box (1) for the gas to pass through, said elements (4) being of such a nature as to impart to said gas molecules, coming from said chamber and coming into contact with said elements (4), a speed whereof the resultant is oriented towards the outlet orifice (3).

Abstract: A process of depositing a coating (5) onto a substrate (3) by reactive sputtering in a closed chamber (1) in the presence of a plasma of a non-reactive gas, and a reactive gas containing the element or elements said coating has to be made of, according to which process use is made of a target (2) having a surface layer (4) directed towards the substrate and containing at least one of the elements to be sputter deposited onto this substrate, according to which process the thickness of said surface layer (4) during the cathode sputtering is controlled by adjusting the concentration of the gases in said closed chamber (1). The single figure.

Abstract: A process for forming a coating on a substrate by condensation of a coating material onto the substrate while the substrate is moving through an enclosure under vacuum in which evaporation of the coating material takes place. With the inventive process, deposits with controlled structure and adhesion can be made on moving substrate or support even at very high speeds, so that the process can advantageously be carried out continuously or at variable speed.

Abstract: The invention concerns a method for making a composite metal product by adding at least one substance to said product, which consists in using a metal product in the form of a continuous strip (1) moved in a vacuum chamber (2), applying the substance on said strip and diffusing said substance at least partially into the strip when it is passing in the vacuum chamber maintaining it at a temperature lower than its melting point, but sufficiently high for enabling said diffusion.

Abstract: Process for the depositing, onto a substrate, of a coating essentially constituted of an electronic conductor compound, in which the said coating is formed by producing alternatively, on the one hand, in at least one depositing zone, one or several deposits of a determined thickness of an electronic conductor element on the substrate, and, on the other hand, in at least one reaction zone, one or several reactions of the element thus deposited with ions of a reactive gas which are implanted into the deposit of the above-mentioned element over approximately this entire thickness determined in a way as to form, preferably with the totality of this element, the said compound, the above-mentioned ions being submitted to a kinetic energy below 2000 V, while the aforesaid thickness of the deposit of the element is determined as a function of the kinetic energy applied in such a way as to allow the implantation of these ions over approximately this entire thickness.

Abstract: Air lock for introducing and continuously passing a strip of a substrate into and through a vacuum chamber, including an enclosure containing at least three successive rollers in the direction of travel of the strip and between which a passage is made for the strip, the first and third rollers being located on one side of this passage, the second roller being located on the opposite side of this passage, an essentially airtight region being formed between the strip and the first and third rollers and connected to a vacuum pump, a component being provided for adjusting the pressure with which the strip rests on the rollers.

Abstract: A process for forming a coating on a substrate by condensation of a coating material onto the substrate while the substrate is moving through an enclosure under vacuum in which evaporation of the coating material takes place.

Abstract: Process for the depositing, onto a substrate, of a coating essentially constituted of an electronic conductor compound, in which the said coating is formed by producing alternatively, on the one hand, in at least one depositing zone, one or several deposits of a determined thickness of an electronic conductor element on the substrate, and, on the other hand, in at least one reaction zone, one or several reactions of the element thus deposited with ions of a reactive gas which are implanted into the deposit of the above-mentioned element over approximately this entire thickness determined in a way as to form, preferably with the totality of this element, the said compound, the above-mentioned ions being submitted to a kinetic energy below 2000 V, while the aforesaid thickness of the deposit of the element is determined as a function of the kinetic energy applied in such a way as to allow the implantation of these ions over approximately this entire thickness.

Abstract: Process for continuously stripping the surface of a substrate moving in a defined direction through a vacuum chamber past at least one counterelectrode, according to which process a plasma is created in a gas, between this counterelectrode and this surface, so as to generate radicals and/or ions which can act on the surface to be stripped, characterized in that at least one pair of successive counterelectrodes, past which the abovementioned chamber and in that an alternating potential is applied to these counterelectrodes so as to impose on the latter an alternately positive and negative potential with respect to the substrate.

Abstract: Process for the depositing, onto a substrate, of a coating essentially constituted of an electronic conductor compound, in which the said coating is formed by producing alternatively, on the one hand, in at least one depositing zone, one or several deposits of a determined thickness of an electronic conductor element on the substrate, and, on the other hand, in at least one reaction zone, one or several reactions of the element thus deposited with ions of a reactive gas which are implanted into the deposit of the above-mentioned element over approximately this entire thickness determined in a way as to form, preferably with the totality of this element, the said compound, the above-mentioned ions being submitted to a kinetic energy below 2000 V, while the aforesaid thickness of the deposit of the element is determined as a function of the kinetic energy applied in such a way as to allow the implantation of these ions over approximately this entire thickness.

Abstract: A process for annealing a moving metal substrate, especially a steel sheet.

Abstract: Disclosed is a process for forming a coating on a substrate (2,2') by cate sputtering, comprising the coating of substrate surfaces (2,2') which have been transferred to a cathode sputtering chamber (1). The substrates vary in width and have a predetermined maximum width. The process involves the use of a target (3) whose surface (4) has an invariable length corresponding approximately to said maximum substrate width. A shift takes place, in accordance with the width of the substrate being coated, between the surface (4) of the target and the substrate surface to be coated, so that the entire surface of the target remains more or less constantly in front of the surface to be coated during the cathode sputtering process.

Abstract: Disclosed is a phosphated steel product and a method for producing the product. The method comprises passing at least one side of a steel strip through a molten bath of a metal selected from the group consisting of Zn-Al and Zn-Fe to form a first coating, electroplating a second coating consisting of essentially a pure metal selected from the group consisting of Mn, Fe and Ni onto the first coating and subjecting the exposed surface of the second coating to a phosphating treatment to form a phosphate coating on the second coating.

Abstract: There is described a device for electrolytically depositing, in a continuous operation and under a high current density, a lining metal layer over at least the one surface of a metal strip moving through an electrolytic bath, comprising at least one conducting roller cooperating with a cathode current supply, extending cross-wise relative to the strip movement direction and rotating about the axis thereof, in contact with the strip, substantially at the same circumferential speed as the traversing speed thereof, at least one anode being provided in the electrolytic bath facing at least the one surface of the strip moving through said bath, device in which said conducting roller is at least partly hollow, and the cathode current supply comprises a series of parallel-connected contacts which are distributed over that inner cylinder-like surface of the roller which lies opposite that outer surface portion the strip is applied on.